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Keywords: AI platform
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96972
... Abstract Due to continuous growth of AI accelerator chip power and heat flux, implementation of advanced cooling technologies for AI platforms seems to be inevitable for hyper scale users. Liquid cooling is one of the relatively more mature category of advanced cooling technologies, and has...
Topics:
Cooling
