1-1 of 1
Keywords: compact thermal model
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Investigation Regarding Transient Compact Thermal Model for Microprocessor Packages

Koji Nishi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6390
https://doi.org/10.1115/IPACK2019-6390
... and thermal management validation because it requires transient thermal simulation with very short time step. To enable rapid simulation environment, compact thermal model which can be employed with both three-dimensional transient thermal simulation and transient thermal network is required. Therefore...
View Paper titled, Investigation Regarding Transient <span class="search-highlight">Compact</span> <span class="search-highlight">Thermal</span> <span class="search-highlight">Model</span> for Microprocessor Packages
Open the PDF for Investigation Regarding Transient <span class="search-highlight">Compact</span> <span class="search-highlight">Thermal</span> <span class="search-highlight">Model</span> for Microprocessor Packages in another window
Topics: Transients (Dynamics)