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Proceedings Papers

Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes

Eiichi Aoyama, Hisaya Kondou, Ryu Minagi, Tsutao Katayama, Toshiki Hirogaki, Hisahiro Inoue
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 317-323, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35086
https://doi.org/10.1115/IPACK2003-35086
View Paper titled, Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes
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Topics: Drilling, Lasers, Temperature, Circuits, Printed circuit boards, Copper foil, Heat, Absorption, Damage, Finite element methods
Proceedings Papers

Failure and Reliability Analysis Influenced by Various Factors Using Accelerated Disturbed State Concept

Russell D. Whitenack, Chandra S. Desai
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 595-604, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35352
https://doi.org/10.1115/IPACK2003-35352
View Paper titled, Failure and Reliability Analysis Influenced by Various Factors Using Accelerated Disturbed State Concept
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Topics: Event history analysis, Failure, Cycles, Approximation, Computers, Design, Electronic packaging, Finite element analysis, Modeling, Reliability
Proceedings Papers

Vapor Pressure Assisted Interface Delamination and Failure of Plastic IC Packages: A Micromechanics Approach

C. W. Chong, T. F. Guo, L. Cheng
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 391-397, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35180
https://doi.org/10.1115/IPACK2003-35180
View Paper titled, Vapor Pressure Assisted Interface Delamination and Failure of Plastic IC Packages: A Micromechanics Approach
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Topics: Damage, Delamination, Failure, Micromechanics (Engineering), Vapor pressure
Proceedings Papers

Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability

Eric Stellrecht, Bongtae Han, Michael Pecht
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 497-503, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35252
https://doi.org/10.1115/IPACK2003-35252
View Paper titled, Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability
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Topics: Proton exchange membranes, Reliability
Proceedings Papers

Thermal Characters of Mesh Structure in a Flat Heat Pipe

Liang-Han Chien, Y.-C. Shih
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 325-333, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35095
https://doi.org/10.1115/IPACK2003-35095
View Paper titled, Thermal Characters of Mesh Structure in a Flat Heat Pipe
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Topics: Flat heat pipes, Heat pipes, Thermal resistance, Condensation, Evaporation, Water, Computer cooling, Condensers (steam plant), Copper, Fluids
Proceedings Papers

Modelling the Performance of Lead-Free Solder Interconnects for Copper Bumped Flip-Chip Devices

Hua Lu, Chris Bailey
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 605-610, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35356
https://doi.org/10.1115/IPACK2003-35356
View Paper titled, Modelling the Performance of Lead-Free Solder Interconnects for Copper Bumped Flip-Chip Devices
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Topics: Copper, Flip-chip devices, Lead-free solders, Modeling, Reliability
Proceedings Papers

Parameter Optimization for a Temperature Estimation Model

J. Cole Smith, Alfonso Ortega, Colleen M. Gabel, Dale Henderson
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 505-512, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35254
https://doi.org/10.1115/IPACK2003-35254
View Paper titled, Parameter Optimization for a Temperature Estimation Model
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Topics: Optimization, Temperature, Algorithms, Computation, Design
Proceedings Papers

Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress

Mohamed-Nabil Sabry
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 399-415, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35185
https://doi.org/10.1115/IPACK2003-35185
View Paper titled, Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress
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Topics: Design, Electronic systems, Nanoscale phenomena, Reliability, Temperature effects
Proceedings Papers

Creep and Microstructural Evolution in Lead-Free Microelectronic Solder Joints

I. Dutta, C. Park, S. Choi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 417-422, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35209
https://doi.org/10.1115/IPACK2003-35209
View Paper titled, Creep and Microstructural Evolution in Lead-Free Microelectronic Solder Joints
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Topics: Creep, Solder joints, Testing, Alloys, Lead-free solders, Solders, Tin, Ball-Grid-Array packaging, Flip-chip, Flip-chip devices
Proceedings Papers

Design of a Low-Cost Infrared Sensor Array Through Thermal System Modeling

Brian R. Smith, Cristina Amon
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 513-519, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35277
https://doi.org/10.1115/IPACK2003-35277
View Paper titled, Design of a Low-Cost Infrared Sensor Array Through Thermal System Modeling
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Topics: Design, Modeling, Sensors, Thermal systems, Thermal properties, Manufacturing, Signals, Silicon, Computer simulation, Electronics
Proceedings Papers

Determination of Package Die Temperature in a Set-Top Box Using JEDEC Thermal Metrics

Zeki Celik
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 423-429, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35212
https://doi.org/10.1115/IPACK2003-35212
View Paper titled, Determination of Package Die Temperature in a Set-Top Box Using JEDEC Thermal Metrics
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Topics: Temperature, Junctions, Thermal resistance, Energy dissipation, Steady state, Strips
Proceedings Papers

Three-Dimensional Simulation of Thermoelectric Devices With Compact Numerical Models

Eric Prather, Bhalchandra Puranik
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 335-342, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35110
https://doi.org/10.1115/IPACK2003-35110
View Paper titled, Three-Dimensional Simulation of Thermoelectric Devices With Compact Numerical Models
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Topics: Air flow, Computational fluid dynamics, Computer cooling, Computer simulation, Computer software, Electric current, Electronic equipment, Energy dissipation, Heat, Heat sinks
Proceedings Papers

Multi-Scale Modeling of High Power Density Data Centers

Jeffrey D. Rambo, Yogendra K. Joshi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 521-527, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35297
https://doi.org/10.1115/IPACK2003-35297
View Paper titled, Multi-Scale Modeling of High Power Density Data Centers
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Topics: Data centers, Multiscale modeling, Power density
Proceedings Papers

Analysis of an Embedded Sensor in a Composite Laminate for Enabling Damage Detection

Scott Sealing, Charles Seeley, Haleh Ardebili
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 343-348, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35132
https://doi.org/10.1115/IPACK2003-35132
View Paper titled, Analysis of an Embedded Sensor in a Composite Laminate for Enabling Damage Detection
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Topics: Composite materials, Damage, Experimental design, Laminates, Sensors
Proceedings Papers

Effects of A Rotated Chip Package on Mechanical and Thermal Performances

Henry H. Jung, Ron Zhang, Eddie Lee, Sai Ankireddi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 529-535, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35311
https://doi.org/10.1115/IPACK2003-35311
View Paper titled, Effects of A Rotated Chip Package on Mechanical and Thermal Performances
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Topics: Air flow, Clamps (Tools), Computers, Design engineering, Junctions, Manufacturing, Rotation, Silicon, Stress, Temperature
Proceedings Papers

Compact Thermal Representations for Several Fundamental Shapes in Forced Convection

Kyle A. Brucker, Kyle T. Ressler, Joseph Majdalani
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 431-437, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35218
https://doi.org/10.1115/IPACK2003-35218
View Paper titled, Compact Thermal Representations for Several Fundamental Shapes in Forced Convection
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Topics: Forced convection, Shapes, Heat sinks, Thermal conductivity, Fluids, Thermal resistance, Approximation, Computer simulation, Cooling, Electronic packages
Proceedings Papers

Numerical Simulation of a Heat Pipe Embedded Cooling System for a Notebook PC

Yi Jia, Pablo D. Quinones
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 349-354, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35135
https://doi.org/10.1115/IPACK2003-35135
View Paper titled, Numerical Simulation of a Heat Pipe Embedded Cooling System for a Notebook PC
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Topics: Computer simulation, Cooling systems, Heat pipes, Laptop computers, Heat, Computer software, Dynamic light scattering, Energy dissipation, Finite element model, Geometry
Proceedings Papers

Compact Thermal Representations for Several Fundamental Shapes in Natural Convection

Kyle A. Brucker, Kyle T. Ressler, Joseph Majdalani
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 439-448, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35219
https://doi.org/10.1115/IPACK2003-35219
View Paper titled, Compact Thermal Representations for Several Fundamental Shapes in Natural Convection
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Topics: Natural convection, Shapes, Heat sinks, Thermal conductivity, Approximation, Fluids, Design, Engineers, Fins, Optimization
Proceedings Papers

Optimization Study of a Silicon-Carbide Micro-Capillary Pumped Loop

Laura J. Meyer, Leslie M. Phinney
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 355-361, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35138
https://doi.org/10.1115/IPACK2003-35138
View Paper titled, Optimization Study of a Silicon-Carbide Micro-Capillary Pumped Loop
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Topics: Optimization, Silicon, Thermal management, Condensers (steam plant), Cooling, Design, Dimensions, Energy budget (Physics), Gallium nitride, Heat flux
Proceedings Papers

Advanced Micro Shear Testing for Solder Alloy Using Direct Local Measurement

Soonwook Kwon, Yuri Lee, Bongtae Han
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 537-542, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35325
https://doi.org/10.1115/IPACK2003-35325
View Paper titled, Advanced Micro Shear Testing for Solder Alloy Using Direct Local Measurement
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Topics: Alloys, Shear (Mechanics), Solders, Testing, Continuum mechanics, Deformation, Finite element methods, Finite element model, Geometry, Machinery