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Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang, Oscar Chuang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6541
https://doi.org/10.1115/IPACK2019-6541
View Paper titled, Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design
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Topics: Design, Finite element analysis, Lamination, Light-emitting diodes, Simulation, Stress, Adhesives, Coatings, Fatigue, Materials properties
Proceedings Papers

Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

M. Niessner, G. Haubner, W. Hartner, S. Pahlke
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8379
https://doi.org/10.1115/IPACK2018-8379
View Paper titled, Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach
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Topics: Design, Radar, Reliability, Solder joints, Simulation, Laminates, Accelerated life testing, Ball-Grid-Array packaging, Materials properties, Mechanical properties
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74278
https://doi.org/10.1115/IPACK2017-74278
View Paper titled, A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations

Keishi Okamoto, Sayuri Kohara, Hiroyuki Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74098
https://doi.org/10.1115/IPACK2017-74098
View Paper titled, Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations
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Topics: Manufacturing, Materials properties, Warping, Copper, Design, Finite element analysis, Simulation, Young's modulus, Errors, Flip-chip
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48389
https://doi.org/10.1115/IPACK2015-48389
View Paper titled, A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures
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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

Influences of Specimen Size and Annealing Temperature on Mechanical Reliability of FIB-Fabricated Si Nanowires for NEMS

Tatsuya Fujii, Koichi Sudoh, Shozo Inoue, Takahiro Namazu
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73310
https://doi.org/10.1115/IPACK2013-73310
View Paper titled, Influences of Specimen Size and Annealing Temperature on Mechanical Reliability of FIB-Fabricated Si Nanowires for NEMS
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Topics: Annealing, Nanoelectromechanical systems, Nanowires, Reliability, Temperature, Manufacturing, Silicon, Young's modulus, Damage, Focused ion beams
Proceedings Papers

Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)

Jae B. Kwak, Da Yu, Tung T. Nguyen, Seungbae Park
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 307-316, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52233
https://doi.org/10.1115/IPACK2011-52233
View Paper titled, Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)
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Topics: Flip-chip packages, Reliability, Solder joints, Solders, Finite element analysis, Corners (Structural elements), Stress, Thermomechanics, Chemical etching, Damage
Proceedings Papers

Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

Kanji Takagi, Masaki Wakabayashi, Junichi Inoue, Qiang Yu, Takahiro Akutsu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 143-148, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52044
https://doi.org/10.1115/IPACK2011-52044
View Paper titled, Study on High Reliability of Lead-Free Solder Joint on Metal Substrate
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Topics: Lead-free solders, Metals, Reliability, Rupture, Solder joints, Crack propagation, Heating, Temperature, Thermal conductivity, Design methodology
Proceedings Papers

Stress Mapping Below Flip-Chip Bumps With High Spatial Resolution Using Piezoresistive CMOS Sensors

Benjamin Lemke, Oliver Paul, Shankar Ganapathysubramanian, Patrick Nardi, Rajashree Baskaran
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 35-44, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52124
https://doi.org/10.1115/IPACK2011-52124
View Paper titled, Stress Mapping Below Flip-Chip Bumps With High Spatial Resolution Using Piezoresistive CMOS Sensors
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Topics: Complementary metal oxide semiconductors, Flip-chip, Resolution (Optics), Sensors, Stress, Compression, Shear (Mechanics), Computer simulation, Shear stress, Adhesion
Proceedings Papers

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 353-359, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89079
https://doi.org/10.1115/InterPACK2009-89079
View Paper titled, Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Fracture (Materials), Fatigue strength, Grain boundaries, Brittle fracture, Ductile fracture, Fatigue testing
Proceedings Papers

A Study of Acoustic Emission Produced by Strength Test on Bio-Ceramics: The Dependency of Roughness on Mechanical and AE Characteristics

Mitsuyuki Nakayama, Hideto Suzuki
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 365-370, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89119
https://doi.org/10.1115/InterPACK2009-89119
View Paper titled, A Study of Acoustic Emission Produced by Strength Test on Bio-Ceramics: The Dependency of Roughness on Mechanical and AE Characteristics
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Topics: Acoustic emissions, Ceramics, Surface roughness, Bone, Mechanical properties, Elasticity, Fracture mechanics, Speed of sound, Stress, Young's modulus
Proceedings Papers

Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films

Muneyuki Otani, Kazuhiko Sakutani, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 735-741, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33261
https://doi.org/10.1115/IPACK2007-33261
View Paper titled, Micro Texture-Induced Variation of Mechanical Properties of Electroplated Copper Thin Films
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Young's modulus, Bulk solids, Grain boundaries, Cold rolling, Deformation, Elasticity
Proceedings Papers

A Study of Acoustic Emission Produced by Strength Test on Bio-Ceramics: Dependency of AE Duration Time and Mean Frequency on the Material Property

Mitsuyuki Nakayama
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 961-964, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33259
https://doi.org/10.1115/IPACK2007-33259
View Paper titled, A Study of Acoustic Emission Produced by Strength Test on Bio-Ceramics: Dependency of AE Duration Time and Mean Frequency on the Material Property
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Topics: Acoustic emissions, Ceramics, Materials properties, Biomaterials, Bone, Mechanical properties, Phase transitions, Waves, Young's modulus
Proceedings Papers

High Precision Young’s Modulus Extraction of Thin Films Through Measuring the Electric-Circuit Behavior of Microstructures

Yuh-Chung Hu, Wei-Hsin Gau, Wei-Hsiang Tu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1743-1747, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73337
https://doi.org/10.1115/IPACK2005-73337
View Paper titled, High Precision Young’s Modulus Extraction of Thin Films Through Measuring the Electric-Circuit Behavior of Microstructures
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Topics: Circuits, Microelectromechanical systems, Thin films, Young's modulus
Proceedings Papers

A Basic Study of Characteristics Between Stress and Deflection on Strength Test of Bio-Ceramics

Mitsuyuki Nakayama, Hideto Suzuki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1715-1718, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73147
https://doi.org/10.1115/IPACK2005-73147
View Paper titled, A Basic Study of Characteristics Between Stress and Deflection on Strength Test of Bio-Ceramics
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Topics: Ceramics, Deflection, Stress, Biomaterials, Bone, Young's modulus, Materials properties, Mechanical properties
Proceedings Papers

Characterization of Time and Temperature Dependent Mechanical Behavior of Underfill Materials in Electronic Packaging Application

Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 473-483, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35232
https://doi.org/10.1115/IPACK2003-35232
View Paper titled, Characterization of Time and Temperature Dependent Mechanical Behavior of Underfill Materials in Electronic Packaging Application
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Topics: Creep, Electronic packaging, Mechanical behavior, Temperature, Testing, Thermomechanics, Adhesion, Solder masks, Deformation, Stress
Proceedings Papers

Effective Thermophysical Properties of Thermal Interface Materials: Part I — Definitions and Models

I. Savija, J. R. Culham, M. M. Yovanovich
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 189-200, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35088
https://doi.org/10.1115/IPACK2003-35088
View Paper titled, Effective Thermophysical Properties of Thermal Interface Materials: Part I — Definitions and Models
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Topics: ASTM International, Solids, Stress, Thermal conductivity, Thermal resistance, Young's modulus
Proceedings Papers

Effective Thermophysical Properties of Thermal Interface Materials: Part II — Experiments and Data

I. Savija, J. R. Culham, M. M. Yovanovich
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 567-573, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35264
https://doi.org/10.1115/IPACK2003-35264
View Paper titled, Effective Thermophysical Properties of Thermal Interface Materials: Part II — Experiments and Data
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Topics: ASTM International, Cycles, Modeling, Pressure, Temperature, Thermal conductivity, Thermal expansion, Thermal resistance, Vacuum, Young's modulus