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1-20 of 37
Reliability of Electronic and Photonic Systems
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Proceedings Papers
Indentation Induced Tin Whisker Formation on Tin Plated Component Leads
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1199-1205, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73233
Proceedings Papers
A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1207-1213, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73238
Proceedings Papers
Damage Path Simulation of Solder Joints in QFP
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1215-1221, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73297
Proceedings Papers
SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1223-1228, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73318
Proceedings Papers
A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1229-1235, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73331
Proceedings Papers
Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1237-1252, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73348
Proceedings Papers
Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures
Available to PurchaseM. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, M. Saiful Islam, Hongtao Ma, Chang Lin, Pradeep Lall, Roy Knight, Mark Strickland, Jim Blanche
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1253-1262, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73349
Proceedings Papers
Determination of the Anand Viscoplasticity Model Constants for SnAgCu
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1263-1270, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73352
Proceedings Papers
Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias
Available to PurchaseM. Reid, J. Punch, B. Rodgers, T. Galkin, T. Stenberg, O. Rusanenc, E. Elonen, M. Vile`n, K. Va¨keva¨inen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1271-1276, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73353
Proceedings Papers
Thermal Gradient in Solder Joints Under Electrical Current Stressing
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1277-1282, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73356
Proceedings Papers
A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1283-1291, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73366
Proceedings Papers
Reduce Vibration Analysis Errors With Precise Weight Predictions
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1075-1081, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73004
Proceedings Papers
Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1293-1298, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73367
Proceedings Papers
Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1083-1088, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73005
Proceedings Papers
Creep Behavior of Lead Free Solder Interconnects in Microelectronic Packages: Impression Creep Testing and Constitutive Modeling
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1299-1306, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73408
Proceedings Papers
Understanding and Testing for Drop Impact Failure
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1089-1094, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73047
Proceedings Papers
Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1095-1100, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73058
Proceedings Papers
Constitutive Modeling of Lead-Free Solders
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1307-1311, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73411
Proceedings Papers
Plastic Strain Based Criterion for Reliability Assessment of CSP Packages Subjected to Dynamic Shock Loads
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1101-1108, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73059
Proceedings Papers
Lead-Free and PbSn Bump Electromigration Testing
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1313-1321, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73417
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