... Abstract Electronic parts may often get exposed to high strains during shocks, vibrations and drop conditions in both commercial and defense applications. In addition, such electronic parts can often be simultaneously exposed to extreme surrounding temperatures between −65°C and 200°C after...

..., whose 1st mode of natural frequency is about z. Therefore, the curvature changes of the test modules inimal, which resulted in smaller relative motion en the package and the PWB, and less solder joint es. All these test results are recommended to be used for ating BGA solder joint vibration fatigue life...

... Fatigue PBGA vibration PTC TCT Thermomechanical, power temperature cycling (PTC) and vibration analyses were performed on a 313 staggered pin PBGA package using plastic and viscoplastic disturbed-state damage models. An accelerated finite element failure analysis was performed using...