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Proceedings Papers

An Accurate and Efficient Link Analysis Methodology for High Speed I/O Design

Mohiuddin Mazumder, James Jaussi, Sitaraman Iyer, Fulvio Spagna, Zuoguo Wu, Beomtaek Lee, Arvind Kumar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 653-661, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52279
https://doi.org/10.1115/IPACK2011-52279
View Paper titled, An Accurate and Efficient Link Analysis Methodology for High Speed I/O Design
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Topics: Design, Circuits, Engineering simulation, Optimization, Simulation, Modeling
Proceedings Papers

Cloud-Based Scalable Parallel Electromagnetic Tools for Full-System Simulation

Vikram Jandhyala, Dipanjan Gope, Swagato Chakraborty, Xiren Wang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 663-669, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52280
https://doi.org/10.1115/IPACK2011-52280
View Paper titled, Cloud-Based Scalable Parallel Electromagnetic Tools for Full-System Simulation
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Topics: Simulation, Algorithms, Boundary element methods, Computer software, Electromagnetic fields, Electronics, Encryption, Fault tolerance, Security
Proceedings Papers

Signal Integrity Analysis for RF System-in-Package

Jeff Chen, Weiping Li, Feng Ling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 671-674, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52282
https://doi.org/10.1115/IPACK2011-52282
View Paper titled, Signal Integrity Analysis for RF System-in-Package
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Topics: Signals, System-in-package, Design methodology, Architects, Design, Electromagnetic compatibility, Engineering simulation, Noise (Sound), Packaging, Simulation
Proceedings Papers

Power/Ground Pin-Map Design for Power Integrity

Jingook Kim, James Drewniak, Jun Fan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 675-679, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52287
https://doi.org/10.1115/IPACK2011-52287
View Paper titled, Power/Ground Pin-Map Design for Power Integrity
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Topics: Design, Circuits, Cavities, Performance, Resonance
Proceedings Papers

Microprocessor Package Embedded Thin Film Capacitor for Power Delivery Improvement

Michael J. Hill, Kemal Aygun, Kaladhar Radhakrishnan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 627-631, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52254
https://doi.org/10.1115/IPACK2011-52254
View Paper titled, Microprocessor Package Embedded Thin Film Capacitor for Power Delivery Improvement
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Topics: Capacitors, Thin films, Engineering prototypes
Proceedings Papers

Estimation of Power Integrity Impact to Low Power Processor Performance Through Pre-Silicon Simulation and Post-Silicon Measurements

Christopher Pan, Amirali Shayan, Mikhail Popovich, Kevin Bowles
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 681-684, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52291
https://doi.org/10.1115/IPACK2011-52291
View Paper titled, Estimation of Power Integrity Impact to Low Power Processor Performance Through Pre-Silicon Simulation and Post-Silicon Measurements
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Topics: Silicon, Simulation, Nanoscale phenomena
Proceedings Papers

Use Condition Characterization of Package Components

Leigh Wojewoda, Dhanya Athreya, Michael J. Hill
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 633-639, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52268
https://doi.org/10.1115/IPACK2011-52268
View Paper titled, Use Condition Characterization of Package Components
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Topics: Capacitors, Design, Electronic packages, Inductors, Metallic composites, Printed circuit boards
Proceedings Papers

Signal and Power Integrity Co-Simulation on DDR Memory

Md. Ruhul Quddus, Sanjiv Soman
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 641-646, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52274
https://doi.org/10.1115/IPACK2011-52274
View Paper titled, Signal and Power Integrity Co-Simulation on DDR Memory
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Topics: Signals, Simulation, Noise (Sound)
Proceedings Papers

A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design

Qing He, Duo Chen, Dan Jiao
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 647-652, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52276
https://doi.org/10.1115/IPACK2011-52276
View Paper titled, A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design
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Topics: Circuits, Design, Simulation, Capacitors, Complementary metal oxide semiconductors, Computation, Electromagnetic force, Electromagnetism, Inductors, Resistors