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Proceedings Papers

Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm

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Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6334
https://doi.org/10.1115/IPACK2019-6334
... the maximum temperature on both layers, the second objective aims to achieve temperature uniformity in the layers. A feed-forward back propagation Artificial Neural Network (ANN) is employed for obtaining the functional relationship between the location of the hotspots and the objectives. The results...
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Topics: Artificial neural networks, Genetic algorithms, Heat