1-20 of 52
Thermal Management - System Level Thermal Management
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

System Level Transient Thermal Performance of High-Power Dynamic Microelectronics

Victor Chiriac
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Paper No: InterPACK2009-89110
DOI: https://doi.org/10.1115/InterPACK2009-89110
View Paper titled, System Level Transient Thermal Performance of High-Power Dynamic Microelectronics
Click here to open pdf in another window PDF for System Level Transient Thermal Performance of High-Power Dynamic Microelectronics
Topics: Computer simulation, Microelectronic devices, Motors, Transients (Dynamics)
Proceedings Papers

Cooling of Data Centers Using Airside Economizers

Saket Karajgikar, Veerendra Mulay, Dereje Agonafer, Roger Schmidt
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1001-1007, July 19–23, 2009
Paper No: InterPACK2009-89356
DOI: https://doi.org/10.1115/InterPACK2009-89356
View Paper titled, Cooling of Data Centers Using Airside Economizers
Click here to open pdf in another window PDF for Cooling of Data Centers Using Airside Economizers
Topics: Cooling, Data centers, Energy consumption, Air conditioners, Computer simulation, Computers, Electronic components, Environmental Protection Agency, Failure, Heat
Proceedings Papers

Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines

Roger Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 851-862, July 19–23, 2009
Paper No: InterPACK2009-89212
DOI: https://doi.org/10.1115/InterPACK2009-89212
View Paper titled, Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines
Click here to open pdf in another window PDF for Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines
Topics: Doors, Heat exchangers, Server racks, Water
Proceedings Papers

The Environmental Footprint of Data Centers

Amip Shah, Cullen Bash, Ratnesh Sharma, Tom Christian, Brian J. Watson, Chandrakant Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 653-662, July 19–23, 2009
Paper No: InterPACK2009-89036
DOI: https://doi.org/10.1115/InterPACK2009-89036
View Paper titled, The Environmental Footprint of Data Centers
Click here to open pdf in another window PDF for The Environmental Footprint of Data Centers
Topics: Data centers, Energy consumption, Energy efficiency, Cycles, Governments, Sustainability
Proceedings Papers

Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics

Victor Adrian Chiriac
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 769-776, July 19–23, 2009
Paper No: InterPACK2009-89111
DOI: https://doi.org/10.1115/InterPACK2009-89111
View Paper titled, Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics
Click here to open pdf in another window PDF for Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics
Topics: Cooling, Fans, Heat pipes, Heat sinks, Microelectronic devices
Proceedings Papers

Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center

Michael K. Patterson, Don Atwood, John G. Miner
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1009-1014, July 19–23, 2009
Paper No: InterPACK2009-89358
DOI: https://doi.org/10.1115/InterPACK2009-89358
View Paper titled, Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center
Click here to open pdf in another window PDF for Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center
Topics: Data centers, Cooling, Cooling systems, Energy consumption, Temperature control, Air conditioning, Design, Doors, Engineers, Heating
Proceedings Papers

IBM’s POWER6 High Performance Water Cooled Cluster at NCAR: Infrastructure Design

Roger Schmidt, Mike Ellsworth, Madhu Iyengar, Gary New
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 863-873, July 19–23, 2009
Paper No: InterPACK2009-89213
DOI: https://doi.org/10.1115/InterPACK2009-89213
View Paper titled, IBM’s POWER6 High Performance Water Cooled Cluster at NCAR: Infrastructure Design
Click here to open pdf in another window PDF for IBM’s POWER6 High Performance Water Cooled Cluster at NCAR: Infrastructure Design
Topics: Design, Doors, Water
Proceedings Papers

Designing Environmentally Sustainable Computer Systems Using Networks of Exergo-Thermo-Volume Building Blocks

Amip Shah, Chandrakant D. Patel, Cullen Bash
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 663-671, July 19–23, 2009
Paper No: InterPACK2009-89037
DOI: https://doi.org/10.1115/InterPACK2009-89037
View Paper titled, Designing Environmentally Sustainable Computer Systems Using Networks of Exergo-Thermo-Volume Building Blocks
Click here to open pdf in another window PDF for Designing Environmentally Sustainable Computer Systems Using Networks of Exergo-Thermo-Volume Building Blocks
Topics: Blocks (Building materials), Computers, Design, Sustainability, Heat, Cooling, Linkages, Boundary-value problems, Green design, Life cycle assessment
Proceedings Papers

Autonomous Detection of Thermal Anomalies in Data Centers

Manish Marwah, Ratnesh K. Sharma, Wilfredo Lugo
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 777-783, July 19–23, 2009
Paper No: InterPACK2009-89140
DOI: https://doi.org/10.1115/InterPACK2009-89140
View Paper titled, Autonomous Detection of Thermal Anomalies in Data Centers
Click here to open pdf in another window PDF for Autonomous Detection of Thermal Anomalies in Data Centers
Topics: Data centers, Cooling, Sensors, Temperature, Temperature sensors, Actuators, Air conditioning, Computers, Cooling towers, Energy consumption
Proceedings Papers

Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls

Michael K. Patterson, Michael Meakins, Dennis Nasont, Prasad Pusuluri, William Tschudi, Geoffrey C. Bell, Roger Schmidt, Ken Schneebeli, Tom Brey, Monty McGraw, Wade Vinson, Jason Gloeckner
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1015-1020, July 19–23, 2009
Paper No: InterPACK2009-89359
DOI: https://doi.org/10.1115/InterPACK2009-89359
View Paper titled, Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls
Click here to open pdf in another window PDF for Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls
Topics: Energy efficiency, Technology management, Cooling systems, Data centers, Temperature, Temperature sensors, Air flow, Control systems, Cooling, Design
Proceedings Papers

Thermal Policies and Active Workload Migration Within Data Centers

Cullen Bash, Chris Hyser, Christopher Hoover
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 673-679, July 19–23, 2009
Paper No: InterPACK2009-89038
DOI: https://doi.org/10.1115/InterPACK2009-89038
View Paper titled, Thermal Policies and Active Workload Migration Within Data Centers
Click here to open pdf in another window PDF for Thermal Policies and Active Workload Migration Within Data Centers
Topics: Data centers, Energy consumption, Heat capacity, Specific heat, Cooling, Emissions, Energy generation, Machinery
Proceedings Papers

Energy-Efficient Air Cooling of Data Centers at 2000 W/ft 2

Magnus K. Herrlin, Michael K. Patterson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 875-880, July 19–23, 2009
Paper No: InterPACK2009-89224
DOI: https://doi.org/10.1115/InterPACK2009-89224
View Paper titled, Energy-Efficient Air Cooling of Data Centers at 2000 W/ft 2
Click here to open pdf in another window PDF for Energy-Efficient Air Cooling of Data Centers at 2000 W/ft 2
Topics: Cooling, Data centers, Air flow, Density, Design, Heat, Computational fluid dynamics, Cooling systems, Energy efficiency, Control systems
Proceedings Papers

A Flow-Network Model for Predicting Rack Cooling in Containment Systems

Saurabh K. Shrivastava, James W. VanGilder
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 785-791, July 19–23, 2009
Paper No: InterPACK2009-89161
DOI: https://doi.org/10.1115/InterPACK2009-89161
View Paper titled, A Flow-Network Model for Predicting Rack Cooling in Containment Systems
Click here to open pdf in another window PDF for A Flow-Network Model for Predicting Rack Cooling in Containment Systems
Topics: Containment systems, Cooling, Flow (Dynamics), Air flow, Computational fluid dynamics, Containment, Cooling systems, Data centers, Dimensions, Heat
Proceedings Papers

Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control

Su-Heon Jeong, Wataru Nakayama, Sun-Kyu Lee
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1021-1024, July 19–23, 2009
Paper No: InterPACK2009-89368
DOI: https://doi.org/10.1115/InterPACK2009-89368
View Paper titled, Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control
Click here to open pdf in another window PDF for Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control
Topics: Columns (Structural), Heat, Switches, Thermal resistance, Electronic packages, Temperature, Flow (Dynamics), Geometry, Plates (structures), Reservoirs
Proceedings Papers

Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets

Nobuyuki Isoshima, Masatoshi Watanabe, Mika Ri, Yutaka Yamada, Koichi Sugimoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 681-692, July 19–23, 2009
Paper No: InterPACK2009-89041
DOI: https://doi.org/10.1115/InterPACK2009-89041
View Paper titled, Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets
Click here to open pdf in another window PDF for Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets
Topics: Cooling, Noise (Sound), Plasmas (Ionized gases), Fans, Flow (Dynamics), Low temperature, Computational fluid dynamics, Heat transfer, Lumber, Natural convection
Proceedings Papers

Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction

Nihad Dukhan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 881-886, July 19–23, 2009
Paper No: InterPACK2009-89231
DOI: https://doi.org/10.1115/InterPACK2009-89231
View Paper titled, Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction
Click here to open pdf in another window PDF for Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction
Topics: Convection, Flow (Dynamics), Fluids, Heat conduction, Porous materials, Electrical conductivity, Heat, Thermal conductivity, Cooling, Design
Proceedings Papers

A Real-Time Data Center Airflow and Energy Assessment Tool

Xuanhang Simon Zhang, James W. VanGilder, Christopher M. Healey
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 793-798, July 19–23, 2009
Paper No: InterPACK2009-89175
DOI: https://doi.org/10.1115/InterPACK2009-89175
View Paper titled, A Real-Time Data Center Airflow and Energy Assessment Tool
Click here to open pdf in another window PDF for A Real-Time Data Center Airflow and Energy Assessment Tool
Topics: Air flow, Data centers, Energy assessment, Temperature, Stress, Computer software, Cooling, Energy consumption, Energy management, Plant layout
Proceedings Papers

Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment

Lang Yuan, Jignesh Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1025-1032, July 19–23, 2009
Paper No: InterPACK2009-89377
DOI: https://doi.org/10.1115/InterPACK2009-89377
View Paper titled, Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment
Click here to open pdf in another window PDF for Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment
Topics: Acoustics, Air filters, Design, Fibers, Noise (Sound), Telecommunications, Thermal management
Proceedings Papers

Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics

Matt Yaquinto, Richard Wirtz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 887-896, July 19–23, 2009
Paper No: InterPACK2009-89237
DOI: https://doi.org/10.1115/InterPACK2009-89237
View Paper titled, Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics
Click here to open pdf in another window PDF for Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics
Topics: Cooling, Electronics, Phase transition temperature, Power density, Thermal energy storage, Storage, Flat heat pipes, Phase change materials, Skin, Temperature
Proceedings Papers

A Computational Study of the Thermal Performance of a 69kV/3000A Solid State Current Limiter Under Transient Fault Current Loading

Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 693-699, July 19–23, 2009
Paper No: InterPACK2009-89071
DOI: https://doi.org/10.1115/InterPACK2009-89071
View Paper titled, A Computational Study of the Thermal Performance of a 69kV/3000A Solid State Current Limiter Under Transient Fault Current Loading
Click here to open pdf in another window PDF for A Computational Study of the Thermal Performance of a 69kV/3000A Solid State Current Limiter Under Transient Fault Current Loading
Topics: Transients (Dynamics), Inductors, Cooling, Forced convection, Operating temperature, Steady state, Temperature, Waste heat