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Keywords: additive manufacturing
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A025, October 26–28, 2021
Paper No: IPACK2021-74199
... for advance packaging. RDL is usually fabricated in wafer level technology for wafer level packaging. With RDL, the by photolithography process. An alternative approach for interconnection of ICs may be re-defined for miniaturization and implementing RDL by additive manufacturing (AM) method is integration [1...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Paper No: IPACK2021-73367
...Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021 October 26-28, 2021, Virtual, Online IPACK2021-73367 RELIABLE ADDITIVE MANUFACTURING USING TRANSIENT LIQUID PHASE SINTERING Gilad Nave...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 27–29, 2020
Paper No: IPACK2020-2532
...Abstract Abstract Significant levels of heat are generated in contemporary electronics, and next generation devices will continue to demand higher power despite decreasing size; therefore, highly effective cooling schemes are needed. Simultaneously, advances in metal additive manufacturing have...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020
Paper No: IPACK2020-2596
... a photolithography approach which involves an increased number of fabrication steps depending on the complexity of the structures. This current study involves the fabrication of these structures using a different approach, utilizing additive manufacturing that reduces the number of fabrication steps required...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Paper No: IPACK2020-2591
...Abstract Abstract The present study is an experimental investigation of a set of five additively-manufactured compact, lightweight, low-cost, air-to-water cross-media heat exchangers suitable for liquid cooling applications in desktop computers, among other applications. The heat transfer...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Paper No: IPACK2019-6356
... Abstract AM (Additive manufacturing) technology has huge demand from industry for its high-speed fabricating, ability of fabricating complex shapes and low-cost fabrication which does not require expensive equipment such as molds. In particular, resolution of stereolithography technology...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Paper No: IPACK2019-6519
... in volume. To fully take advantage of the benefits offered by these devices, the packaging, including cooling infrastructure, must also be addressed. Additive manufactured (AM) structures, based on unit cells seen in stochastic foams, have been investigated as an improvement in thermal management...