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Keywords: Heat Transfer
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112452
... multi-chip module liquid cooling heat sink data centers heat transfer Abstract The variety of new electronic packaging technologies has grown significantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97266
... Abstract This study presents an experimental investigation on the nucleate boiling heat transfer (NBHT) in deionized (DI) water and HFE-7100 on bare copper surfaces. The experiments were performed under atmospheric condition at 0 and 10 K subcooling levels. The primary objective...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97446
... heat transfer heat sink jet impingement nozzle direct cooling geometry manifold power modules hybrid inverter Abstract The objective of this study is to quantify heat transfer direct cooling channel enhancements in single phase for optimal cooling. A device is created to mitigate...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6391
... International, Alpharetta, GA ABSTRACT The use of computational fluid dynamics/heat transfer (CFD/HT) software has become common in exploring the thermal and hydrodynamic behavior of many electronic products. Well-designed CFD/HT models are very valuable for driving the product design, but accurate models can...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 261-272, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89065
... 07 01 2011 Heat transfer enhancement using segmented non-boiling gas-liquid streams is examined. Segmentation results in a two phase flow of liquid/gas having a constant liquid fraction, i.e. no phase change occurs. In this flow configuration, enhanced heat transfer occurs as a result...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 329-334, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33471
... of this coefficient is C ≈ 0.7∼0.95. For the demonstration, we designed the assembled-type two-phase cooling module with the optimum flow rate based on our model, and we observed that the evaporator had a relatively small thermal resistance of 0.1K/W. Boiling Heat transfer Evaporator Condenser Electronics...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 189-195, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73128
...) × 50 mm (H), and fin number varied between 23 and 33. Heat sink base for all heat sinks was made of solid copper, while different fin materials of Aluminum and Copper are used. Several analytical methods for laminar flow from literature were reviewed in this study. A new heat transfer analytical method...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 545-552, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73392
... In this work ways to improve the performance of the MJA is investigated using computer modeling. Finite-difference method is used to analyze and understand the heat transfer mechanism in the MEMS based air micro-jet array (MJA) impinging cooling device. The three-dimensional Navier-Stokes (NS...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1-9, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73003
... pressure of 41.4 kPa) and gassy conditions (chamber with N 2 gas at 101 kPa) with a bulk fluid temperature of 20.5°C. Results for both the degassed and gassy cases show that structure width and separation distance have a dominant effect upon the heat transfer for the size ranges used. Cubic pin fin height...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 111-117, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35055
... application challenges unique to LEDs. Conventional lighting methods provide little guidance for LED thermal problems since these usually involve a very high temperature source, such as a filament or an arc, and radiant heat transfer dissipates the thermal energy. LED junction temperatures are limited to much...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 73-80, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35020
... A series of experimental investigations with a new modified transient liquid crystal method on the studies related to the fluid flow and heat transfer characteristics in a channel installed with a heat sink have been successfully performed. The parametric studies on the local and average...