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Proceedings Papers

Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics

Mei-Chien Lu
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 26–28, 2021
Paper No: IPACK2021-73314
DOI: https://doi.org/10.1115/IPACK2021-73314
View Paper titled, Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics
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Topics: Bonding, Copper, Density, Design, Overlays (Materials engineering)
Proceedings Papers

Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders

Zihao Yuan, Tao Zhang, Jeroen Van Duren, Ayse K. Coskun
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 26–28, 2021
Paper No: IPACK2021-73017
DOI: https://doi.org/10.1115/IPACK2021-73017
View Paper titled, Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders
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Topics: Diamonds, Flat heat pipes, Simulation, Thermal efficiency
Proceedings Papers

Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy

Tadeh Avanessian, Jim Clatterbaugh, Robin L. Zinsmaster, Leyla Hashemi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 26–28, 2021
Paper No: IPACK2021-69495
DOI: https://doi.org/10.1115/IPACK2021-69495
View Paper titled, Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy
Click here to open pdf in another window PDF for Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy
Topics: Bonding, Epoxy adhesives, Epoxy resins, Flip-chip, Flip-chip devices