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Keywords: Proper Orthogonal Decomposition
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Proceedings Papers
Dynamic Reduced Order Thermal Modeling of Data Center Air Temperatures
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 423-432, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52029
... 15 02 2012 We developed a Proper Orthogonal Decomposition (POD) based dynamic reduced order model that can predict transient temperature field in an air-cooled data center. A typical data center is modeled as a turbulent convective thermal system with multiple length scales...
Proceedings Papers
Robust Design of Air-Cooled Server Cabinets for Thermal Efficiency
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1649-1659, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73171
... Design Proper Orthogonal Decomposition Proceedings of IPACK05 International Electronic Packaging Technical Conference and Exhibition July 17-22, 2005, San Francisco, California, USA cab [1]. unp the con thro The ene sign infr bec Proceedings of IPACK2005 ASME InterPACK '05 July 17-22, San Francisco...
