..., it was revealed that the coaxial jet’s attained higher heat transfer characteristics than the single circular jet’s. coaxial jet impingement numerical analysis heat transfer electronics cooling Proceedings of the ASME 2024 International Technical Conference and Exhibition on Packaging and Integration...

... design of such cooling loops. electronics cooling experimental simulation passive two-phase refrigerant thermal performance Proceedings of the ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2024...

... their operation. Consequently, the objective of this article is to design and construct an apparatus to test electronic cooling via direct contact with liquids. Properties of liquids researched, as well as the rational for choosing the electronics we tested are given in this article. Description of the testing...

... Abstract When dealing with thermosyphon systems for electronics cooling, there is a dearth of experimental studies addressing the physics of having multiple evaporators in parallel. Indeed, it is very common to have several processing units on the same device, such as the Central Processing...

... qualities of about 70 to 75%, and the pressure drop increased linearly with exit quality. metallic foam compressed foam flow boiling porous media electronics cooling high heat flux two phase cooling Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging...

... removal capability. datacenter electronics cooling passive two-phase heat transfer simulations thermal performance thermosyphon Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021...

... Abstract The trade-off between efficient cooling and low power consumption is a goal that has always been very desirable in electronics cooling, especially nowadays that power densities of processing units are increasing. Conventional cooling solutions do not have the necessary cooling...

... Abstract Two-phase cooling systems based on the thermosyphon operating principle exhibit excellent heat transfer performance, reliability, and flexibility, therefore can be applied to overcome thermal challenges in a wide range of electronic cooling applications and deployment scenarios...

... on a larger scale in data center applications. cryogenic liquid nitrogen electronics cooling Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online...

... reduction in overall thermal resistance for highly porous foams bonded on Cu substrates. electronics cooling mathematical modeling modeling thermal analysis thermal interface thermal management of electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition...

... pastes at a significantly lower cost. We also expect similar benefits for the silicone-based thermal pastes. electronics cooling thermal interface material thermal management electronics packaging graphene thermal conductance Proceedings of the ASME 2021 International Technical Conference...

.... analytical modeling data centers electronics cooling liquid-cooling mathematical modeling modeling Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online...

... electronics cooling liquid-cooling mathematical modeling modeling thermal management of electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online...

... component-level design or analysis for different operating conditions and system requirements. data centers electronics cooling liquid-cooling mathematical modeling modeling thermal management of electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition...

.... Thermosyphon-based cooling systems across multiple length scales can significantly improve operation in terms of lowering energy consumption, allowing for higher hardware density, increased processing speed and reliability. datacenters electronics cooling operational maps passive two-phase flow...

... drop in the heat transfer rate. In this regard, the study emphasizes the importance of the fin tip design for the heat sinks operating under frosting conditions. frost thermal resistance heat flux electronics cooling forced convection AN EXPERIMENTAL INVESTIGATION INTO FROST ACCUMULATION...

... abatement techniques for local hot spots while keeping light extraction at maximum. Light emitting diodes LEDs Liquid cooling thermal management electronics cooling design optimization DIRECT LIQUID COOLING OF HIGH FLUX LED SYSTEMS: HOT SPOT ABATEMENT Enes Tamdogan*, Mehmet Arik and M. Baris...

... lighting applications. LED cooling natural convection heat sink chimney electronics cooling A19 bulb ADVANCED NATURAL CONVECTION COOLING DESIGNS FOR LED BULB SYSTEMS James Petroski Lighting Display & Technologies Rambus, Inc. Brecksville, OH USA, 44141 ABSTRACT The movement to LED lighting...

... design was proposed by eliminating the fin material at the center of the heat sink, thereby enhancing its thermal performance. Computational Fluid Dynamics electronics cooling heat sinks heat sink optimization heat sink with fan Impingement flow Impingement heat sink thermal management...

... survivable by the materials used to construct the driving motor. General characteristics of the FPSC are discussed from the standpoint of electronics cooling and various options for heat transport are presented. Two prototype FPSCs have been developed for cooling electronics packages in applications where...