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Proceedings Papers

Development of an Automated Solder Inspection System With Neural Network Using Oblique Computed Tomography

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Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujita
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 453-457, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33017
https://doi.org/10.1115/IPACK2007-33017
View Paper titled, Development of an Automated Solder Inspection System With Neural Network Using Oblique Computed Tomography
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Topics: Artificial neural networks, Computerized tomography, Inspection, Solders, Ball-Grid-Array packaging, Density, Electronics, Shapes, Solder joints, X-rays
Proceedings Papers

Benchmark Testing of LGA Sockets for Server Applications

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Brian Beaman
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 459-467, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33067
https://doi.org/10.1115/IPACK2007-33067
View Paper titled, Benchmark Testing of LGA Sockets for Server Applications
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Topics: Testing, Engineering standards, Circuits, Construction, Hardware, Compression, Heat sinks, Reliability, Solders
Proceedings Papers

Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope

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Minhua Lu, Carla Bailey, Hsichang Liu, Krystyna Semkow
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 469-472, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33178
https://doi.org/10.1115/IPACK2007-33178
View Paper titled, Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope
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Topics: Acoustics, Microscopes, Failure analysis, Manufacturing, Metallurgy, Microscopy
Proceedings Papers

Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips

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Yuki Sato, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 473-479, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33257
https://doi.org/10.1115/IPACK2007-33257
View Paper titled, Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips
Open the PDF for Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips in another window
Topics: Failure, Nondestructive evaluation, Deformation, Delamination, Finite element analysis, Surface deformation, Diluents, Epoxy resins, Lasers, Microscopes
Proceedings Papers

Optoelectronic Methodology for Development of MEMS

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Ryszard J. Pryputniewicz, Ryan T. Marinis, Adam R. Klempner, Peter Hefti
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 481-488, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33268
https://doi.org/10.1115/IPACK2007-33268
View Paper titled, Optoelectronic Methodology for Development of MEMS
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Topics: Microelectromechanical systems, Vibration