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Keywords: Hygroscopic swelling
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Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 497-503, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35252
... between adjacent materials, the hygroscopic stress increases as the hygroscopic swelling coefficient of the mold compound increases. Accurate measurement of hygroscopic swelling is essential in assessing the effect of hygroscopic stresses on package reliability. In this paper, a whole-field experimental...