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Proceedings Papers

Experimental Study on Applied Thin Vapor Chamber and Embedded Heat Pipe Heat Sinks

Garrett A. Glover, Yongguo Chen, Annie Luo, Herman Chu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 821-829, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89191
https://doi.org/10.1115/InterPACK2009-89191
View Paper titled, Experimental Study on Applied Thin Vapor Chamber and Embedded Heat Pipe Heat Sinks
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Topics: Heat pipes, Heat sinks, Vapors, Computer cooling, Aluminum, Copper, Cycles, Flow (Dynamics), Fluids, Heat
Proceedings Papers

Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers

Takeshi Tsukamoto, Jyunji Takayoshi, Roger R. Schmidt, Madhusudan K. Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 915-921, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89258
https://doi.org/10.1115/InterPACK2009-89258
View Paper titled, Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers
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Topics: Cooling, Data centers, Heat exchangers, Refrigeration, Server racks, Refrigerants, Water, Compression, Construction, Coolants
Proceedings Papers

Optimal Fan Speed Control for Thermal Management of Servers

Zhikui Wang, Cullen Bash, Niraj Tolia, Manish Marwah, Xiaoyun Zhu, Parthasarathy Ranganathan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 709-719, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89074
https://doi.org/10.1115/InterPACK2009-89074
View Paper titled, Optimal Fan Speed Control for Thermal Management of Servers
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Topics: Air flow, Architecture, Control equipment, Cooling, Data centers, Energy consumption, Fans, Feedback, Temperature, Thermal management
Proceedings Papers

Co-Generation: Grid Independent Power and Cooling for a Data Center

Roger Schmidt, Madhusudan Iyengar, James Steffes, Vijay Lund
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1063-1075, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89411
https://doi.org/10.1115/InterPACK2009-89411
View Paper titled, Co-Generation: Grid Independent Power and Cooling for a Data Center
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Topics: Combined heat and power, Cooling, Data centers, Pressure, Reliability
Proceedings Papers

A New Methodology for Cold Plate and Heat Sink Optimization

Jeremy Rice, Monem Alyaser
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 831-840, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89197
https://doi.org/10.1115/InterPACK2009-89197
View Paper titled, A New Methodology for Cold Plate and Heat Sink Optimization
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Topics: Heat sinks, Optimization, Computational fluid dynamics, Anisotropy, Convection, Fins, Fluids, Heat conduction, Heat transfer, Prandtl number
Proceedings Papers

Advanced Integrated Cooling Systems for Thermal Management in Data Centers

Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 619-624, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89009
https://doi.org/10.1115/InterPACK2009-89009
View Paper titled, Advanced Integrated Cooling Systems for Thermal Management in Data Centers
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Topics: Cooling systems, Data centers, Thermal management, Server racks, Heat pipes, Cables, Fluids, Heat exchangers, Heat sinks, Nanofluids
Proceedings Papers

Unified Thermal and Power Management in Server Enclosures

Niraj Tolia, Zhikui Wang, Parthasarathy Ranganathan, Cullen Bash, Manish Marwah, Xiaoyun Zhu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 721-730, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89075
https://doi.org/10.1115/InterPACK2009-89075
View Paper titled, Unified Thermal and Power Management in Server Enclosures
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Topics: Control equipment, Cooling, Data centers, Design, Energy consumption, Energy efficiency, Fans, Feedback, Heat transfer
Proceedings Papers

System Level Thermal Design Challenges in Validation Platforms

Rahima K. Mohammed, Ridvan A. Sahan, Ying-Feng Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1077-1086, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89412
https://doi.org/10.1115/InterPACK2009-89412
View Paper titled, System Level Thermal Design Challenges in Validation Platforms
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Topics: Design, Cooling, Engineering simulation, Simulation, Computational fluid dynamics, Semiconductor industry, Silicon, Acoustics, Cables, Heating
Proceedings Papers

Integrating an Electronics Component Database Into a Thermal Design Tool

Patrick Loney
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 731-740, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89080
https://doi.org/10.1115/InterPACK2009-89080
View Paper titled, Integrating an Electronics Component Database Into a Thermal Design Tool
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Topics: Databases, Design, Electronics, Engineers, Junctions, Lumber, Temperature, Computer software, Cooling, Electrical conductivity
Proceedings Papers

Thermoelectric Assisted Adsorption Cooling Systems for Harsh Environment Electronics: Issues With Heat Regeneration

Ashish Sinha, Yogendra Joshi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 625-633, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89021
https://doi.org/10.1115/InterPACK2009-89021
View Paper titled, Thermoelectric Assisted Adsorption Cooling Systems for Harsh Environment Electronics: Issues With Heat Regeneration
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Topics: Cooling systems, Electronics, Heat, Temperature, Desorption, Cooling, Heat pumps, Heat recovery, High temperature
Proceedings Papers

Numerical Simulations for Digitized Heat Transfer

Eric Baird, Kamran Mohseni
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 923-931, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89264
https://doi.org/10.1115/InterPACK2009-89264
View Paper titled, Numerical Simulations for Digitized Heat Transfer
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Topics: Computer simulation, Heat transfer, Alloys, Electronics, Fluids, Heat, Heat flux, Heat sinks, Liquid metals, Microelectromechanical systems
Proceedings Papers

Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits

Srujan Gondipalli, Bahgat Sammakia, Siddarth Bhopte, Roger Schmidt, Madhusudan K. Iyengar, Bruce Murray
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 841-850, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89203
https://doi.org/10.1115/InterPACK2009-89203
View Paper titled, Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits
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Topics: Data centers, Doors, Optimization, Roofs, Temperature, Air flow, Ceilings, Heat, Computers, Coolers
Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89092
https://doi.org/10.1115/InterPACK2009-89092
View Paper titled, Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization
Proceedings Papers

Integrated Design and Management of a Sustainable Data Center

Brian J. Watson, Amip J. Shah, Manish Marwah, Cullen E. Bash, Ratnesh K. Sharma, Christopher E. Hoover, Tom W. Christian, Chandrakant D. Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 635-644, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89032
https://doi.org/10.1115/InterPACK2009-89032
View Paper titled, Integrated Design and Management of a Sustainable Data Center
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Topics: Data centers, Design, Sustainability, Blocks (Building materials), Collaboration, Visualization
Proceedings Papers

Numerical Analysis of Mist-Cooled High Power Components in Cabinets

Niru Kumari, Vaibhav Bahadur, Marc Hodes, Todd Salamon, Alan Lyons, Paul Kolodner, Suresh V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 933-944, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89269
https://doi.org/10.1115/InterPACK2009-89269
View Paper titled, Numerical Analysis of Mist-Cooled High Power Components in Cabinets
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Topics: Numerical analysis, Flow (Dynamics), Heat sinks, Drops, Evaporation, Telecommunications, Thermal management, Acoustics, Circuits, Cooling
Proceedings Papers

Effects of Enhanced Surface Inclination on Pool Boiling of a Dielectric Fluid

Liang-Han Chien, Shu-Che Lee
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 753-760, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89101
https://doi.org/10.1115/InterPACK2009-89101
View Paper titled, Effects of Enhanced Surface Inclination on Pool Boiling of a Dielectric Fluid
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Topics: Boiling, Fluids, Heat flux, Nucleate boiling, Nucleation (Physics), Pool boiling
Proceedings Papers

Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer

Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 945-951, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89294
https://doi.org/10.1115/InterPACK2009-89294
View Paper titled, Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer
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Topics: Cooling systems, Design, Heat, Stress, Control systems, Forced convection, Mineral oil, Natural convection, Power grids, Renewable energy
Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 953-961, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89306
https://doi.org/10.1115/InterPACK2009-89306
View Paper titled, Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell
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Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Flow (Dynamics), Temperature, Compacting, Cooling, Design, Heat transfer
Proceedings Papers

Analysis for Single Board Computer Module Cooling Under Natural Air Convection Condition

Jiahui Zhang, Dave Weber, Jason Waggel, Tony Pollice, Marco Matuonto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 963-972, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89310
https://doi.org/10.1115/InterPACK2009-89310
View Paper titled, Analysis for Single Board Computer Module Cooling Under Natural Air Convection Condition
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Topics: Computers, Convection, Cooling, Heat conduction, Heat sinks, Natural convection, Optimization
Proceedings Papers

Local Cooling Control of Data Centers With Adaptive Vent Tiles

Monem H. Beitelmal, Zhikui Wang, Carlos Felix, Cullen Bash, Christopher Hoover, Alan McReynolds
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 645-652, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89035
https://doi.org/10.1115/InterPACK2009-89035
View Paper titled, Local Cooling Control of Data Centers With Adaptive Vent Tiles
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Topics: Cooling, Data centers, Tiles, Vents, Control equipment, Air flow, Algorithms, Design, Dynamic models, Errors