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Keywords: Composite
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Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 719-725, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35149
... Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electronic package systems. High dielectric constant epoxy/ceramic composites have been of great interest as embedded capacitor materials, because they have good...
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 343-348, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35132
... Composite Design of Experiments Finite Element Modeling A study of the influence of embedding sensors to detect damage within a composite laminate is conducted. A variety of sensors are considered along with several encapsulation materials. Encapsulation is required to aid in interfacial...