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Servers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions to InterPACK, the EPP Division, and Leadership in Liquid Cooling of Server Systems
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Proceedings Papers

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L., Huanyu Liao, Ganesh Subbarayan
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6501
https://doi.org/10.1115/IPACK2019-6501
View Paper titled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
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Topics: Algorithms, Particulate matter, Packing (Shipments), Packings (Cushioning), Nonlinear programming, Optimization algorithms, Simulation, Computer programming, Gradient methods, Heat
Proceedings Papers

Computational Form Factor Study of a 3 rd Generation Open Compute Server for Single-Phase Immersion Cooling

Jimil M. Shah, Chinmay Bhatt, Pranavi Rachamreddy, Ravya Dandamudi, Satyam Saini, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6602
https://doi.org/10.1115/IPACK2019-6602
View Paper titled, Computational Form Factor Study of a 3 rd Generation Open Compute Server for Single-Phase Immersion Cooling
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Topics: Cooling
Proceedings Papers

Optimal Design and Modeling of Server Cabinets With In-Row Coolers and Air Conditioning Units in a Modular Data Center

Uschas Chowdhury, Walter Hendrix, Thomas Craft, Willis James, Ankit Sutaria, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6522
https://doi.org/10.1115/IPACK2019-6522
View Paper titled, Optimal Design and Modeling of Server Cabinets With In-Row Coolers and Air Conditioning Units in a Modular Data Center
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Topics: Air conditioning, Containment, Coolers, Data centers, Design, Modeling
Proceedings Papers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6530
https://doi.org/10.1115/IPACK2019-6530
View Paper titled, Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink
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Topics: Cooling, Heat sinks, Maintainability, Thermal management, Data centers, Heat pipes, Air flow, Boundary-value problems, Computers, Design
Proceedings Papers

Dynamic Control of Airflow Balance in Data Centers

Stephen Paul Linder, Jim Van Gilder, Yan Zhang, Enda Barrett
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6304
https://doi.org/10.1115/IPACK2019-6304
View Paper titled, Dynamic Control of Airflow Balance in Data Centers
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Topics: Air flow, Containment, Data centers, Flow (Dynamics)
Proceedings Papers

Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages

Shrinath Ramdas, Pavan Rajmane, Tushar Chauhan, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6568
https://doi.org/10.1115/IPACK2019-6568
View Paper titled, Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages
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Topics: Cooling, Electronic packages, Printed circuit boards, Reliability, Thermomechanics
Proceedings Papers

Thermal Profiling of a Small Operational Data Center

İsmail Türkmen, Cem Ahmet Mercan, Hamza Salih Erden
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6309
https://doi.org/10.1115/IPACK2019-6309
View Paper titled, Thermal Profiling of a Small Operational Data Center
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Topics: Computational fluid dynamics, Data centers
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6585
https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Design of Passive Two-Phase Thermosyphons for Server Cooling

Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Filippo Cataldo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6386
https://doi.org/10.1115/IPACK2019-6386
View Paper titled, Design of Passive Two-Phase Thermosyphons for Server Cooling
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Topics: Cooling, Design, Energy consumption, Heat, Cooling systems, Artificial intelligence, Condensers (steam plant), Coolants, Databases, Electric vehicles
Proceedings Papers

Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling

Dhruvkumar Gandhi, Uschas Chowdhury, Tushar Chauhan, Pratik Bansode, Satyam Saini, Jimil M. Shah, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6587
https://doi.org/10.1115/IPACK2019-6587
View Paper titled, Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling
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Topics: Cooling, Fluids, Optimization
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6389
https://doi.org/10.1115/IPACK2019-6389
View Paper titled, Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
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Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Proceedings Papers

Investigation Regarding Transient Compact Thermal Model for Microprocessor Packages

Koji Nishi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6390
https://doi.org/10.1115/IPACK2019-6390
View Paper titled, Investigation Regarding Transient Compact Thermal Model for Microprocessor Packages
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Topics: Transients (Dynamics)
Proceedings Papers

Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling

Pravin A. Shinde, Pratik V. Bansode, Satyam Saini, Rajesh Kasukurthy, Tushar Chauhan, Jimil M. Shah, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6590
https://doi.org/10.1115/IPACK2019-6590
View Paper titled, Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling
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Topics: Cooling, Data centers, Experimental analysis, Optimization, Temperature
Proceedings Papers

Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6444
https://doi.org/10.1115/IPACK2019-6444
View Paper titled, Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922
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Topics: Cooling, Design, Design engineering, Thermal management, Water, Graphics processing units, Electronic components, Flow (Dynamics), Artificial intelligence, Data centers
Proceedings Papers

CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3 rd Generation Open Compute Server for Single-Phase Immersion Cooling

Jimil M. Shah, Ravya Dandamudi, Chinmay Bhatt, Pranavi Rachamreddy, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6600
https://doi.org/10.1115/IPACK2019-6600
View Paper titled, CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3 rd Generation Open Compute Server for Single-Phase Immersion Cooling
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Topics: Computational fluid dynamics, Cooling, Heat sinks, Optimization
Proceedings Papers

Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center

Jimil M. Shah, Roshan Anand, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Prabjit Singh, Mike Kaler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6601
https://doi.org/10.1115/IPACK2019-6601
View Paper titled, Development of a Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center
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Topics: Contamination, Data centers, Particulate matter
Proceedings Papers

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load

Sadegh Khalili, Srikanth Rangarajan, Bahgat Sammakia, Vadim Gektin
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6463
https://doi.org/10.1115/IPACK2019-6463
View Paper titled, An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load
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Topics: Cooling, Fluids, Stress, Transients (Dynamics)