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Keywords: EBSD
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Proceedings Papers
Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94505
... tensile and shear tests are conducted at room temperature on a set of single-grain SAC305 solder joints. The grain structure for each test specimen is characterized with EBSD and finite element modeling is used to iteratively extract model constants for Hill-Holloman continuum plasticity model, which...
Proceedings Papers
Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging
Available to PurchaseMohammad Hasnine, Muhannad Mustafa, Jing Zou, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73234
..., it was important to identify the grain structure and crystal orientations in the tested joints. Polarized light microscopy and Electron Back Scattered Diffraction (EBSD) techniques have been utilized for this purpose. The test results show that the elastic, plastic, and creep properties of the solder joints...
