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Keywords: cyclic stress-strain curve
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Proceedings Papers
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112030
... was accumulated. We are also using the data in our studies to incorporate damage parameters into popular constitutive models for solder such as the Norton and Garofalo creep models, and the Anand viscoplastic model. SAC305 lead-free solder cyclic stress-strain curve creep response hysteresis total...
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-93878
... mechanics models and fatigue criteria for lead free solders that are subjected to variable temperature applications. KEYWORDS SAC305 Lead-Free Solder, Cyclic Stress-Strain Curve, Creep Response, Hysteresis. INTRODUCTION Solder alloys are used as interconnecting materials in modern electronic packages...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73548
.... These samples were then mechanically cycled for various durations at testing temperatures of 100 °C. The measured cyclic stress-strain curves were used to characterize the evolution of the hysteresis loop properties (peak stress, hysteresis loop area, and plastic strain range) with high temperature mechanical...
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6560
.... KEYWORDS Lead Free Solder, Aging, Doped, Bismuth, Microstructure, Evolution, Hysteresis, Cyclic Stress-Strain Curve 1 Copyright © 2019 ASME Proceedings of the ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2019...
Topics:
Lead-free solders
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 507-518, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52186
.... Samples were cyclically loaded under both strain control (constant positive and negative strain limits) and stress control (constant positive and negative stress limits). The hysteresis loop size (area) was calculated from the measured cyclic stress-strain curves for a given solder alloy and temperature...