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Underfill and Encapsulant Effects on Package Reliability
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Proceedings Papers
Tae Hyun Kim, Sung Yi, Jae Ky Roh, Chang Mu Jung, Yan Shuang Guo, Jae Chun Do, Jin Gu Kim, Shan Guo, Jupyo Hong
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1-8, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33034
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 13-19, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33591
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 9-12, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33562