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Keywords: electronics cooling
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97729
... Abstract When dealing with thermosyphon systems for electronics cooling, there is a dearth of experimental studies addressing the physics of having multiple evaporators in parallel. Indeed, it is very common to have several processing units on the same device, such as the Central Processing...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97400
... qualities of about 70 to 75%, and the pressure drop increased linearly with exit quality. metallic foam compressed foam flow boiling porous media electronics cooling high heat flux two phase cooling Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72620
... removal capability. datacenter electronics cooling passive two-phase heat transfer simulations thermal performance thermosyphon Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
... Abstract The trade-off between efficient cooling and low power consumption is a goal that has always been very desirable in electronics cooling, especially nowadays that power densities of processing units are increasing. Conventional cooling solutions do not have the necessary cooling...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72618
... Abstract Two-phase cooling systems based on the thermosyphon operating principle exhibit excellent heat transfer performance, reliability, and flexibility, therefore can be applied to overcome thermal challenges in a wide range of electronic cooling applications and deployment scenarios...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74108
... on a larger scale in data center applications. cryogenic liquid nitrogen electronics cooling Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73015
... reduction in overall thermal resistance for highly porous foams bonded on Cu substrates. electronics cooling mathematical modeling modeling thermal analysis thermal interface thermal management of electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69254
... pastes at a significantly lower cost. We also expect similar benefits for the silicone-based thermal pastes. electronics cooling thermal interface material thermal management electronics packaging graphene thermal conductance Proceedings of the ASME 2021 International Technical Conference...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73269
.... analytical modeling data centers electronics cooling liquid-cooling mathematical modeling modeling Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73270
... electronics cooling liquid-cooling mathematical modeling modeling thermal management of electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73271
... component-level design or analysis for different operating conditions and system requirements. data centers electronics cooling liquid-cooling mathematical modeling modeling thermal management of electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72612
.... Thermosyphon-based cooling systems across multiple length scales can significantly improve operation in terms of lowering energy consumption, allowing for higher hardware density, increased processing speed and reliability. datacenters electronics cooling operational maps passive two-phase flow...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2569
... drop in the heat transfer rate. In this regard, the study emphasizes the importance of the fin tip design for the heat sinks operating under frosting conditions. frost thermal resistance heat flux electronics cooling forced convection AN EXPERIMENTAL INVESTIGATION INTO FROST ACCUMULATION...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73031
... abatement techniques for local hot spots while keeping light extraction at maximum. Light emitting diodes LEDs Liquid cooling thermal management electronics cooling design optimization DIRECT LIQUID COOLING OF HIGH FLUX LED SYSTEMS: HOT SPOT ABATEMENT Enes Tamdogan*, Mehmet Arik and M. Baris...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A035, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73179
... lighting applications. LED cooling natural convection heat sink chimney electronics cooling A19 bulb ADVANCED NATURAL CONVECTION COOLING DESIGNS FOR LED BULB SYSTEMS James Petroski Lighting Display & Technologies Rambus, Inc. Brecksville, OH USA, 44141 ABSTRACT The movement to LED lighting...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 273-282, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89076
... design was proposed by eliminating the fin material at the center of the heat sink, thereby enhancing its thermal performance. Computational Fluid Dynamics electronics cooling heat sinks heat sink optimization heat sink with fan Impingement flow Impingement heat sink thermal management...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 79-86, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33684
... survivable by the materials used to construct the driving motor. General characteristics of the FPSC are discussed from the standpoint of electronics cooling and various options for heat transport are presented. Two prototype FPSCs have been developed for cooling electronics packages in applications where...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 329-334, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33471
..., Electronics cooling 'Col~esponding author: [email protected] NOMENCLATURE C Ratio of amount of evaporated liquid to the flow rate cp specific heat [J/(kg K)] I1 L Power Q QL Re, S I C" re,, height of fin in evaporator latent heat thermal design power total flow rate amount of evaporated liquid...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 119-127, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73101
... of board-level conductivity enhancement and thermal vias under the package in reduction of package temperature. Compact component thermal models thermal design electronics cooling Proceedings of IPACK2005 Proceedings of IPACK2005design, electronics cooling. NOMENCLATURE T Temperature, °C k...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 439-443, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73288
... perform significantly better in terms of power consumption and cooling volume.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference . electronics cooling piezoelectric actuators miniature fans heat sinks 1 This work was co...