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Keywords: electromigration
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021
Paper No: IPACK2021-69882
...Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online IPACK2021-69882 ELECTROMIGRATION ANALYSIS OF SOLDER JOINTS FOR POWER MODULES USING AN ELECTRICAL...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021
Paper No: IPACK2021-68902
... current. According to scaling down of In addition, the reliability characteristics of the metal electric devices, the current density and Joule heat in particle line under electric current loads were recently evaluated interconnect line increase and electromigration (EM) damage [4]. However, reliability...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020
Paper No: IPACK2020-2556
...Abstract Abstract Power modules are being developed with the aim of increasing power output. Achieving this aim requires increased current density in power modules. However, at high current densities, power modules can degrade as a result of electromigration, which is a phenomenon where atoms...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019
Paper No: IPACK2019-6521
... Abstract Lead free solder materials have replaced lead based solder materials nowadays for increased environmental concern. Further miniaturization of electronic solder joints in packages has caused electromigration to dominate among all the reliability issues found in electronic packages...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1313-1321, July 17–22, 2005
Paper No: IPACK2005-73417
... in the International Technology of Roadmap for Semiconductors (ITRS), this trend makes electromigration the limiting factor in high density packages. The heightened current density and correspondingly elevated operating temperatures are a critical issue in reliability since these factors facilitate the effects...