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Keywords: flexible electronics
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Proceedings Papers
Effect of Passivation Layer and Line Thickness on Damage Mechanism of Flexible Ag Nanowire Interconnects Under High Density Current
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141181
... Abstract In recent years, the demand of flexible electronic circuits has been increasing with the development of wearable devices. Ag nanowire network structures are attracting attention as a material for flexible transparent conductive films because of their low cost, flexibility and light...
Proceedings Papers
Oscillator Performance on Thermoformed Additive In-Mold Electronics for Automotive Applications
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141877
... of manufacturing parameters related to screen-printing and thermoforming on IME circuit performance, which is dedicated to its application in the automobile industry. in-mold electronics IME printed electronics PC additive printing flexible electronics Proceedings of the ASME 2024 International...
Proceedings Papers
Reliability of Direct Write Additively Printed Sustainable Flexible Circuitry With ECA Under Sustained High-Temperature Operation
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142111
... as substrate materials. The actual output of the printed circuitry before exposure to high temperature and during HTOL conditions is contrasted with the simulated performance of the circuit. flexible electronics sustainability reliability direct-write additive printing surface mount device...
Proceedings Papers
Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112061
... Abstract Sustainable conductive ink for 3D-printed flexible electronics is needed to enable lower-impact waste print processes. The ability to undertake reparability is an additional method to achieve sustainable products through the extension of electronic components’ lifespan and reduced e...
Proceedings Papers
Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112069
... have employed the OrCAD software to build and simulate a digital circuit. The performance of the inverting circuit was compared and evaluated against the tolerance limits of the COTs. direct-write technique additive printing in-mold electronics flexible electronics PC silver ink...
Proceedings Papers
Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
... attachment in FHE. Such insights can aid in the development of reliable and efficient interconnectivity methods for FHE, which can contribute to the widespread adoption of FHE in various industries. additive manufacturing flexible electronics bonding materials direct write Proceedings of the ASME...
Proceedings Papers
SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97451
... accelerated life cycling tests of batteries with random variation in these two parameters, individually and simultaneously. Finally, multiple iterations of the SOH estimation models have been presented with different predictor variables to minimize the model validation error. flexible electronics...
Proceedings Papers
Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
... Abstract For many years, traditional rigid PCBs have been utilized in many applications and have been shown to be reliable in a number of applications. There hasn’t been much research on flexible electronics device attachment techniques and process reliability. There has been prior research...
Proceedings Papers
Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
... the intermetallics at the interface of conductive adhesive and additively printed circuits. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge gauge factor shear load to failure Proceedings of the ASME 2022 International...
Proceedings Papers
Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
... rigid, flexible, or conformable, provides several benefits over conventional electronics fabrication methods. Furthermore, the growing complexity of flexible electronics necessitates the development of multilayered circuits similar to traditional PCBs to decrease the volumetric and gravimetric effect...
Proceedings Papers
Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74570
... tensile cyclic loading (3-point bending) at various strain rates and maximum strains. Long-term performance testing will be carried out using cyclic tensile loads. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge...
Proceedings Papers
Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74073
...-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive process development sintering analysis shear load to failure LC filter Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging...
Proceedings Papers
Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68902
... under high-density electric current. Reducing EM damage is extremely important to enhance device reliability. In this study, high-density current loading tests of flexible electronic line were conducted under bending deformation of the substrate in order to investigate the effect of mechanical stress...
Proceedings Papers
Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing
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Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74088
... as to study the effect of lamination parameters. flexible electronics Li-ion battery capacity degradation state of health lamination encapsulation Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...
Proceedings Papers
Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74115
... as to generate high fidelity data. Ultimately, a regression model developed previously has been augmented with the results generated in the current study. flexible electronics Li-ion battery capacity degradation flex to install dynamic fold flexure fold diameter Proceedings of the ASME 2021...
Proceedings Papers
Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition
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Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2644
... Contract, NASA MSFC Tele: +1(334)844-3424; E-mail: [email protected] ABSTRACT Wearable electronics need a number of desirable attributes, such as being compact, flexible, and lightweight. Prior studies on reliability testing have examined the relationship between a flexible electronic and repetitive human...
Proceedings Papers
Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2661
... was developed to capture the effect of these use parameters on battery capacity degradation. Keywords flexible electronics, capacity degradation, flex to install, flexure, li-ion battery, power source 1. INTRODUCTION Owing to the high specific energy and high specific power combination, lithium-ion batteries [1...
Proceedings Papers
Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6570
... on several parameters was developed to estimate the battery capacity as a function of the cycle number. Keywords: flexible electronics, capacity degradation, shallow charging, li-ion battery, power source 1. INTRODUCTION Lithium ion batteries (Li-ion batteries or LIBs) have been the popular battery chemistry...
Proceedings Papers
Low Temperature OFET (Organic Field Effect Transistor) Fabrication by Metal Nanoparticle Imprinting
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 947-953, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33448
... substrates. The performance of the transistors were characterized and discussed. Keywords: Nanoparticle, imprint, organic transistor, flexible electronics INTRODUCTION Direct nanoimprinting of SAM (self assembled monolayer)-protected gold nanoparticles was explored to develop a novel high resolution direct...
Proceedings Papers
Subtractive Laser Processing of Low Temperature Inkjet Printed Micro Electric Components of Functional Nano-Ink for Flexible Electronics
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1935-1941, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73186
... Flexible electronics nanoparticle gold inkjet laser ablation sintering The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand (DOD) inkjetting system was used...