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Keywords: electronics cooling
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Paper No: IPACK2021-72620
... which would include new standards for implementing green heat removal capability. solutions. In the present study, a newly updated version of the general thermosyphon simulation code previously presented at Keywords: Datacenter, electronics cooling, passive two-phase InterPACK 2019 and InterPACK 2020...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Paper No: IPACK2021-72621
... difference [K] consumption is a goal that has always been very desirable in electronics cooling, especially nowadays that power densities of liquid phase density [kg/m3] processing units are increasing. Conventional cooling solutions do not have the necessary cooling capacities for these power 1...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 26–28, 2021
Paper No: IPACK2021-72618
... FOR ELECTRONIC COOLING APPLICATIONS John Kim Raffaele L. Amalfi Data & Devices Group Thermal Management Research Group Nokia Bell Labs Nokia Bell Labs Murray Hill, New Jersey, USA Murray Hill, New Jersey, USA Email: john.kim@nokia-bell-labs.com Email: raffaele.amalfi@nokia-bell-labs.com ABSTRACT FR filling ratio...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 26–28, 2021
Paper No: IPACK2021-74108
...: Cryogenic, liquid nitrogen, electronics cooling has been conducted to explore the viability of cryogenic cooling to reduce CPU power consumption. Liquid nitrogen cooling 1. INTRODUCTION showed a 10.6% reduction in processor power consumption With the rapid pace of technology development, appropriate...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Paper No: IPACK2021-73015
... for Greek Letters & Symbols highly porous foams bonded on Cu substrates. Heat Transfer Coefficient, W/(m2K) Temperature Difference, °C Keywords: Electronics cooling, Mathematical modeling, Root Mean Square (RMS) Error Modeling, Thermal analysis, Thermal Interface, Thermal Standard Deviation management...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Paper No: IPACK2021-69254
... with lower thermal resistance. To this end, Keywords: Electronics Cooling; Thermal Interface Material; high conductivity thermal paste or similar thermal interface Thermal management; Electronics Packaging, Graphene; materials (TIMs), reinforced with superior thermal conductivity Thermal Conductance...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 26–28, 2021
Paper No: IPACK2021-73269
..., doi: 10.1021/ie4033999. [44] Welcome to CoolProp CoolProp 6.4.1 documentation. httpwww.coolprop.org/ (accessed May 10, 2021). V001T02A012-12 Copyright © 2021 by ASME analytical modeling data centers electronics cooling liquid-cooling mathematical modeling modeling Abstract Abstract...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 26–28, 2021
Paper No: IPACK2021-73270
... a commercial software. Keywords: Data centers, Electronics cooling, Liquid-cooling, Mathematical modeling, Modeling, Thermal management of electronics V001T02A013-1 Copyright © 2021 by ASME Greek has commissioned a set of regulations in 2019 in order to meet the goal of making Europe climate-neutral by 2050 [1...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 26–28, 2021
Paper No: IPACK2021-73271
... of interest for a work, J scroll compressor running on a given refrigerant for which data mechanical power, W may be limited, enabling component-level design or analysis for different operating conditions and system requirements. electromechanical power loss, W Keywords: Data centers, Electronics cooling...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Paper No: IPACK2021-72612
.... Thermosyphon-based cooling systems across multiple length scales can significantly improve operation in terms of lowering energy consumption, allowing for higher hardware density, increased processing speed and reliability. datacenters electronics cooling operational maps passive two-phase flow...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020
Paper No: IPACK2020-2569
... drop in the heat transfer rate. In this regard, the study emphasizes the importance of the fin tip design for the heat sinks operating under frosting conditions. frost thermal resistance heat flux electronics cooling forced convection AN EXPERIMENTAL INVESTIGATION INTO FROST ACCUMULATION...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Paper No: IPACK2013-73031
... abatement techniques for local hot spots while keeping light extraction at maximum. Light emitting diodes LEDs Liquid cooling thermal management electronics cooling design optimization DIRECT LIQUID COOLING OF HIGH FLUX LED SYSTEMS: HOT SPOT ABATEMENT Enes Tamdogan*, Mehmet Arik and M. Baris...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A035, July 16–18, 2013
Paper No: IPACK2013-73179
... lighting applications. LED cooling natural convection heat sink chimney electronics cooling A19 bulb ADVANCED NATURAL CONVECTION COOLING DESIGNS FOR LED BULB SYSTEMS James Petroski Lighting Display & Technologies Rambus, Inc. Brecksville, OH USA, 44141 ABSTRACT The movement to LED lighting...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 273-282, July 19–23, 2009
Paper No: InterPACK2009-89076
... design was proposed by eliminating the fin material at the center of the heat sink, thereby enhancing its thermal performance. Computational Fluid Dynamics electronics cooling heat sinks heat sink optimization heat sink with fan Impingement flow Impingement heat sink thermal management...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 79-86, July 8–12, 2007
Paper No: IPACK2007-33684
... survivable by the materials used to construct the driving motor. General characteristics of the FPSC are discussed from the standpoint of electronics cooling and various options for heat transport are presented. Two prototype FPSCs have been developed for cooling electronics packages in applications where...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 329-334, July 8–12, 2007
Paper No: IPACK2007-33471
..., Electronics cooling 'Col~esponding author: keisuke.horiuchi.oa@hitachi.com NOMENCLATURE C Ratio of amount of evaporated liquid to the flow rate cp specific heat [J/(kg K)] I1 L Power Q QL Re, S I C" re,, height of fin in evaporator latent heat thermal design power total flow rate amount of evaporated liquid...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 119-127, July 17–22, 2005
Paper No: IPACK2005-73101
...-level conductivity enhancement and thermal vias under the package in reduction of package temperature. 03 04 2009 Compact component thermal models thermal design electronics cooling Proceedings of IPACK2005 Proceedings of IPACK2005design, electronics cooling. NOMENCLATURE T...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 439-443, July 17–22, 2005
Paper No: IPACK2005-73288
... better in terms of power consumption and cooling volume.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference . 03 04 2009 electronics cooling piezoelectric actuators miniature fans heat sinks 1 This work was co...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 189-195, July 17–22, 2005
Paper No: IPACK2005-73128
... Plate fin heat sinks are commonly used in electronics cooling including high end processors. A number of empirical and analytical methods are available to predict their performance but most of the models are valid for fin pitch larger than 3 mm heat sinks in laminar flow. The present work...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 697-702, July 17–22, 2005
Paper No: IPACK2005-73498
... has enable it to score an edge over the traditional heat pipes. In the past, LHPs has been invariably assessed for electronic cooling at large scale. As the size of the thermal footprint and available space is going down drastically, miniature size of the LHP has to be developed. In this paper...