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Modeling and Characterization of Electronic and Photonic Systems
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Proceedings Papers

A CFD Analysis of Telecommunication Racks, Including Effects of Air Filter Locations

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L. T. Yeh, B. T. F. Chung, Joseph Yeh
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1359-1364, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73008
https://doi.org/10.1115/IPACK2005-73008
View Paper titled, A CFD Analysis of Telecommunication Racks, Including Effects of Air Filter Locations
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Topics: Air filters, Computational fluid dynamics, Server racks, Air flow, Computer software, Failure, Fans, Flow (Dynamics)
Proceedings Papers

Models for Shock and Vibration Survivability of Electronic and MEMS Packaging

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Pradeep Lall, Dhananjay Panchagade, Prakriti Choudhary, Jeff Suhling, Sameep Gupte
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1545-1556, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73427
https://doi.org/10.1115/IPACK2005-73427
View Paper titled, Models for Shock and Vibration Survivability of Electronic and MEMS Packaging
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Topics: MEMS packaging, Shock (Mechanics), Vibration, Damage, Failure, Design, Electronic packaging, Reliability, Transients (Dynamics), Boundary-value problems
Proceedings Papers

Characterization of Non-Conductive Adhesives

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Daniel Farley, Abhijit Dasgupta, J. F. J. M. Caers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73021
https://doi.org/10.1115/IPACK2005-73021
View Paper titled, Characterization of Non-Conductive Adhesives
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Topics: Adhesives, Manufacturing, Stress, Metals, Modeling, Contact resistance, Simulation, Temperature, Bonding, Compression
Proceedings Papers

The Impact of Varying Feature Dimensions on Substrate Reliability Risks

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Kayleen L. E. Helms, Qing A. Zhou, Charles Zhang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1557-1563, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73428
https://doi.org/10.1115/IPACK2005-73428
View Paper titled, The Impact of Varying Feature Dimensions on Substrate Reliability Risks
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Topics: Dimensions, Reliability, Modeling, Design, Geometry, Cracking (Materials), Electronic packaging, Failure, Failure mechanisms, Finite element analysis
Proceedings Papers

Characterization of Maximum Current Capacity for Microprocessor Sockets

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David Song, Ashish Gupta, Chia-Pin Chiu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1371-1374, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73035
https://doi.org/10.1115/IPACK2005-73035
View Paper titled, Characterization of Maximum Current Capacity for Microprocessor Sockets
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Topics: Computer simulation, Modeling, Pressure, Risk assessment, Temperature
Proceedings Papers

The Characterization of Damage Propagation in BGA’s on Flip-Chip Electronic Packages

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Kayleen L. E. Helms, Betty Phillips
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1565-1573, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73429
https://doi.org/10.1115/IPACK2005-73429
View Paper titled, The Characterization of Damage Propagation in BGA’s on Flip-Chip Electronic Packages
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Topics: Damage, Electronic packages, Flip-chip, Solder joints, Ball-Grid-Array packaging, Failure analysis, Fracture (Materials), Cracking (Materials), Design, Flat heat pipes
Proceedings Papers

Thermal Characterization and Modeling of Stacked Die Packages

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P. Szabo, M. Rencz, V. Sze´kely, A. Poppe, G. Farkas, B. Courtois
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1575-1581, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73437
https://doi.org/10.1115/IPACK2005-73437
View Paper titled, Thermal Characterization and Modeling of Stacked Die Packages
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Topics: Modeling, Steady state, Thermal characterization, Transients (Dynamics)
Proceedings Papers

High Precision Compact Thermal Models

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Mohamed-Nabil Sabry
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1379-1387, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73051
https://doi.org/10.1115/IPACK2005-73051
View Paper titled, High Precision Compact Thermal Models
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Topics: Errors, Heat, Reliability, Temperature gradient
Proceedings Papers

Artificial Neural Network Trained, Genetic Algorithms Optimized Thermal Energy Storage Heatsinks for Electronics Cooling

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Jeevan Kanesan, Parthiban Arunasalam, Kankanhalli N. Seetharamu, Ishak A. Azid
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1389-1395, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73053
https://doi.org/10.1115/IPACK2005-73053
View Paper titled, Artificial Neural Network Trained, Genetic Algorithms Optimized Thermal Energy Storage Heatsinks for Electronics Cooling
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Topics: Artificial neural networks, Computer cooling, Genetic algorithms, Thermal energy storage, Fins, Operating temperature, Optimization, Phase transition temperature, Computer simulation, Aluminum
Proceedings Papers

Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects

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Alex Vukovic, Michel Savoie
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1375-1377, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73039
https://doi.org/10.1115/IPACK2005-73039
View Paper titled, Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects
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Topics: Density, Heat pipes, Optical interconnections, Performance characterization, Server racks, Thermal management
Proceedings Papers

Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP)

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Satish C. Chaparala, Frank E. Andros, Bill Infantolino, Bahgat G. Sammakia, Satish C. Guttikonda, Julia Zhao, Dipak Sengupta
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1397-1404, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73085
https://doi.org/10.1115/IPACK2005-73085
View Paper titled, Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP)
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Topics: Stress analysis (Engineering), Stress, Fracture (Materials), Packaging, Wire, Cracking (Materials), Density, Design, Engineers, Finite element methods
Proceedings Papers

A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP

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Hideo Koguchi, Mirai Ishida, Kazuto Nishida, Tomoaki Kuroishi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1405-1412, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73096
https://doi.org/10.1115/IPACK2005-73096
View Paper titled, A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP
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Topics: Deflection, Reliability, Stress, Viscoelasticity, Relaxation (Physics), Resins, Thermodynamic cycles, Adhesives, Thermal expansion, Thermal stresses
Proceedings Papers

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

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Pavel L. Komarov, Mihai G. Burzo, Peter E. Raad
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1413-1420, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73196
https://doi.org/10.1115/IPACK2005-73196
View Paper titled, Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning
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Topics: Microelectronic devices, Temperature, Thermal characterization, Thermoreflectance, Reflectance, Silicon, Transients (Dynamics), MOSFET transistors, Resolution (Optics), Calibration
Proceedings Papers

Simplified Network Based Modeling of Cold Plate in a CFD Environment

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Debabrata Pal, Mark Severson
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1421-1426, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73202
https://doi.org/10.1115/IPACK2005-73202
View Paper titled, Simplified Network Based Modeling of Cold Plate in a CFD Environment
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Topics: Computational fluid dynamics, Modeling, Flow (Dynamics), Electronics, Manufacturing, Plates (structures), Aerospace industry, Boundary-value problems, Design, Heat
Proceedings Papers

Modeling of Electron Transport in Thin Films With Quantum and Scattering Effects

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A. Bulusu, D. G. Walker
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1427-1432, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73212
https://doi.org/10.1115/IPACK2005-73212
View Paper titled, Modeling of Electron Transport in Thin Films With Quantum and Scattering Effects
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Topics: Electromagnetic scattering, Electron transport, Modeling, Radiation scattering, Scattering (Physics), Thin films, Equilibrium (Physics), Phonons, Dimensions, Electrons
Proceedings Papers

Solder Joint Reliability Prediction of Flip Chip Packages Under Shock Loading Environment

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Wei Keat Loh, Luke J. Garner
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1433-1440, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73213
https://doi.org/10.1115/IPACK2005-73213
View Paper titled, Solder Joint Reliability Prediction of Flip Chip Packages Under Shock Loading Environment
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Topics: Flip-chip packages, Reliability, Shock (Mechanics), Solder joints
Proceedings Papers

A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application

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Shaw Fong Wong, Wei Keat Loh, Yung Hsiang Lee, Eng Hooi Yap, Siang Woen Wong, Tze Yang Hin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1441-1447, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73215
https://doi.org/10.1115/IPACK2005-73215
View Paper titled, A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application
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Topics: Ball-Grid-Array packaging, Dynamic response, Flip-chip, Flip-chip devices, Fracture (Materials), Risk, Solder joints, Accelerometers, Computer software, Design
Proceedings Papers

Solder Joint Reliability Challenges in Sub 1.00 mm Ball Pitch for Flip Chip Ball Grid Array

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Keh Shin Beh, Wei Keat Loh, Jenn Seong Leong, Wooi Aun Tan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1449-1454, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73216
https://doi.org/10.1115/IPACK2005-73216
View Paper titled, Solder Joint Reliability Challenges in Sub 1.00 mm Ball Pitch for Flip Chip Ball Grid Array
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Topics: Ball-Grid-Array packaging, Flip-chip, Flip-chip devices, Reliability, Solder joints, Heat sinks, Stress, Compression, Cycles, Electronic packages
Proceedings Papers

Modeling Melting Solder in System-in-Package Assembly

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J. F. Zhao, J. F. Wang, C. Yang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1455-1458, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73237
https://doi.org/10.1115/IPACK2005-73237
View Paper titled, Modeling Melting Solder in System-in-Package Assembly
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Topics: Manufacturing, Melting, Modeling, Solders, Stress, System-in-package
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

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Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
https://doi.org/10.1115/IPACK2005-73239
View Paper titled, Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
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Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics