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Proceedings Papers

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73127
https://doi.org/10.1115/IPACK2005-73127
View Paper titled, 3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies
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Topics: Millimeter waves, Design, Ceramics, Filters, Dimensions, Electromagnetic spectrum, Filtration, Internet, Liquid crystalline polymers, Low temperature
Proceedings Papers

Integration of RF Inductors and Baluns in Multilayer Organic Substrates

Telesphor Kamgaing, Chee Hoo Lee, Kyu-Pyung Hwang, Xiang Yin Zeng, Jiangqi He, Rockwell Hsu, Yongki Min, Jae-Yong Ihm
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1973-1977, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73316
https://doi.org/10.1115/IPACK2005-73316
View Paper titled, Integration of RF Inductors and Baluns in Multilayer Organic Substrates
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Topics: Inductors, Design, Modeling, Simulation, Wireless LAN
Proceedings Papers

Embedded RF Filters for WLAN and Bluetooth Applications

Telesphor Kamgaing, Jiangqi He, Rockwell Hsu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1621-1624, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73319
https://doi.org/10.1115/IPACK2005-73319
View Paper titled, Embedded RF Filters for WLAN and Bluetooth Applications
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Topics: Filters, Wireless LAN, Ceramics, Design, Low-pass filters, Manufacturing
Proceedings Papers

RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems

M. Tentzeris, J. Laskar
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 19-24, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35360
https://doi.org/10.1115/IPACK2003-35360
View Paper titled, RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems
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Topics: Architecture, Cavities, Filters, Finite difference time-domain analysis, Inductors, Manufacturing, Microelectromechanical systems, Modeling, Q-factor, Simulation