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1-20 of 31
Modeling and Characterization of Electronic and Photonic Systems
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Proceedings Papers
A CFD Analysis of Telecommunication Racks, Including Effects of Air Filter Locations
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1359-1364, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73008
Proceedings Papers
Models for Shock and Vibration Survivability of Electronic and MEMS Packaging
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1545-1556, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73427
Proceedings Papers
Characterization of Non-Conductive Adhesives
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73021
Proceedings Papers
The Impact of Varying Feature Dimensions on Substrate Reliability Risks
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1557-1563, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73428
Proceedings Papers
Characterization of Maximum Current Capacity for Microprocessor Sockets
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1371-1374, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73035
Proceedings Papers
The Characterization of Damage Propagation in BGA’s on Flip-Chip Electronic Packages
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1565-1573, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73429
Proceedings Papers
Thermal Characterization and Modeling of Stacked Die Packages
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1575-1581, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73437
Proceedings Papers
High Precision Compact Thermal Models
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1379-1387, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73051
Proceedings Papers
Artificial Neural Network Trained, Genetic Algorithms Optimized Thermal Energy Storage Heatsinks for Electronics Cooling
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1389-1395, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73053
Proceedings Papers
Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1375-1377, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73039
Proceedings Papers
Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP)
Available to PurchaseSatish C. Chaparala, Frank E. Andros, Bill Infantolino, Bahgat G. Sammakia, Satish C. Guttikonda, Julia Zhao, Dipak Sengupta
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1397-1404, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73085
Proceedings Papers
A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1405-1412, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73096
Proceedings Papers
Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1413-1420, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73196
Proceedings Papers
Simplified Network Based Modeling of Cold Plate in a CFD Environment
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1421-1426, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73202
Proceedings Papers
Modeling of Electron Transport in Thin Films With Quantum and Scattering Effects
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1427-1432, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73212
Proceedings Papers
Solder Joint Reliability Prediction of Flip Chip Packages Under Shock Loading Environment
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1433-1440, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73213
Proceedings Papers
A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1441-1447, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73215
Proceedings Papers
Solder Joint Reliability Challenges in Sub 1.00 mm Ball Pitch for Flip Chip Ball Grid Array
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1449-1454, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73216
Proceedings Papers
Modeling Melting Solder in System-in-Package Assembly
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1455-1458, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73237
Proceedings Papers
Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
Available to PurchaseQiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
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