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Keywords: Spray Cooling
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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1-9, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73003
... Experiments were conducted to study the effects of enhanced surface structures on heat flux using spray cooling. The surface enhancements consisted of cubic pin fins machined on the top surface of copper heater blocks. The structure height, pitch, and width were parametrically varied. Each...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 259-266, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73189
... are subjected to stressing techniques that induce heat levels, typically, 100%–300% greater than end use environment heat loads. For this work, an indirect spray cooling method was developed and experimentally evaluated. In the indirect method, sprays are sealed within a spraycap (evaporator) that is thermally...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 575-583, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35334
... and compared in terms of heat dissipation potential, reliability, and packaging application concerns. thermal management electronic cooling thermal modeling refrigeration liquid cooling spray cooling p Cr ratio COP coef CFM Cubi D diam h heat i enth I elect K therm M& mass Nu Nuss NTU num P...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 635-640, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35299
... described in this study include the operating characteristics of the VIDA spray and heat transfer capabilities. Heat dissipation levels as high as 195 W have been measured from an evaporation surface held below 120°C at atmospheric pressure. two-phase heat transfer spray cooling microelectronics...