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Proceedings Papers

Polyimide Multi-Layer Substrate for High-Density Semiconductor Package

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Shoichi Takenaka, Shoji Ito, Ryoichi Kishihara, Masahiro Okamoto, Osamu Nakao
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1779-1782, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73065
https://doi.org/10.1115/IPACK2005-73065
View Paper titled, Polyimide Multi-Layer Substrate for High-Density Semiconductor Package
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Topics: Density, Semiconductors (Materials), Electrical wires, Epoxy adhesives, Epoxy resins, Glass, Heat, Multi-chip modules
Proceedings Papers

CAM Systems Based on Traveling Salesman Problem From Time Perspective for High Density Through-Hole Drilling

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Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Naohide Hashimoto, Mitsutaka Matsumura
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1783-1789, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73092
https://doi.org/10.1115/IPACK2005-73092
View Paper titled, CAM Systems Based on Traveling Salesman Problem From Time Perspective for High Density Through-Hole Drilling
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Topics: Density, Drilling, Printed circuit boards, Machine tools, Drills (Tools)
Proceedings Papers

A Viscoplastic Constitutive Model and Estimation Method of Material Constants for Lead-Free Solder Alloys

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Ken-Ichi Ohguchi, Katsuhiko Sasaki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1791-1796, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73103
https://doi.org/10.1115/IPACK2005-73103
View Paper titled, A Viscoplastic Constitutive Model and Estimation Method of Material Constants for Lead-Free Solder Alloys
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Topics: Alloys, Constitutive equations, Lead-free solders, Creep, Tin, Deformation, Engineering simulation, Finite element methods, Finite element model, Relaxation (Physics)
Proceedings Papers

Cu-Direct Via-Hole Drilling of Aramid Fiber Reinforced Build-Up Layer by CO 2 Laser Beam

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Eiichi Aoyama, Toshiki Hirogaki, Keiji Ogawa, Nobuyuki Doi, Ryu Minagi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1797-1804, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73114
https://doi.org/10.1115/IPACK2005-73114
View Paper titled, Cu-Direct Via-Hole Drilling of Aramid Fiber Reinforced Build-Up Layer by CO 2 Laser Beam
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Topics: Aramid fibers, Carbon dioxide lasers, Drilling, Copper foil, Lasers, Absorption, Drills (Tools), Fillers (Materials), Heat, Hole quality
Proceedings Papers

Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy

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Noboru Hidaka, Megumi Nagano, Masayoshi Shimoda, Hirohiko Watanabe, Masahiro Ono
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1805-1810, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73148
https://doi.org/10.1115/IPACK2005-73148
View Paper titled, Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy
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Topics: Alloys, Creep, Lead-free solders, Tin
Proceedings Papers

An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

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Takehiko Takahashi, Susumu Hioki, Ikuo Shohji, Osamu Kamiya
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1811-1817, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73152
https://doi.org/10.1115/IPACK2005-73152
View Paper titled, An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature
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Topics: Cycles, Fatigue damage, Image processing, Lead-free solders, Solders, Tin, Low cycle fatigue, Fatigue life, Surface deformation, Fatigue
Proceedings Papers

Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys

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Changqing Liu, David A. Hutt, Dezhi Li, Paul P. Conway
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1819-1825, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73160
https://doi.org/10.1115/IPACK2005-73160
View Paper titled, Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys
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Topics: Alloys, Lead-free solders, Nickel, Coatings, Tin, Storage, Temperature, Testing, Copper, Mechanical properties
Proceedings Papers

Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen

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Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga, Masahisa Otsuka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1827-1832, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73165
https://doi.org/10.1115/IPACK2005-73165
View Paper titled, Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen
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Topics: Alloys, Damage, Fatigue life, Fracture (Materials), Low cycle fatigue, Solders, Tin
Proceedings Papers

Reliability Improvement of Solder Joints Between Ceramic Chip Resistors and Insulated Metal Substrates With Thick Copper Pads

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Kenji Monden
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1833-1840, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73176
https://doi.org/10.1115/IPACK2005-73176
View Paper titled, Reliability Improvement of Solder Joints Between Ceramic Chip Resistors and Insulated Metal Substrates With Thick Copper Pads
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Topics: Ceramics, Copper, Metals, Reliability, Resistors, Solder joints
Proceedings Papers

Numerical Model to Analyse IC Chip Encapsulation Process

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Venkatesh M. Kulkarni, Ishak Abdul Azid, K. N. Seetharamu, P. A. Aswatha Narayana
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1841-1848, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73197
https://doi.org/10.1115/IPACK2005-73197
View Paper titled, Numerical Model to Analyse IC Chip Encapsulation Process
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Topics: Computer simulation, Flip-chip packages, Flow (Dynamics), Fluids, Simulation, Cavities, Epoxy adhesives, Epoxy resins, Geometry, Pressure
Proceedings Papers

Microstructure and Magnetic Properties of NdFeB Based Nanocomposites to Shock Compression

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Jin-Chein Lin, M. H. Nien, L. C. Chang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1849-1855, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73230
https://doi.org/10.1115/IPACK2005-73230
View Paper titled, Microstructure and Magnetic Properties of NdFeB Based Nanocomposites to Shock Compression
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Topics: Compression, Magnetic alloys, Nanocomposites, Shock (Mechanics)
Proceedings Papers

Loading Rate Effect Investigation of Through-Hole-Mounted Solder Joints

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Frank Z. Liang, Larry M. Palanuk, Mike Gabriel
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1857-1862, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73275
https://doi.org/10.1115/IPACK2005-73275
View Paper titled, Loading Rate Effect Investigation of Through-Hole-Mounted Solder Joints
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Topics: Solder joints, Shock (Mechanics), Stress, Failure, Actuators, Lead-free solders, Manufacturing
Proceedings Papers

Characterization of Novolac Based Photoresists to Fabricate 3D Polymer Dome Features

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Sriram Muthukumar, Tom W. Miller, Balu Pathangey, Neha M. Patel, Charles D. Hill
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1863-1868, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73300
https://doi.org/10.1115/IPACK2005-73300
View Paper titled, Characterization of Novolac Based Photoresists to Fabricate 3D Polymer Dome Features
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Topics: Domes (Structural elements), Photoresists, Polymers, Shapes, Cylinders, Deformation, Evaporation, Fourier transform infrared spectroscopy, Fourier transforms, Gas chromatography
Proceedings Papers

Silicone Gel Thermal Interface Materials for High Heat Dissipation and Thermo-Mechanical Stress Management for Good Reliability Performance

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J. C. Matayabas, Jr., Vassou LeBonheur
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1869-1873, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73372
https://doi.org/10.1115/IPACK2005-73372
View Paper titled, Silicone Gel Thermal Interface Materials for High Heat Dissipation and Thermo-Mechanical Stress Management for Good Reliability Performance
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Topics: Energy dissipation, Heat, Reliability, Silicones, Stress, Thermomechanics, Flat heat pipes, Packaging, Accelerated life testing, Clocks
Proceedings Papers

Future Direction and Challenges for Microelectronics Packaging Materials

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Vijay Wakharkar, J. C. Matayabas, Jr.
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1875-1880, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73374
https://doi.org/10.1115/IPACK2005-73374
View Paper titled, Future Direction and Challenges for Microelectronics Packaging Materials
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Topics: Advanced materials, Density, Dimensions, Energy dissipation, Microelectronic devices, Microelectronic packaging, Packaging
Proceedings Papers

Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages

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Arun Raman, Jun Tian, Alfred A. La Mar, Shalabh Tandon
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1881-1887, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73389
https://doi.org/10.1115/IPACK2005-73389
View Paper titled, Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages
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Topics: Lasers, Spallation (Nuclear physics), Adhesion, Adhesives, Ball-Grid-Array packaging, Copper, Dielectric materials, Epoxy adhesives, Epoxy resins, Flip-chip
Proceedings Papers

Effect of Filler Geometry on the Conduction of Isotropically Conductive Adhesives

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Bin Su, Jianmin Qu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1889-1901, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73413
https://doi.org/10.1115/IPACK2005-73413
View Paper titled, Effect of Filler Geometry on the Conduction of Isotropically Conductive Adhesives
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Topics: Adhesives, Fillers (Materials), Geometry, Heat conduction, Particulate matter, Electrical resistivity, Design, Engineering simulation, Resistors, Simulation
Proceedings Papers

CO 2 Laser Drilling of Microvias Using Diffractive Optics Techniques: I — Mathematical Modeling

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Chong Zhang, Sachin Bet, Islam A. Salama, Nathaniel R. Quick, Aravinda Kar
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1903-1909, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73474
https://doi.org/10.1115/IPACK2005-73474
View Paper titled, CO 2 Laser Drilling of Microvias Using Diffractive Optics Techniques: I — Mathematical Modeling
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Topics: Carbon dioxide lasers, Drilling, Lasers, Modeling, Optics, Packaging
Proceedings Papers

Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

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Arun Gowda, Annita Zhong, Sandeep Tonapi, Kaustubh Nagarkar, K. Srihari
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1911-1918, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73490
https://doi.org/10.1115/IPACK2005-73490
View Paper titled, Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities
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Topics: Mechanical properties, Silicones, Heat, Adhesives, Fillers (Materials), Flat heat pipes, Microelectronic devices, Phase change materials, Pumps, Resins
Proceedings Papers

Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys

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Katsuhiko Sasaki, Takuji Kobayashi, Ken-Ichi Ohguchi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1773-1778, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73054
https://doi.org/10.1115/IPACK2005-73054
View Paper titled, Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys
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Topics: Alloys, Creep, Solders, Tin, Deformation, Tension, Compression, Electronic packaging, Reliability, Safety