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Proceedings Papers

Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 277-282, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89233
https://doi.org/10.1115/InterPACK2009-89233
View Paper titled, Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
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Topics: Electronics, Manufacturing, Optical fiber, Polarization (Light), Fibers, Displacement, Polarization (Electricity), Polarization (Waves), Electric discharge, Experimental design
Proceedings Papers

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 193-200, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89014
https://doi.org/10.1115/InterPACK2009-89014
View Paper titled, Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale
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Topics: Copper, Heating, Interferometry, Joules, Heat, Current density, Design, Electrodiffusion, Electronic packaging, Energy dissipation
Proceedings Papers

Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes

G. Srinivasan, R. Murcko, K. Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 283-292, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89241
https://doi.org/10.1115/InterPACK2009-89241
View Paper titled, Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes
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Topics: Finishes, Plating, Wire, Nickel, Palladium, Silver, Failure analysis, High temperature, Manufacturing, Reliability
Proceedings Papers

Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

Keiji Ogawa, Heisaburo Nakagawa, Masatoshi Matsudaira
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 201-210, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89034
https://doi.org/10.1115/InterPACK2009-89034
View Paper titled, Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics
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Topics: Fiber reinforced plastics, Glass, Printed circuit boards, Drilling, Drills (Tools), Surface roughness, Temperature, Circuits, Delamination, Glass fibers
Proceedings Papers

Reliability Assessment for Printed Circuit Board in Lead-Free Process

Chien-Yi Huang, Chen-Liang Ku, Hao-Chun Hsieh, Tzu-Min Chien, Hui-Hua Huang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 293-299, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89253
https://doi.org/10.1115/InterPACK2009-89253
View Paper titled, Reliability Assessment for Printed Circuit Board in Lead-Free Process
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Topics: Delamination, Printed circuit boards, Reliability
Proceedings Papers

Desktop NC Machine Tool With Abilities of Compliant Motion and Stick-Slip Motion

Fusaomi Nagata, Shintaro Tani, Takanori Mizobuchi, Tetsuo Hase, Zenku Haga, Keigo Watanabe
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 211-217, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89042
https://doi.org/10.1115/InterPACK2009-89042
View Paper titled, Desktop NC Machine Tool With Abilities of Compliant Motion and Stick-Slip Motion
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Topics: Machine tools, Stick-slip, Finishing, Control systems, Feedback, Feedforward control, Force feedback, Motion control, Lenses (Optics), Mirrors
Proceedings Papers

Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature

Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Tsuyoshi Okawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 219-227, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89060
https://doi.org/10.1115/InterPACK2009-89060
View Paper titled, Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature
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Topics: Drilling, Drills (Tools), Optimization, Printed circuit boards, Temperature, Fibers, Glass reinforced plastics
Proceedings Papers

Mapping Growth of an Emerging Technology: A Case Study of Flexible Electronics

Srikanth Poranki, Nagen Nagarur, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 301-307, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89315
https://doi.org/10.1115/InterPACK2009-89315
View Paper titled, Mapping Growth of an Emerging Technology: A Case Study of Flexible Electronics
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Topics: Flexible electronics, Electronics, Cycles, Diffusion (Physics), Explosions, Failure, Innovation, Patents, Plastics, Roads
Proceedings Papers

Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Influence of Surface Treatment on Drilled Hole Quality

Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Tsukasa Ayuzawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 229-237, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89061
https://doi.org/10.1115/InterPACK2009-89061
View Paper titled, Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Influence of Surface Treatment on Drilled Hole Quality
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Topics: Drilling, Hole quality, Lasers, Surface finishing, Carbon dioxide lasers, Copper foil, Copper, Printed circuit boards, Melting, Resins
Proceedings Papers

Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

Bankeem V. Chheda, Sathishkumar Sakthivelan, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 309-316, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89321
https://doi.org/10.1115/InterPACK2009-89321
View Paper titled, Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies
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Topics: Thermal shock, Solders, Alloys, Failure, Chain, Manufacturing, Solder joints, Ball-Grid-Array packaging, Finishes, Lead-free solders
Proceedings Papers

In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 239-245, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89145
https://doi.org/10.1115/InterPACK2009-89145
View Paper titled, In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures
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Topics: Evaluation methods, Stress, Thin films, Transistors, Gates (Closures), Electrodes, Finite element methods, Manufacturing, Stress concentration, Focused ion beams
Proceedings Papers

New Technique for Testing Performance of Thermoelectric Quantum Well Materials

Velimir Jovanovic, Saeid Ghamaty, Norbert B. Elsner, Daniel Krommenhoek, John Morris
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 317-320.8, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89328
https://doi.org/10.1115/InterPACK2009-89328
View Paper titled, New Technique for Testing Performance of Thermoelectric Quantum Well Materials
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Topics: Quantum wells, Testing performance, Electrical resistivity, Thin films, Stress, Temperature, Alloys, Bulk solids, Copper, Electrical properties
Proceedings Papers

Optimization of Saw Street Configuration to Save Saw Blade in Assembling QFN Packages

Youmin Yu, Denis Bai, Y. W. Jiang, Sonder Wang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 247-252, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89158
https://doi.org/10.1115/InterPACK2009-89158
View Paper titled, Optimization of Saw Street Configuration to Save Saw Blade in Assembling QFN Packages
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Topics: Blades, Optimization, Roads, Strips, Cutting, Wear, Metals, Manufacturing
Proceedings Papers

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

Salil Pradhan, Francois Billaut, Sunil Gopakumar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 321-328, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89405
https://doi.org/10.1115/InterPACK2009-89405
View Paper titled, Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages
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Topics: Manufacturing, Reliability, Lumber, Pins (Engineering), Ball-Grid-Array packaging, Construction, Cross section (Physics), Design, Experimental design, Failure analysis
Proceedings Papers

Packaging Technology Development for Silicon on Sapphire Based Commercial RF IC Products

John Zhiyuan Yang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 253-259, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89199
https://doi.org/10.1115/InterPACK2009-89199
View Paper titled, Packaging Technology Development for Silicon on Sapphire Based Commercial RF IC Products
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Topics: Packaging, Silicon-on-sapphire, Technology development, Equipment performance, Reliability
Proceedings Papers

A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages

Youmin Yu, Y. Q. Su, S. A. Yao, Y. W. Jiang, Sonder Wang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 329-334, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89408
https://doi.org/10.1115/InterPACK2009-89408
View Paper titled, A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages
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Topics: Errors, Heat, Heat transfer, Heating, Optimization, Ovens, Reflow soldering, Reliability, Solders
Proceedings Papers

Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 261-265, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89221
https://doi.org/10.1115/InterPACK2009-89221
View Paper titled, Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
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Topics: Electronics, Manufacturing, Optical fiber, Polarization (Electricity), Polarization (Light), Polarization (Waves), Fibers, Engineering design processes, Experimental design, Manufacturing technology
Proceedings Papers

Optical Methodology for Testing of Microsystems

Ryszard J. Pryputniewicz, Ryan T. Marinis, Peter Hefti
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 267-276, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89223
https://doi.org/10.1115/InterPACK2009-89223
View Paper titled, Optical Methodology for Testing of Microsystems
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Topics: Microelectromechanical systems, Reliability, Testing
Proceedings Papers

An Investigation of Spray Cooling Thermal Management for Semiconductor Burn-In

T. Cader, B. Tolman, C. Tilton, M. C. Harris
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 65-71, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35137
https://doi.org/10.1115/IPACK2003-35137
View Paper titled, An Investigation of Spray Cooling Thermal Management for Semiconductor Burn-In
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Topics: Cooling, Semiconductors (Materials), Sprays, Thermal management, Temperature, Junctions, Engineering prototypes, Failure, Flow control, Forced convection
Proceedings Papers

Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis

S. Ansari, T. Cader, N. Stoddard, B. Tolman, J. Frank, D. Cotton, T. Wong, N. Pakdaman
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 73-80, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35206
https://doi.org/10.1115/IPACK2003-35206
View Paper titled, Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis
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Topics: Cooling, Failure analysis, Semiconductors (Materials), Sprays, Thermal management, Temperature, Microscopes, Silicon, Coolants, Heat