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Proceedings Papers

Users’ Thermal Response to a Simulated Tablet Computer Surface

Han Zhang, Alan Hedge, Beiyuan Guo
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A023, July 6–9, 2015
Paper No: IPACK2015-48787
DOI: https://doi.org/10.1115/IPACK2015-48787
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Topics: Computers, Temperature, Engineering prototypes, Heat, Heating, Aluminum, Design, Sensors, Skin
Proceedings Papers

Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A002, July 6–9, 2015
Paper No: IPACK2015-48239
DOI: https://doi.org/10.1115/IPACK2015-48239
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Topics: Graphene, Strain sensors, Chemical vapor deposition, Copper foil, Deformation, Energy gap, Reactive-ion etching, Tensile deformation, Density functional theory, Electron configuration
Proceedings Papers

The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Luke Yates, Thomas L. Bougher, Thomas Beechem, Baratunde A. Cola, Samuel Graham
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A009, July 6–9, 2015
Paper No: IPACK2015-48259
DOI: https://doi.org/10.1115/IPACK2015-48259
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Topics: Gallium nitride, Interfacial thermal resistance, Stress, Polishing equipment, Electronics, Crystal structure, Electron mobility, Flow (Dynamics), Heat, Reliability
Proceedings Papers

Robust Data Acquisition for Building Lighting Systems

Zak Pearson, Tanya L. Crenshaw, Heather Dillon, Erik Paulson, Nick Warlen
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A016, July 6–9, 2015
Paper No: IPACK2015-48445
DOI: https://doi.org/10.1115/IPACK2015-48445
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Topics: Data acquisition, Heat sinks, Cables, Data acquisition systems, Energy efficiency, Temperature, Thermal management
Proceedings Papers

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A010, July 6–9, 2015
Paper No: IPACK2015-48382
DOI: https://doi.org/10.1115/IPACK2015-48382
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Topics: Convection, Jets, Machinery, Thermal management, Transmission fluids, Heat transfer coefficients, Temperature, Automotive industry, Cooling, Cooling systems
Proceedings Papers

Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating

Tatiana Zolotoukhina
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A003, July 6–9, 2015
Paper No: IPACK2015-48297
DOI: https://doi.org/10.1115/IPACK2015-48297
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Topics: Graphene, Heating, Phonons, Thermal conductivity, Transients (Dynamics), Equilibrium (Physics), High temperature, Density, Dispersion relations, Dynamics (Mechanics)
Proceedings Papers

Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics

Boris Marovic, Mathew Clark, James Petroski
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A017, July 6–9, 2015
Paper No: IPACK2015-48635
DOI: https://doi.org/10.1115/IPACK2015-48635
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Topics: Computational fluid dynamics, Light-emitting diodes, Simulation, Temperature, Workflow
Proceedings Papers

Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method

David B. Brown, Thomas L. Bougher, Baratunde A. Cola, Satish Kumar
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A004, July 6–9, 2015
Paper No: IPACK2015-48444
DOI: https://doi.org/10.1115/IPACK2015-48444
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Topics: Electrical conductance, Graphene, Metals, Thermoreflectance, Chemical vapor deposition, Copper foil
Proceedings Papers

Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

S. A. McElhinney, T. M. Jahns, T. A. Shedd
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A011, July 6–9, 2015
Paper No: IPACK2015-48516
DOI: https://doi.org/10.1115/IPACK2015-48516
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Topics: Cooling, Engines, Motors, Rotors, Machinery, Design, Heat, Manufacturing, Centrifugal force, Chemical processes
Proceedings Papers

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A018, July 6–9, 2015
Paper No: IPACK2015-48175
DOI: https://doi.org/10.1115/IPACK2015-48175
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Topics: Natural convection, Performance characterization, Vapors, Heat, Flat heat pipes, Computer simulation, Condensers (steam plant), Energy dissipation, Heat losses, Temperature distribution
Proceedings Papers

Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance

Thomas L. Bougher, John H. Taphouse, Baratunde A. Cola
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A005, July 6–9, 2015
Paper No: IPACK2015-48587
DOI: https://doi.org/10.1115/IPACK2015-48587
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Topics: Carbon nanotubes, Thermoreflectance, Contact resistance, Heat transfer, Heating, Mechanical properties, Metrology, Probes, Thermal conductivity, Uncertainty
Proceedings Papers

System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles

Kraig J. Olejniczak, Tom Flint, David Simco, Sergei Storkov, Brad McGee, Kenny George, Peter Killeen, Austin Curbow, Robert S. Shaw, Brandon Passmore, Ty R. McNutt
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A012, July 6–9, 2015
Paper No: IPACK2015-48602
DOI: https://doi.org/10.1115/IPACK2015-48602
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Topics: Energy gap, Packaging, Traction, Vehicles, Silicon, Reliability, Capacitors, Cooling, High temperature, Junctions
Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

David H. Altman, Anurag Gupta, Matthew Tyhach
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Paper No: IPACK2015-48179
DOI: https://doi.org/10.1115/IPACK2015-48179
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature
Proceedings Papers

Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices

Tannaz Harirchian, Zuyang Frank Liang, Kyle Yazzie, Michael A. Schroeder, Ashish Gupta, Alan C. Mcallister
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A019, July 6–9, 2015
Paper No: IPACK2015-48367
DOI: https://doi.org/10.1115/IPACK2015-48367
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Topics: Boundary-value problems, Data collection, Design, Junctions, Reliability, Simulation, Skin, Solder joints, Stress, Temperature
Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015
Paper No: IPACK2015-48429
DOI: https://doi.org/10.1115/IPACK2015-48429
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Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes
Proceedings Papers

Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module

Keisuke Horiuchi, Yuichiro Konishi, Atsuo Nishihara
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A013, July 6–9, 2015
Paper No: IPACK2015-48625
DOI: https://doi.org/10.1115/IPACK2015-48625
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Topics: Temperature measurement, Water, Flow (Dynamics), Thermal resistance, Capacitance, Computer simulation, Design, Heat, Heat transfer, Junctions
Proceedings Papers

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

Rick Beyerle, Gary Shives
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A020, July 6–9, 2015
Paper No: IPACK2015-48523
DOI: https://doi.org/10.1115/IPACK2015-48523
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Topics: Graphite, Heat transfer, Computer software, Errors, Flat heat pipes, Heat, Thermal conductivity, Accounting, Adhesives, Computational fluid dynamics
Proceedings Papers

Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Feng Zhou, Yan Liu, Shailesh N. Joshi, Yanghe Liu, Ercan M. Dede
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A008, July 6–9, 2015
Paper No: IPACK2015-48029
DOI: https://doi.org/10.1115/IPACK2015-48029
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Topics: Design, Flow (Dynamics), Manifolds, Microchannels, Cooling, Shapes, Coolants, Temperature, Channel flow, Computer cooling
Proceedings Papers

Design Considerations of Packaging a High Voltage Current Switch

Ankan De, Adam Morgan, Subhashish Bhattacharya, Douglas C. Hopkins
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A014, July 6–9, 2015
Paper No: IPACK2015-48714
DOI: https://doi.org/10.1115/IPACK2015-48714
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Topics: Design, Packaging, Switches, Anodes, Computer software, Current density, Electromagnetic fields, Gates (Closures), Packing (Shipments), Packings (Cushioning)
Proceedings Papers

Thermal Performance Enhancement of Glass Interposer

Sangbeom Cho, Yogendra K. Joshi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A021, July 6–9, 2015
Paper No: IPACK2015-48563
DOI: https://doi.org/10.1115/IPACK2015-48563
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Topics: Glass, Electronics, Packaging, Brittleness, Computer simulation, Cooling, Copper, Design, Electrical resistivity, Modeling