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Proceedings Papers

Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms

Myunghoon Lee, Lindo Arimpoor Pallan Ouseph, Vamsi Krishna Yaddanapudi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141171
https://doi.org/10.1115/IPACK2024-141171
View Paper titled, Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms
Open the PDF for Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms in another window
Topics: Computational fluid dynamics, Design, Evolutionary algorithms, Optimization, Workflow, Delays, Energy consumption, Intellectual property, Temperature, Thermal analysis
Proceedings Papers

Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics

Boris Marovic, Mathew Clark, James Petroski
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48635
https://doi.org/10.1115/IPACK2015-48635
View Paper titled, Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics
Open the PDF for Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics in another window
Topics: Computational fluid dynamics, Light-emitting diodes, Simulation, Temperature, Workflow