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Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

David H. Altman, Anurag Gupta, Matthew Tyhach
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48179
https://doi.org/10.1115/IPACK2015-48179
View Paper titled, Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature
Proceedings Papers

Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices

Tannaz Harirchian, Zuyang Frank Liang, Kyle Yazzie, Michael A. Schroeder, Ashish Gupta, Alan C. Mcallister
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48367
https://doi.org/10.1115/IPACK2015-48367
View Paper titled, Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices
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Topics: Boundary-value problems, Data collection, Design, Junctions, Reliability, Simulation, Skin, Solder joints, Stress, Temperature
Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48429
https://doi.org/10.1115/IPACK2015-48429
View Paper titled, Advanced Cooling Designs for GaN-on-Diamond MMICs
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Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes
Proceedings Papers

Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module

Keisuke Horiuchi, Yuichiro Konishi, Atsuo Nishihara
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48625
https://doi.org/10.1115/IPACK2015-48625
View Paper titled, Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module
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Topics: Temperature measurement, Water, Flow (Dynamics), Thermal resistance, Capacitance, Computer simulation, Design, Heat, Heat transfer, Junctions
Proceedings Papers

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

Rick Beyerle, Gary Shives
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48523
https://doi.org/10.1115/IPACK2015-48523
View Paper titled, Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications
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Topics: Graphite, Heat transfer, Computer software, Errors, Flat heat pipes, Heat, Thermal conductivity, Accounting, Adhesives, Computational fluid dynamics
Proceedings Papers

Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Feng Zhou, Yan Liu, Shailesh N. Joshi, Yanghe Liu, Ercan M. Dede
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48029
https://doi.org/10.1115/IPACK2015-48029
View Paper titled, Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate
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Topics: Design, Flow (Dynamics), Manifolds, Microchannels, Cooling, Shapes, Coolants, Temperature, Channel flow, Computer cooling
Proceedings Papers

Design Considerations of Packaging a High Voltage Current Switch

Ankan De, Adam Morgan, Subhashish Bhattacharya, Douglas C. Hopkins
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48714
https://doi.org/10.1115/IPACK2015-48714
View Paper titled, Design Considerations of Packaging a High Voltage Current Switch
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Topics: Design, Packaging, Switches, Anodes, Computer software, Current density, Electromagnetic fields, Gates (Closures), Packing (Shipments), Packings (Cushioning)
Proceedings Papers

Thermal Performance Enhancement of Glass Interposer

Sangbeom Cho, Yogendra K. Joshi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A021, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48563
https://doi.org/10.1115/IPACK2015-48563
View Paper titled, Thermal Performance Enhancement of Glass Interposer
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Topics: Glass, Electronics, Packaging, Brittleness, Computer simulation, Cooling, Copper, Design, Electrical resistivity, Modeling
Proceedings Papers

The Contribution of the Bulk Modes on Electrical Conductivity in 3D Topological Insulators

Gulru Babac
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48213
https://doi.org/10.1115/IPACK2015-48213
View Paper titled, The Contribution of the Bulk Modes on Electrical Conductivity in 3D Topological Insulators
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Topics: Electrical conductivity, Magnetic fields
Proceedings Papers

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48326
https://doi.org/10.1115/IPACK2015-48326
View Paper titled, Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems
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Topics: Cavities, Proteins, Silicones, Biomaterials, Computational fluid dynamics, Light-emitting diodes, Phosphors, Polymers, Thermal conductivity, Absorption
Proceedings Papers

Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations

Carin Lundquist Ruiz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48769
https://doi.org/10.1115/IPACK2015-48769
View Paper titled, Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations
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Topics: Design, Modeling, Cutting, Engineers, Light-emitting diodes, Simulation, Structural design
Proceedings Papers

Users’ Thermal Response to a Simulated Tablet Computer Surface

Han Zhang, Alan Hedge, Beiyuan Guo
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48787
https://doi.org/10.1115/IPACK2015-48787
View Paper titled, Users’ Thermal Response to a Simulated Tablet Computer Surface
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Topics: Computers, Temperature, Engineering prototypes, Heat, Heating, Aluminum, Design, Sensors, Skin
Proceedings Papers

Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48239
https://doi.org/10.1115/IPACK2015-48239
View Paper titled, Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons
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Topics: Graphene, Strain sensors, Chemical vapor deposition, Copper foil, Deformation, Energy gap, Reactive-ion etching, Tensile deformation, Density functional theory, Electron configuration
Proceedings Papers

The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Luke Yates, Thomas L. Bougher, Thomas Beechem, Baratunde A. Cola, Samuel Graham
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48259
https://doi.org/10.1115/IPACK2015-48259
View Paper titled, The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers
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Topics: Gallium nitride, Interfacial thermal resistance, Stress, Polishing equipment, Electronics, Crystal structure, Electron mobility, Flow (Dynamics), Heat, Reliability
Proceedings Papers

Robust Data Acquisition for Building Lighting Systems

Zak Pearson, Tanya L. Crenshaw, Heather Dillon, Erik Paulson, Nick Warlen
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48445
https://doi.org/10.1115/IPACK2015-48445
View Paper titled, Robust Data Acquisition for Building Lighting Systems
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Topics: Data acquisition, Heat sinks, Cables, Data acquisition systems, Energy efficiency, Temperature, Thermal management
Proceedings Papers

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48382
https://doi.org/10.1115/IPACK2015-48382
View Paper titled, Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management
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Topics: Convection, Jets, Machinery, Thermal management, Transmission fluids, Heat transfer coefficients, Temperature, Automotive industry, Cooling, Cooling systems
Proceedings Papers

Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating

Tatiana Zolotoukhina
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48297
https://doi.org/10.1115/IPACK2015-48297
View Paper titled, Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating
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Topics: Graphene, Heating, Phonons, Thermal conductivity, Transients (Dynamics), Equilibrium (Physics), High temperature, Density, Dispersion relations, Dynamics (Mechanics)
Proceedings Papers

Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics

Boris Marovic, Mathew Clark, James Petroski
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48635
https://doi.org/10.1115/IPACK2015-48635
View Paper titled, Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Light-emitting diodes, Simulation, Temperature, Workflow
Proceedings Papers

Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method

David B. Brown, Thomas L. Bougher, Baratunde A. Cola, Satish Kumar
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48444
https://doi.org/10.1115/IPACK2015-48444
View Paper titled, Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method
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Topics: Electrical conductance, Graphene, Metals, Thermoreflectance, Chemical vapor deposition, Copper foil
Proceedings Papers

Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

S. A. McElhinney, T. M. Jahns, T. A. Shedd
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48516
https://doi.org/10.1115/IPACK2015-48516
View Paper titled, Centrifugally Pumped Thermosiphons for Motor Rotor Cooling
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Topics: Cooling, Engines, Motors, Rotors, Machinery, Design, Heat, Manufacturing, Centrifugal force, Chemical processes