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Keywords: heat spreader
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73017
... lab-grown diamond heat spreader high-performance processors thermal simulations Abstract Lab-grown diamond heat spreaders are becoming attractive solutions compared to traditional copper heat spreaders due to their high thermal conductivity, the ability to directly bond them on silicon...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73087
... Ensuring adequate spreading of heat dissipated by high power density devices is a critical part of many electronics packaging designs. In many cases, passive wick-based heat spreaders can offer improved heat spreading performance relative to solid conductor alternatives. However, concerns...
Topics: Flat heat pipes
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A022, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73093
... In thin handheld electronic devices, such as smartphone and tablet computers, high conductivity flexible graphite heat spreaders have become the passive thermal management solution of choice. Graphite is used in these applications because of its unique anisotropic properties of high in-plane...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 213-220, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52122
... heat spreader nanostructured wicks heat pipe vapor chamber thermal resistance sintered powder wick carbon nanotube (CNT) boiling Spreading of high-flux electronics heat is a critical part of any packaging design. This need is particularly profound in advanced devices where...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 607-617, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33215
... Heat spreader natural graphite thermal via ASIC FB-DIMM Natural graphite heat spreaders are in use in electronic cooling applications where heat flux density is low. Natural graphite is an anisotropic material, with a high thermal conductivity in the plane of the spreader combined...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 79-89, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73073
... Heat spreaders can be made from natural graphite sheet materials. These spreaders take advantage of the anisotropic thermal properties of natural graphite. Natural graphite exhibits a high thermal conductivity in the plane of the sheet combined with a much lower thermal conductivity through...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 63-71, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35018
... An effective thermal analyzer for exploring the thermal performance of 3-D heat spreader having discrete heat sources integrated with heat sink has been successfully developed in the study. The thermal performances such as local temperature distributions and isotherms on heat spreader surfaces...