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Proceedings Papers

Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods

David Leslie, Abhijit Dasgupta, Andrei Damian
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97363
https://doi.org/10.1115/IPACK2022-97363
View Paper titled, Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods
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Topics: Creep, Silver
Proceedings Papers

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Pradeep Lall, Ved Soni
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97451
https://doi.org/10.1115/IPACK2022-97451
View Paper titled, SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates
Open the PDF for SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates in another window
Topics: Batteries, Biomedical equipment, Cycles, Electronics, Errors, Flexible electronics, Industrial research, Model validation, Modeling, Service life (Equipment)
Proceedings Papers

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97450
https://doi.org/10.1115/IPACK2022-97450
View Paper titled, Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries
Open the PDF for Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries in another window
Topics: Circuits, Electronics, Printing
Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97437
https://doi.org/10.1115/IPACK2022-97437
View Paper titled, Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform
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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models
Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97382
https://doi.org/10.1115/IPACK2022-97382
View Paper titled, Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level
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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage
Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
https://doi.org/10.1115/IPACK2022-97430
View Paper titled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
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Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat
Proceedings Papers

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

Pradeep Lall, Hyesoo Jang, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97432
https://doi.org/10.1115/IPACK2022-97432
View Paper titled, Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments
Open the PDF for Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments in another window
Topics: Astronauts, Event history analysis, Manufacturing, Reliability, Sensors
Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97428
https://doi.org/10.1115/IPACK2022-97428
View Paper titled, Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
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Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Open the PDF for Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability in another window
Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging

Pradeep Lall, Hyesoo Jang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97431
https://doi.org/10.1115/IPACK2022-97431
View Paper titled, ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging
Open the PDF for ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging in another window
Topics: Artificial neural networks, Batteries, Lithium-ion batteries, Machine learning, Reliability, Simulation
Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94052
https://doi.org/10.1115/IPACK2022-94052
View Paper titled, Additive Manufacturing of Electronic Patterns for Harsh Environments
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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations
Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
https://doi.org/10.1115/IPACK2021-74086
View Paper titled, Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment
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Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components
Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74074
https://doi.org/10.1115/IPACK2021-74074
View Paper titled, Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads
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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration
Proceedings Papers

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74570
https://doi.org/10.1115/IPACK2021-74570
View Paper titled, Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions
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Topics: Failure, Gages, Inks, Printing, Shear (Mechanics), Stability, Strain gages, Stress
Proceedings Papers

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74060
https://doi.org/10.1115/IPACK2021-74060
View Paper titled, Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications
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Topics: Electronics, Reliability, Surface preparation, Stress, Adhesives, Biometry, Diluents, Dust, Finite element model, Flexible electronics
Proceedings Papers

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Kyle Schulze, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74073
https://doi.org/10.1115/IPACK2021-74073
View Paper titled, Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment
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Topics: Adhesives, Filters, Printing, Silver, Sintering
Proceedings Papers

Additively Printed Flexible Temperature Sensor for Wearable Applications

Pradeep Lall, Hyesoo Jang, Jinesh Narangaparambil, Kartik Goyal, Curtis Hill
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74071
https://doi.org/10.1115/IPACK2021-74071
View Paper titled, Additively Printed Flexible Temperature Sensor for Wearable Applications
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Topics: Reliability, Temperature sensors
Proceedings Papers

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68902
https://doi.org/10.1115/IPACK2021-68902
View Paper titled, Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading
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Topics: Damage, Electrodiffusion, Flexible electronics, Stress
Proceedings Papers

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Pradeep Lall, Kartik Goyal, Kyle Schulze, Curtis Hill
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74063
https://doi.org/10.1115/IPACK2021-74063
View Paper titled, Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate
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Topics: Copper, Electronics, Inks, Sintering