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Keywords: electronic packaging reliability
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A014, October 25–27, 2022
Paper No: IPACK2022-97453
... stress or strain has been recorded and discussed. electronic packaging reliability EMC mechanical properties fatigue long term aging high temperature Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A024, October 26–28, 2021
Paper No: IPACK2021-74076
... modulus and glass transition temperature are extracted from the results of dynamic loading tests. The aging effect of linear viscoelasticity has been discussed. electronic packaging reliability underfill mechanical properties long term aging high temperature Proceedings of the ASME 2021...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A023, October 26–28, 2021
Paper No: IPACK2021-74075
... viscoelasticity has been discussed. electronic packaging reliability epoxy molding compound linear viscoelasticity prony parameters long term aging high temperature Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic...
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Paper No: IPACK2020-2677
.... electronic packaging reliability underfill mechanical properties microstructure long term aging high temperature DEGRADATION MECHANISMS OF UNDERFILLS SUBJECTED TO ISOTHERMAL LONG- TERM AGING FROM 150 TO 200 Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling Auburn University NSF-CAVE3...
