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Keywords: MEMS
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Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 267-276, July 19–23, 2009
Paper No: InterPACK2009-89223
... Center for Holographic Studies and Laser micro-mechaTronics Mechanical Engineering Department Worcester Polytechnic Institute Worcester, MA 01609 USA Telephone: (508) 831-5536, Fax: (508) 831-5713, Email: rjp@wpi.edu ABSTRACT Advancing the emerging technologies of MEMS, especially relating...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 971-977, July 8–12, 2007
Paper No: IPACK2007-33501
... 12 01 2010 Increasing demand for high performance, stable, and affordable sensors for applications in process control industry has led to development of a miniature pressure sensor. This development, made possible by recent advances in microelectromechanical systems (MEMS) fabrication...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 37-42, July 8–12, 2007
Paper No: IPACK2007-33503
... 12 01 2010 Development of microelectromechanical system (MEMS) sensors for various applications requires the use of analytical and computational modeling/simulation coupled with rigorous physical measurements. This requirement has led to advancement of an approach that combines...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 481-488, July 8–12, 2007
Paper No: IPACK2007-33268
... 12 01 2010 Development of microelectromechanical systems (MEMS) constitutes one of the most challenging tasks in today’s micromechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies for determination of functional...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 319-326, July 8–12, 2007
Paper No: IPACK2007-33094
... 12 01 2010 Copyright © 2007 by ASME 1 Proceedings of IPACK2007 ASME InterPACK '07 July 8-12, 2007, Vancouver, British Columbia, CANADA IPACK2007-33094 EFFECT OF PROCESS PARAMETERS ON TED-BASED Q-FACTOR OF MEMS Ryszard J. Pryputniewicz NEST NanoEngineering, Science, and Technology CHSLT...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 155-162, July 8–12, 2007
Paper No: IPACK2007-33269
... fabrication of micron-sized mechanical devices, which have had a major impact on many disciplines. These devices have not only led to development of miniature transducers for sensing and actuation, but also a chip-based chemical laboratory ( ChemLab) and other microelectromechanical systems (MEMS...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 67-72, July 8–12, 2007
Paper No: IPACK2007-33850
... 12 01 2010 Two of the primary causes of MEMS failure are stiction of the moving microparts due to moisture from environment and particulate contamination due to the degradation of organic materials. The use of getters such as sputtered Ti and Ba to maintain a moisture free environment...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 185-191, July 8–12, 2007
Paper No: IPACK2007-33502
... 12 01 2010 Today, an ideal microelectromechanical systems (MEMS) switch is no longer a designer’s dream, yet electrothermomechanical (ETM) effects still limit the design possibilities and may adversely affect reliability of microswitches, especially the Ohmic-type cantilever contact...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1631-1636, July 17–22, 2005
Paper No: IPACK2005-73049
... 03 04 2009 MEMS RF switch microrelay design optimization electroforming This paper discusses a new structural optimization methodology for MEMS and its application to reliability evaluation of micro relays. Clarifying the relationship between system characteristics and design...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1637-1642, July 17–22, 2005
Paper No: IPACK2005-73050
... MEMS Optimal design CAE MESA Surface micro machining We report on the development of a new micro-electro-mechanical systems (MEMS) optimal design method called MEMS Early-Stage Analysis (MESA), which supports the total system evaluation of MEMS devices before the design stage. Recently...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1695-1702, July 17–22, 2005
Paper No: IPACK2005-73088
... Micro-infrared thermography (micro-IR) can provide a Proceedings of IPACK20051 Copyright © 2005 by ASME oscopy, polycrystalline silicon, MEMS, etry, thermal stress -electro-mechanical systems (MEMS) are of micro-devices that are being developed e of engineering applications. In the area of es, induced...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2067-2071, July 17–22, 2005
Paper No: IPACK2005-73485
... 03 04 2009 Wafer level packaging has emerged as one of the promising solutions for hermetic packaging of MEMS devices. Detection of the level of hermeticity of the package is essential for reliability and design assessment of the devices. Traditionally, hermeticity has been tested...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1743-1747, July 17–22, 2005
Paper No: IPACK2005-73337
...-extraction methods for large-scale implementation in semiconductor or MEMS fabs. MEMS MEMS modeling Micromechanics Microstructures Thin films Young’s modulus Proceedings of IPACK 2005 ASME InterPACK 05 July 17-22, San Francisco, California, USA technique on suspended thin-film membranes under...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 545-552, July 17–22, 2005
Paper No: IPACK2005-73392
... 03 04 2009 In this work ways to improve the performance of the MJA is investigated using computer modeling. Finite-difference method is used to analyze and understand the heat transfer mechanism in the MEMS based air micro-jet array (MJA) impinging cooling device. The three-dimensional...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 239-244, July 6–11, 2003
Paper No: IPACK2003-35145
...Proceedings of IPACK03 lectronic Packaging Technical Conference and Exhibition equalize the optical signal power in the wavelength division multiplexing (WDM) network systems. Keywords: PLC, MEMS, AWG, VOA, WDM, Surface m I i w h i c w y e y attenuator (VOA) has been also demonstrated and put...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 269-277, July 6–11, 2003
Paper No: IPACK2003-35341
... requirements defined by a dual-lens and dual-micromirror array system are used to guide the designs of the micromirrors. The micromirrors with multiple digitized angles are designed using MUMPs, a MEMS foundry process, and simulated by full coupled-domain FEM/BEM. The effects of the design parameters...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 233-238, July 6–11, 2003
Paper No: IPACK2003-35123
... and actuate on the micro scale. MS are enabling systems that are widely used in many lications such as accelerometers, pressure sensors, medical sensors, atomic force sensors and flow controls ]. Additionally, in the optical communication field, MEMS ed micromirrors have been used to attenuate optical power...