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Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 239-244, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35145
... power in the wavelength division multiplexing (WDM) network systems. PLC MEMS AWG VOA WDM Surface micromachining Proceedings of IPACK03 lectronic Packaging Technical Conference and Exhibition equalize the optical signal power in the wavelength division multiplexing (WDM) network systems...
Topics:
Microelectromechanical systems