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Keywords: contact resistance
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Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 687-694, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35324
..., if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances...
