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Proceedings Papers

Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

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Fanghao Yang, Mark Schultz, Pritish Parida, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48341
https://doi.org/10.1115/IPACK2015-48341
View Paper titled, Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Heating, Temperature, Cooling, Resistance thermometers, Coolants, Density
Proceedings Papers

Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

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Mirco Magnini, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48033
https://doi.org/10.1115/IPACK2015-48033
View Paper titled, Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels
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Topics: Boiling, Computational fluid dynamics, Engineering simulation, Heat transfer, Microchannels, Simulation, Slug flows, Bubbles, Evaporation, Flow (Dynamics)
Proceedings Papers

Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

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John Ditri, Joseph Hahn, Roland Cadotte, Michael McNulty, Denise Luppa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48689
https://doi.org/10.1115/IPACK2015-48689
View Paper titled, Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets
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Topics: Cooling, Electronics, Heat flux, Jets, Microfluidics, Simulation, Computational fluid dynamics, Reliability, Coolers, Cooling systems
Proceedings Papers

Novel Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

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Tom Saenen, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A021, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48066
https://doi.org/10.1115/IPACK2015-48066
View Paper titled, Novel Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
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Topics: Microchannels, Dynamic models, Flow (Dynamics), Heat conduction, Heat transfer, Pressure, Simulation, Stability, Two-phase flow
Proceedings Papers

Reliable Integration of Microchannel Coolers for Power Electronics

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David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48757
https://doi.org/10.1115/IPACK2015-48757
View Paper titled, Reliable Integration of Microchannel Coolers for Power Electronics
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Topics: Coolers, Electronics, Microchannels, Corrosion, Electronic packages, Electronic systems, Erosion, Failure mechanisms, Fracture (Materials), Fracture (Process)
Proceedings Papers

Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

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Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48348
https://doi.org/10.1115/IPACK2015-48348
View Paper titled, Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels
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Topics: Cooling, Coolants, Temperature, Vehicles, Flux (Metallurgy), Heat, Dimensions, Flow (Dynamics), Heating, Pressure drop
Proceedings Papers

Validation Study for VOF Simulations of Boiling in a Microchannel

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Catherine Gorlé, Hyoungsoon Lee, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48129
https://doi.org/10.1115/IPACK2015-48129
View Paper titled, Validation Study for VOF Simulations of Boiling in a Microchannel
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Topics: Boiling, Microchannels, Simulation, Boundary-value problems, Temperature, Two-phase flow, Flow (Dynamics), Fluids, Heat flux, Heat transfer
Proceedings Papers

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

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Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48178
https://doi.org/10.1115/IPACK2015-48178
View Paper titled, A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels
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Topics: Boiling, Flow (Dynamics), Microchannels, Modeling, Vapors, Bubbles, Simulation, Currents, Errors, Evaporation
Proceedings Papers

3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

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Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48584
https://doi.org/10.1115/IPACK2015-48584
View Paper titled, 3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Microfluidics, Heat sinks, Atmospheric pressure, Coolants, Heat flux, Heat transfer coefficients, Pressure drop, Silicon, Testing
Proceedings Papers

Heat Transfer Characteristics of Self-Rewetting Fluid and its Application in Heat Pipe

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S. F. Wang, Y. X. Hu, Y. Zhou, W. Zhang
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48665
https://doi.org/10.1115/IPACK2015-48665
View Paper titled, Heat Transfer Characteristics of Self-Rewetting Fluid and its Application in Heat Pipe
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Topics: Fluids, Heat pipes, Heat transfer, Water, Surface tension, Boiling, Bubbles, Cooling, Critical heat flux, Temperature
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

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Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48334
https://doi.org/10.1115/IPACK2015-48334
View Paper titled, Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program
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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Proceedings Papers

A Numerical Study of Pulsating Heat Pipe Performance

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Brian P. d’Entremont, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48350
https://doi.org/10.1115/IPACK2015-48350
View Paper titled, A Numerical Study of Pulsating Heat Pipe Performance
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Topics: Heat pipes, Slug flows, Boiling, Condensation, Evaporation, Microchannels, Buoyancy, Condensers (steam plant), Flow (Dynamics), Heat transfer
Proceedings Papers

ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels

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Gustavo R. Anjos, Norberto Mangiavacchi, Jose Pontes, John Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A026, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48441
https://doi.org/10.1115/IPACK2015-48441
View Paper titled, ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels
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Topics: Finite element methods, Heat, Mass transfer, Microchannels, Two-phase flow, Bubbles, Computer programming, Cooling, Design, Electronics
Proceedings Papers

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

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Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48489
https://doi.org/10.1115/IPACK2015-48489
View Paper titled, Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling
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Topics: Boiling, Cavities, Coolants, Cooling, Density, Evaporative cooling, Flow (Dynamics), Fluids, Heat transfer, Integrated circuits
Proceedings Papers

A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

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Yasushi Koito, Hiroyuki Maehara, Daisuke Shimada, Toshio Tomimura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A028, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48308
https://doi.org/10.1115/IPACK2015-48308
View Paper titled, A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)
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Topics: Heat, Heat pipes, Heat transfer, Thermal conductivity, Water, Circuits, Condensers (steam plant), Copper powders, Dimensions, Fluids
Proceedings Papers

Fabrication of a Vapor Chamber on a Plastic Board

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Fumihiko Hideyama, Shuto Nonoshita, Yasushi Koito, Toshio Tomimura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A029, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48554
https://doi.org/10.1115/IPACK2015-48554
View Paper titled, Fabrication of a Vapor Chamber on a Plastic Board
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Topics: Manufacturing, Vapors, Heat transfer, Cooling, Heat, Fluids, Water, Condensers (steam plant), Copper powders, Flat heat pipes
Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

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Prabjit Singh, Michael Ellsworth
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48154
https://doi.org/10.1115/IPACK2015-48154
View Paper titled, Measuring Moisture Leakage Out of Water Cooling Hardware
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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors
Proceedings Papers

Passive Thermosyphon Cooling System for High Heat Flux Servers

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Sylwia Szczukiewicz, Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome, Peter J. Beucher
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48288
https://doi.org/10.1115/IPACK2015-48288
View Paper titled, Passive Thermosyphon Cooling System for High Heat Flux Servers
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Topics: Cooling systems, Heat flux, Cooling, Critical heat flux, Design, Condensers (steam plant), Fluids, Heat, Heat exchangers, Pipeline risers
Proceedings Papers

A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet

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Muhammad Ikhlaq, Baris Dogruoz, Omidreza Ghaffari, Mehmet Arik
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48094
https://doi.org/10.1115/IPACK2015-48094
View Paper titled, A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet
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Topics: Heat transfer, Momentum, Nozzles, Boundary-value problems, Flow (Dynamics), Temperature, Computational fluid dynamics, Cooling, Diaphragms (Mechanical devices), Diaphragms (Structural)
Proceedings Papers

Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

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Michael J. Ellsworth, Jr., Levi A. Campbell
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48324
https://doi.org/10.1115/IPACK2015-48324
View Paper titled, Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness
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Topics: Cooling, Thermal resistance, Heat sinks, Density, Flow (Dynamics), Fluids, Heat exchangers, Pressure, Specific heat, Water