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Proceedings Papers

Prediction of Microelectronic Substrate Warpage Using Homogenized Thermomechanical Finite Element Models

Parsaoran Hutapea, Joachim L. Grenestedt, Mitul Modi, Michael Mello, Kristopher Frutschy

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1141-1145, July 17–22, 2005

Paper No: IPACK2005-73122

DOI: https://doi.org/10.1115/IPACK2005-73122

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Topics: Finite element model, Thermomechanics, Warping, Adhesion, Copper, Curve fitting, Density, Fibers, Finite element analysis, Polymers

Proceedings Papers

Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines

Kazuhiko Sasagawa, Shigeo Uno, Nao Yamaji, Masumi Saka

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1147-1152, July 17–22, 2005

Paper No: IPACK2005-73133

DOI: https://doi.org/10.1115/IPACK2005-73133

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Topics: Current density, Damage, Electrodiffusion, Shapes, Metals, Computer simulation, Density, Evaluation methods, Reliability

Proceedings Papers

Adhesion Strength at High Temperatures Affected by Moisture for Die-Attach Materials of Integrated Circuit Packages

Hiroyuki Tanaka, Takashi Numata

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1153-1158, July 17–22, 2005

Paper No: IPACK2005-73139

DOI: https://doi.org/10.1115/IPACK2005-73139

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Topics: Adhesion, High temperature, Integrated circuits

Proceedings Papers

Study on the Dynamic Behavior of Repetitive Drop Test for Electronic Component and the Reliability

Qiang Yu, Tsuyoki Shibata, Keiji Watanabe, Toshihiro Tsurusawa, Masaki Shiratori, Takayoshi Katahira

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1159-1166, July 17–22, 2005

Paper No: IPACK2005-73146

DOI: https://doi.org/10.1115/IPACK2005-73146

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Topics: Electronic components, Fracture (Materials), Fracture (Process), Reliability, Solder joints

Proceedings Papers

Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

Toru Ikeda, Won-Keun Kim, Noriyuki Miyazaki

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1167-1175, July 17–22, 2005

Paper No: IPACK2005-73153

DOI: https://doi.org/10.1115/IPACK2005-73153

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Topics: Bonding, Delamination, Flip-chip packages, Reflow soldering, Flip-chip, Flip-chip devices, Reliability, Fracture (Materials), Solder joints, Stress

Proceedings Papers

Micro-Via Reliability Study of High-Density Substrate

Youhong Wu

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1177-1180, July 17–22, 2005

Paper No: IPACK2005-73156

DOI: https://doi.org/10.1115/IPACK2005-73156

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Topics: Density, Reliability

Proceedings Papers

Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis

Takahiro Nagata, Takaya Kobayashi

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1181-1186, July 17–22, 2005

Paper No: IPACK2005-73162

DOI: https://doi.org/10.1115/IPACK2005-73162

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Topics: Equilibrium (Physics), Finite element analysis, Solders, Stability, Drops, Surface tension, Constitutive equations, Deformation, Fluids, Creep

Proceedings Papers

Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage

Saket Karajgikar, Wonkee Ahn, Dereje Agonafer

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1187-1192, July 17–22, 2005

Paper No: IPACK2005-73184

DOI: https://doi.org/10.1115/IPACK2005-73184

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Topics: Manufacturing, Printed circuit boards, Warping

Proceedings Papers

Using High Speed Camera for Electronic Board Failure Analysis

Wade Hezeltine, Frank Z. Liang

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1193-1198, July 17–22, 2005

Paper No: IPACK2005-73223

DOI: https://doi.org/10.1115/IPACK2005-73223

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Topics: Failure analysis, Design, Failure, Corrective actions, Cross section (Physics), Cycles, Microscopy, Modeling, Product design, Teams

Proceedings Papers

Indentation Induced Tin Whisker Formation on Tin Plated Component Leads

Jin Liang, Xiaodong Li, Zhi-Hui Xu, Dongkai Shangguan

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1199-1205, July 17–22, 2005

Paper No: IPACK2005-73233

DOI: https://doi.org/10.1115/IPACK2005-73233

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Topics: Coating processes, Coatings, Deformation, Elastic moduli, Finishes, Finite element analysis, Nanoindentation, Nucleation (Physics), Plating, Reliability

Proceedings Papers

A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination

Guojun Hu, Andrew A. O. Tay

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1207-1213, July 17–22, 2005

Paper No: IPACK2005-73238

DOI: https://doi.org/10.1115/IPACK2005-73238

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Topics: Delamination, Displacement, Fracture (Materials), Reflow soldering, Vapor pressure, Density, Diffusion (Physics), Lead-free solders, Solders, Stress

Proceedings Papers

Damage Path Simulation of Solder Joints in QFP

Minoru Mukai, Kenji Hirohata, Hiroyuki Takahashi, Takashi Kawakami, Kuniaki Takahashi

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1215-1221, July 17–22, 2005

Paper No: IPACK2005-73297

DOI: https://doi.org/10.1115/IPACK2005-73297

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Topics: Damage, Simulation, Solder joints, Crack propagation, Electronic packages, Solders, Design, Fatigue cracks, Fracture (Materials), Cycles

Proceedings Papers

SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method

Claire Ryan, Bryan A. Rodgers, Jeff M. Punch

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1223-1228, July 17–22, 2005

Paper No: IPACK2005-73318

DOI: https://doi.org/10.1115/IPACK2005-73318

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Topics: Ball-Grid-Array packaging, Fatigue testing, Solder joints, Torsion, Cycles, Failure, Solders, Chain, Copper, Electronic equipment

Proceedings Papers

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

Hisashi Tanie, Takeshi Terasaki, Yasuhiro Naka

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1229-1235, July 17–22, 2005

Paper No: IPACK2005-73331

DOI: https://doi.org/10.1115/IPACK2005-73331

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Topics: Fatigue life, Semiconductors (Materials), Solders, Crack propagation, Fracture (Materials), Ball-Grid-Array packaging, Solder joints, Surface mount devices, Diluents, Damage

Proceedings Papers

Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1237-1252, July 17–22, 2005

Paper No: IPACK2005-73348

DOI: https://doi.org/10.1115/IPACK2005-73348

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Topics: Delamination, Flip-chip assemblies, Stress, Flip-chip, Flip-chip devices, Sensors, Silicon, Cycles, Manufacturing, Solder joints

Proceedings Papers

Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, M. Saiful Islam, Hongtao Ma, Chang Lin, Pradeep Lall, Roy Knight, Mark Strickland, Jim Blanche

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1253-1262, July 17–22, 2005

Paper No: IPACK2005-73349

DOI: https://doi.org/10.1115/IPACK2005-73349

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Topics: Electronic packaging, Flip-chip, Flip-chip devices, Low temperature, Stress, Temperature, Finite element model, Flip-chip assemblies, Modeling, Packaging

Proceedings Papers

Determination of the Anand Viscoplasticity Model Constants for SnAgCu

Bryan Rodgers, Ben Flood, Jeff Punch, Finbarr Waldron

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1263-1270, July 17–22, 2005

Paper No: IPACK2005-73352

DOI: https://doi.org/10.1115/IPACK2005-73352

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Topics: Alloys, ASTM International, Ball-Grid-Array packaging, Bone, Computer software, Constitutive equations, Displacement, Fatigue life, Finite element model, Fittings

Proceedings Papers

Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias

M. Reid, J. Punch, B. Rodgers, T. Galkin, T. Stenberg, O. Rusanenc, E. Elonen, M. Vile`n, K. Va¨keva¨inen

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1271-1276, July 17–22, 2005

Paper No: IPACK2005-73353

DOI: https://doi.org/10.1115/IPACK2005-73353

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Topics: Printed circuit boards, Steady state, Temperature, Failure, Condensation, Density, Electronic packaging, High temperature, Microelectronic packaging, Optical microscopy

Proceedings Papers

Thermal Gradient in Solder Joints Under Electrical Current Stressing

Da-Jeng Yao, Chung-Yi Hsu, Chih Chen, Sheng-Hsiang Chiu

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1277-1282, July 17–22, 2005

Paper No: IPACK2005-73356

DOI: https://doi.org/10.1115/IPACK2005-73356

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Topics: Electric current, Solder joints, Temperature gradient, Temperature, Current density, Solders, Computer software, Errors, Finite element analysis, Heating

Proceedings Papers

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

Greg Heaslip, Jeff Punch, Bryan Rogers, Claire Ryan, Michael Reid

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1283-1291, July 17–22, 2005

Paper No: IPACK2005-73366

DOI: https://doi.org/10.1115/IPACK2005-73366

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Topics: Ball-Grid-Array packaging, Failure, Failure analysis, Lead-free solders, Solders, Stress, Testing, Data acquisition systems, Design, Electronic components

NARROW

Prediction of Microelectronic Substrate Warpage Using Homogenized Thermomechanical Finite Element Models

Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines

Adhesion Strength at High Temperatures Affected by Moisture for Die-Attach Materials of Integrated Circuit Packages

Study on the Dynamic Behavior of Repetitive Drop Test for Electronic Component and the Reliability

Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

Micro-Via Reliability Study of High-Density Substrate

Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis

Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage

Using High Speed Camera for Electronic Board Failure Analysis

Indentation Induced Tin Whisker Formation on Tin Plated Component Leads

A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination

Damage Path Simulation of Solder Joints in QFP

SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies

Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures

Determination of the Anand Viscoplasticity Model Constants for SnAgCu

Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias

Thermal Gradient in Solder Joints Under Electrical Current Stressing

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

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