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Keywords: Finned Surfaces
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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1-9, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73003
...% relative to the flat surface case. 03 04 2009 Enhancement Spray Cooling Finned Surfaces Dissolved Gas Heat Transfer Corre Proceedings of InterPACK 2005: ASME INTERNATIONAL ELECTRONIC PACKAGING AND TECHNICAL CONFERENCE height, copper Measure surface was us perform (chambe with N2 oC...