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Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

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Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89155
https://doi.org/10.1115/InterPACK2009-89155
View Paper titled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
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Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography
Proceedings Papers

Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder

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Kok Ee Tan, John H. L. Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 841-847, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89278
https://doi.org/10.1115/InterPACK2009-89278
View Paper titled, Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder
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Topics: Lead-free solders, Solders, Yield stress, Stress-strain curves, Bone, Constitutive equations, Deformation, Elastic moduli, Finite element analysis, Mechanical properties
Proceedings Papers

Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

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Masanori Yamagiwa, Masato Fujita, Qiang Yu, Hiromi Sugihara
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 849-855, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89284
https://doi.org/10.1115/InterPACK2009-89284
View Paper titled, Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer
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Topics: Reliability, Shear (Mechanics), Temperature, Finite element analysis, Cycles, Displacement, Fatigue, Gallium nitride, Stress, Circuits
Proceedings Papers

Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

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Tiao Zhou, Robert Derk, Kaysar Rahim, Xuejun Fan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 693-701, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89018
https://doi.org/10.1115/InterPACK2009-89018
View Paper titled, Larger Array Fine Pitch Wafer Level Package Drop Test Reliability
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Topics: Reliability, Semiconductor wafers, Fracture (Materials), Corners (Structural elements), Failure, Alloys, Failure mechanisms, Finite element analysis, Solder joints, Solders
Proceedings Papers

Pb-Free Thin Small Outline Package (TSOP) Board Level Reliability Study

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Weidong Xie, Kuo-Chuan Liu, Mark Brillhart
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 775-780, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89183
https://doi.org/10.1115/InterPACK2009-89183
View Paper titled, Pb-Free Thin Small Outline Package (TSOP) Board Level Reliability Study
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Topics: Reliability, Lead-free solders, Solders, Ball-Grid-Array packaging, Finite element analysis, Solder joints, Stress, Testing, Cycles, Failure
Proceedings Papers

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

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Pradeep Lall, Prashant Gupta, Arjun Angral, Jeff Suhling
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 857-871, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89298
https://doi.org/10.1115/InterPACK2009-89298
View Paper titled, Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration
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Topics: Electronics, Shock (Mechanics), Vibration, Failure, Damage, Solders, Principal component analysis, Failure mechanisms, Fracture (Process), Alloys
Proceedings Papers

Solder Joint Electromigration Mechanisms

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Pilin Liu, Fan-yi Ouyang, Shenquan Ou, Zezhong Fu, Goyal Deepak
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 703-709, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89023
https://doi.org/10.1115/InterPACK2009-89023
View Paper titled, Solder Joint Electromigration Mechanisms
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Topics: Electrodiffusion, Solder joints, Nucleation (Physics), Failure mechanisms, Warping
Proceedings Papers

Virtual Qualification Using Field Life Temperature Data

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Patrick McCluskey, Peter Hansen, Christian Lenakakis, Wolfgang Wondrak
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 781-787, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89184
https://doi.org/10.1115/InterPACK2009-89184
View Paper titled, Virtual Qualification Using Field Life Temperature Data
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Topics: Temperature, Automotive engines, Cycles, Engines, Failure, Physics, Testing
Proceedings Papers

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

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Pradeep Lall, Rahul Vaidya, Vikrant More, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 873-885, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89299
https://doi.org/10.1115/InterPACK2009-89299
View Paper titled, Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments
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Topics: Damage, Electronics, Service life (Equipment), Thermomechanics, Algorithms, Alloys, Circuits, Condition monitoring, Delamination, Fracture (Materials)
Proceedings Papers

Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

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Guoyun Tian, Chang Lin, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89209
https://doi.org/10.1115/InterPACK2009-89209
View Paper titled, Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies
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Topics: Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Mechanical behavior, Reliability, Stress-strain curves
Proceedings Papers

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

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Pradeep Lall, Sandeep Shantaram, Arjun Angral, Mandar Kulkarni, Jeff Suhling
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 887-901, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89307
https://doi.org/10.1115/InterPACK2009-89307
View Paper titled, Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact
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Topics: Damage, Electronics, Shock (Mechanics), Alloys, Failure mechanisms, Solders, Transients (Dynamics), Failure, Finite element analysis, Reliability
Proceedings Papers

Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS

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Leila J. Ladani
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 711-715, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89083
https://doi.org/10.1115/InterPACK2009-89083
View Paper titled, Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS
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Topics: Design, Stress, Thermomechanics, Copper, Finite element analysis, Stiffness, Density, Diffusion (Physics), Finite element model, Integrated circuits
Proceedings Papers

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

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Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 797-802, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89232
https://doi.org/10.1115/InterPACK2009-89232
View Paper titled, Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package
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Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Solders, Crack propagation, Shapes, Finite element analysis, Particulate matter, Stiffness, Deformation
Proceedings Papers

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

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Hideo Koguchi, Masato Nakajima
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 717-727, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89091
https://doi.org/10.1115/InterPACK2009-89091
View Paper titled, Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints
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Topics: Bonding, Resins, Silicon, Stress, Thermal stresses, Boundary element methods, Delamination, Materials properties, Stress concentration, Cooling
Proceedings Papers

Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads

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Pradeep Lall, Ryan Lowe, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 903-914, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89308
https://doi.org/10.1115/InterPACK2009-89308
View Paper titled, Leading-Indicators Based on Impedance Spectroscopy for Prognostication of Electronics Under Shock and Vibration Loads
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Topics: Electrochemical impedance spectroscopy, Electronics, Shock (Mechanics), Stress, Vibration, Damage, Spectroscopy, Failure, Solders, Condition monitoring
Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

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Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89098
https://doi.org/10.1115/InterPACK2009-89098
View Paper titled, Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints
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Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis
Proceedings Papers

Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages

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Karl J. L. Geisler
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 915-920, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89312
https://doi.org/10.1115/InterPACK2009-89312
View Paper titled, Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages
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Topics: Coatings, Fatigue, Solders, Fatigue life, Failure, Failure data, Shapes, Solder joints, Temperature, Urethane elastomers
Proceedings Papers

Life Prediction of SAC305 Interconnects Under Temperature Cycling Conditions Using an Arbitrary Loading Fatigue Model

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Dominik Herkommer, Jeff Punch, Michael Reid
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 737-742, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89105
https://doi.org/10.1115/InterPACK2009-89105
View Paper titled, Life Prediction of SAC305 Interconnects Under Temperature Cycling Conditions Using an Arbitrary Loading Fatigue Model
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Topics: Ball-Grid-Array packaging, Failure, Fatigue, Finite element analysis, Modeling, Solders, Temperature, Testing
Proceedings Papers

Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test

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C. H. Chen, W. L. Tsai, C. Y. Tang, M. Y. Tsai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 921-927, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89337
https://doi.org/10.1115/InterPACK2009-89337
View Paper titled, Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test
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Topics: Junctions, Reliability, Temperature, Thermal resistance
Proceedings Papers

Localized High-Resolution Stress Measurements on MEMS Structures

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Dietmar Vogel, Astrid Gollhardt, Bernd Michel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 743-747, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89106
https://doi.org/10.1115/InterPACK2009-89106
View Paper titled, Localized High-Resolution Stress Measurements on MEMS Structures
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Topics: Microelectromechanical systems, Resolution (Optics), Stress, Electron backscatter diffraction, Focused ion beams, Milling, Raman spectroscopy