... 07 01 2011 Advancing the emerging technologies of MEMS, especially relating to the applications, constitutes one of the most challenging tasks in today’s micromechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies...

... 12 01 2010 Development of microelectromechanical system (MEMS) sensors for various applications requires the use of analytical and computational modeling/simulation coupled with rigorous physical measurements. This requirement has led to advancement of an approach that combines...

... 12 01 2010 Development of microelectromechanical systems (MEMS) constitutes one of the most challenging tasks in today’s micromechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies for determination of functional...

... 12 01 2010 Continued advances in microelectromechanical systems (MEMS) technology have led to development of numerous applications including, but not limited to: automotive, communication, information technology, deep-space, medical, safety, national security, etc. These developments...

... laboratory (μChemLab) and other microelectromechanical systems (MEMS). Applications of these microscale systems frequently demand heat removal and temperature control. This paper presents preliminary results of a study of heat transfer in microscale systems. Computational modeling is based on Thermal...

... 12 01 2010 Increasing demand for high performance, stable, and affordable sensors for applications in process control industry has led to development of a miniature pressure sensor. This development, made possible by recent advances in microelectromechanical systems (MEMS) fabrication...

... 12 01 2010 Two of the primary causes of MEMS failure are stiction of the moving microparts due to moisture from environment and particulate contamination due to the degradation of organic materials. The use of getters such as sputtered Ti and Ba to maintain a moisture free environment...

... 12 01 2010 Today, an ideal microelectromechanical systems (MEMS) switch is no longer a designer’s dream, yet electrothermomechanical (ETM) effects still limit the design possibilities and may adversely affect reliability of microswitches, especially the Ohmic-type cantilever contact...

... 03 04 2009 Wafer level packaging has emerged as one of the promising solutions for hermetic packaging of MEMS devices. Detection of the level of hermeticity of the package is essential for reliability and design assessment of the devices. Traditionally, hermeticity has been tested...

...-extraction methods for large-scale implementation in semiconductor or MEMS fabs. MEMS MEMS modeling Micromechanics Microstructures Thin films Young’s modulus Proceedings of IPACK 2005 ASME InterPACK 05 July 17-22, San Francisco, California, USA technique on suspended thin-film membranes under...

... 03 04 2009 Micro-jet array MEMS Finite difference method Impinging cooling device Heat transfer Compressible flow In this work ways to improve the performance of the MJA is investigated using computer modeling. Finite-difference method is used to analyze and understand...

... 03 04 2009 This paper discusses a new structural optimization methodology for MEMS and its application to reliability evaluation of micro relays. Clarifying the relationship between system characteristics and design factors, our new design optimization method (called MESA) enables...

... 03 04 2009 We report on the development of a new micro-electro-mechanical systems (MEMS) optimal design method called MEMS Early-Stage Analysis (MESA), which supports the total system evaluation of MEMS devices before the design stage. Recently total system simulation and design using...

... 03 04 2009 Raman spectroscopy was investigated as a method for the temperature and stress measurement in thermal MEMS devices. Calibrations of the Stokes Raman shift and the Stokes to anti-Stokes intensity ratio for doped samples were performed in order to calculate the temperature...

... An integrated arrayed waveguide grating multi/demultiplexer (AWG) with a micro-electro-mechanical systems (MEMS) based variable optical attenuator (VOA) is reported. The device consists of an AWG based on silica and a MEMS-VOA chip. The MEMS chip includes 100 μm × 100 μm polysilicon shutter...

... MEMS Micromirror Digitized Angle Repeatability To eliminate or lower the power consumption and complexity of the control electronics that limit the applications of analog optical switches, beam steering devices and other micromirrors, this paper presents micromirrors with multiple...

... Actuator Micromirror MEMS Surface micro machining Response surface method In this paper, a new thermal actuator for micromirror control with very low operating voltage is described. The actuator consists of three straight polysilicon cantilever arms and a polysilicon winding arm...