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Proceedings Papers

Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit

Yusuke Watanabe, Yuji Ichikawa, Kazuhiro Ogawa, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73150
https://doi.org/10.1115/IPACK2013-73150
View Paper titled, Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit
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Topics: Copper, Mechanical properties, Particulate matter, Brittle fracture, Ceramics, Coating processes, Coatings, Dielectric materials, Electrical properties, Electron backscatter diffraction
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73158
https://doi.org/10.1115/IPACK2013-73158
View Paper titled, Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Laser Processing by Using Fluidic Laser Beam Shaper

Hong Duc Doan, Naoki Iwatani, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73059
https://doi.org/10.1115/IPACK2013-73059
View Paper titled, Laser Processing by Using Fluidic Laser Beam Shaper
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Topics: Laser beams, Lasers, Laser materials, Drilling
Proceedings Papers

Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach

Preeti Chauhan, Subhasis Mukherjee, Michael Osterman, Abhijit Dasgupta, Michael Pecht
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A009, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73164
https://doi.org/10.1115/IPACK2013-73164
View Paper titled, Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach
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Topics: Creep, Micromechanics (Engineering), Solders, Tin, Nanoscale phenomena, Solder joints, Alloys, Image processing, Intermetallic compounds, Particulate matter
Proceedings Papers

Fundamental Research on Via Processing by Using Short Pulse Laser in SiC

Naoki Iwatani, Hong Duc Doan, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73060
https://doi.org/10.1115/IPACK2013-73060
View Paper titled, Fundamental Research on Via Processing by Using Short Pulse Laser in SiC
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Topics: Lasers, Water, Ablation (Vaporization technology), Fluence (Radiation measurement), Fracture (Materials), Semiconductor wafers, Drilling, Etching, Film thickness, Nd-YAG lasers
Proceedings Papers

Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel

Shingo Hattori, Naoya Matsubara, Ikuo Shohji, Hideyuki Kuwahara
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73170
https://doi.org/10.1115/IPACK2013-73170
View Paper titled, Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel
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Topics: Plasmas (Ionized gases), Stainless steel, Tin, Erosion, Diffusion (Physics), Temperature
Proceedings Papers

Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls

Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida, Toshikazu Ookubo
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73171
https://doi.org/10.1115/IPACK2013-73171
View Paper titled, Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls
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Topics: Electrodes, Lead-free solders, Tin, Plating baths, Shear (Mechanics), Solders, Intermetallic compounds, Melting, Nickel plating
Proceedings Papers

Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging

Z. Huang, I. Dutta, G. S. Subbarayan
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73079
https://doi.org/10.1115/IPACK2013-73079
View Paper titled, Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging
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Topics: Fracture (Materials), Fracture (Process), Solders, Tin, Brittleness, Fracture mechanics, Fracture toughness, Solder joints, Adhesives, Ball-Grid-Array packaging
Proceedings Papers

Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73113
https://doi.org/10.1115/IPACK2013-73113
View Paper titled, Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon
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Topics: Coating processes, Coatings, Sapphire, Silicon, Delamination, Bonding, Resins, Stress, Cooling, Temperature
Proceedings Papers

Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil

Takuya Nagayama, Hiroaki Yoshida, Ikuo Shohji
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73172
https://doi.org/10.1115/IPACK2013-73172
View Paper titled, Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil
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Topics: Copper foil, Electrolytes, Mechanical properties, Copper, Elastic moduli, Fatigue properties, Grain size, Proteins, Tensile strength
Proceedings Papers

Effect of Aging on Impression Creep Behavior of Pb-Free Solders

B. Talebanpour, U. Sahaym, I. Dutta, P. Kumar
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73137
https://doi.org/10.1115/IPACK2013-73137
View Paper titled, Effect of Aging on Impression Creep Behavior of Pb-Free Solders
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Topics: Creep, Lead-free solders, Tin, Alloys, Particulate matter, Solders, Temperature, Melting, Melting point, Particle size
Proceedings Papers

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73149
https://doi.org/10.1115/IPACK2013-73149
View Paper titled, Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films
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Topics: Reliability, Thin films, Electroplating, Copper, Annealing, Current density, Electrical properties, Electron backscatter diffraction, Electrical resistivity, Grain boundaries
Proceedings Papers

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73192
https://doi.org/10.1115/IPACK2013-73192
View Paper titled, Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint
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Topics: Damage, Low cycle fatigue, Solder joints, Tin, Grain boundaries, Fracture (Materials), Stress concentration, Crack propagation, Cycles, Electron backscatter diffraction
Proceedings Papers

Effect of Temperature and Strain Rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy

Takuma Sato, Yoshiharu Kariya, Kazuma Fukui
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73193
https://doi.org/10.1115/IPACK2013-73193
View Paper titled, Effect of Temperature and Strain Rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy
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Topics: Eutectic alloys, Low cycle fatigue, Temperature, Tin, Fatigue life, Deformation, Ductility, Fatigue, Metals, Temperature effects
Proceedings Papers

Aging Induced Mechanical Property Degradation and Microstructure Evolution of SAC+X Lead Free Solder Alloys

Zijie Cai, Jeffrey C. Suhling, Pradeep Lall, Michael J. Bozack
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A016, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73241
https://doi.org/10.1115/IPACK2013-73241
View Paper titled, Aging Induced Mechanical Property Degradation and Microstructure Evolution of SAC+X Lead Free Solder Alloys
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Topics: Alloys, Creep, Lead-free solders, Mechanical properties
Proceedings Papers

Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73242
https://doi.org/10.1115/IPACK2013-73242
View Paper titled, Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging
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Topics: Mechanical behavior, Microelectronic packaging, Polymers, Mechanical properties, Stress, Tension, Adhesives, Elastic moduli, Epoxy adhesives, Epoxy resins
Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73278
https://doi.org/10.1115/IPACK2013-73278
View Paper titled, Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
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Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)
Proceedings Papers

Leading Indicators for Prognostication of Impending Failures on Cu-Al Interconnects

Pradeep Lall, Shantanu Deshpande
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A019, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73287
https://doi.org/10.1115/IPACK2013-73287
View Paper titled, Leading Indicators for Prognostication of Impending Failures on Cu-Al Interconnects
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Topics: Failure, Intermetallic compounds, Wire, Damage, Service life (Equipment), Wire bonding, Algorithms, Aluminum, Copper, Electronic packaging
Proceedings Papers

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73315
https://doi.org/10.1115/IPACK2013-73315
View Paper titled, Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic
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Topics: Crystals, Intermetallic compounds, Mechanical behavior, Tin, Solder joints, Electron backscatter diffraction, Nanoindentation, Anisotropy, Creep, Ductility
Proceedings Papers

Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging

Mohammad Hasnine, Muhannad Mustafa, Jing Zou, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73234
https://doi.org/10.1115/IPACK2013-73234
View Paper titled, Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging
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Topics: Creep, Electron backscatter diffraction, Microelectronic packaging, Nanoindentation, Solder joints