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Proceedings Papers

Variable Area Jet Impingement for High Voltage Power Electronics

Reece Whitt, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
https://doi.org/10.1115/IPACK2023-111996
View Paper titled, Variable Area Jet Impingement for High Voltage Power Electronics
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Topics: Electronics, Nozzles, Convection, Coolants, Cooling, Flow (Dynamics), Impingement cooling, Reliability, Temperature, Transients (Dynamics)
Proceedings Papers

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74060
https://doi.org/10.1115/IPACK2021-74060
View Paper titled, Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications
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Topics: Electronics, Reliability, Surface preparation, Stress, Adhesives, Biometry, Diluents, Dust, Finite element model, Flexible electronics
Proceedings Papers

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74173
https://doi.org/10.1115/IPACK2017-74173
View Paper titled, Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering
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Topics: Lasers, Manufacturing, Microscale devices, Sintering, Fluence (Radiation measurement), Additive manufacturing, Copper, Density, Design, Energy dissipation
Proceedings Papers

Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency

Jingshi Meng, Abhijit Dasgupta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A042, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48669
https://doi.org/10.1115/IPACK2015-48669
View Paper titled, Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency
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Topics: Failure mechanisms, Resonance, Reflection, Stress, Circuits, Diluents, Disperse systems, Electrical wires, Impulse (Physics), Microelectromechanical systems
Proceedings Papers

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Kazuaki Yazawa, Dustin Kendig, James Christofferson, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73104
https://doi.org/10.1115/IPACK2013-73104
View Paper titled, A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance
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Topics: Electron emission, Failure analysis, Imaging, Thermoreflectance, Circuits, Emissions, Failure, Electrons, Silicon, Temperature
Proceedings Papers

A Quantum Mechanical Study of the Thermal Conduction Across a ZrB 2 -SiC Interface as a Function of Temperature and Strain

Vikas Samvedi, Vikas Tomar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 357-359, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52283
https://doi.org/10.1115/IPACK2011-52283
View Paper titled, A Quantum Mechanical Study of the Thermal Conduction Across a ZrB 2 -SiC Interface as a Function of Temperature and Strain
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Topics: Heat conduction, Temperature, Nanocomposites, Density functional theory, Thermal properties, Waves
Proceedings Papers

High Performance Thermal Conductive Sheets Made of Carbon Fibers

Keisuke Aramaki, Hiroyuki Ryoson, Yuichi Ishida
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 305-309, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52218
https://doi.org/10.1115/IPACK2011-52218
View Paper titled, High Performance Thermal Conductive Sheets Made of Carbon Fibers
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Topics: Carbon fibers, Resins, Thermal conductivity, Compressibility, Cooling systems, Fibers, Particulate matter, Aluminum, ASTM International, Contact resistance
Proceedings Papers

An Innovative Way to Measure Temperature by Using the Faraday Effect

Pranav Limaye, Anisur Rehman
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 293-296, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52202
https://doi.org/10.1115/IPACK2011-52202
View Paper titled, An Innovative Way to Measure Temperature by Using the Faraday Effect
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Topics: Faraday effect, Temperature, Magnetic fields, Cables, Electromagnetic interference, Fibers, Insulation, Magnets, Optical fiber, Permanent magnets
Proceedings Papers

Energy Conversion Efficiency of Synthetic Jets

Ri Li, Rajdeep Sharma, Mehmet Arik
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 115-122, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52034
https://doi.org/10.1115/IPACK2011-52034
View Paper titled, Energy Conversion Efficiency of Synthetic Jets
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Topics: Energy conversion, Jets, Electricity (Physics), Energy efficiency, Signals, Actuators, Air flow, Design, Piezoelectric actuators, Cooling
Proceedings Papers

Numerical Calculation for Phonon Properties of a Nano-Porous Si

Koji Miyazaki, Daisuke Nagai, Yohei Kido, Hiroshi Tsukamoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 557-561, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89118
https://doi.org/10.1115/InterPACK2009-89118
View Paper titled, Numerical Calculation for Phonon Properties of a Nano-Porous Si
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Topics: Phonons, Fourier transforms, Thermal conductivity, Boundary-value problems, Crystals, Density, Heat conduction, Mean free path, Molecular dynamics simulation, Nanostructures
Proceedings Papers

Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin

Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 569-574, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89146
https://doi.org/10.1115/InterPACK2009-89146
View Paper titled, Remote Strain Measurement by Multi-Walled Carbon Nanotube-Dispersed Resin
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Topics: Carbon, Nanotubes, Resins, Strain measurement, Carbon nanotubes, Electrical resistance, Waves, Electrical conductivity, Thermal conductivity, Thin films
Proceedings Papers

Numerical Solutions of Poisson Equation by the CIP-Basis Set Method

Daisuke Shibata, Takayuki Utsumi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 91-98, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89150
https://doi.org/10.1115/InterPACK2009-89150
View Paper titled, Numerical Solutions of Poisson Equation by the CIP-Basis Set Method
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Topics: Poisson equation, Waves, Polynomials, Computers, Crystals, Density, Eigenvalues, Electron configuration, Electrons, Errors
Proceedings Papers

Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times

Chunjian Ni, Jayathi Y. Murthy
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 99-109, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89181
https://doi.org/10.1115/InterPACK2009-89181
View Paper titled, Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times
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Topics: Anisotropy, Modeling, Phonons, Relaxation (Physics), Electromagnetic scattering, Radiation scattering, Scattering (Physics), Silicon, Accounting, Equilibrium (Physics)
Proceedings Papers

Micro-Raman Thermometry of Laser Heated Surfaces

Justin R. Serrano, Leslie M. Phinney
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 327-333, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33571
https://doi.org/10.1115/IPACK2007-33571
View Paper titled, Micro-Raman Thermometry of Laser Heated Surfaces
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Topics: Lasers, Temperature measurement, Temperature, Polysilicon, Computer simulation, Data collection, Heating, Infrared imaging, Microelectromechanical systems, Microscopy
Proceedings Papers

Packaging of an Iron-Gallium Nanowire Acoustic Sensor for Under-Water Applications

Rupal Jain, F. Patrick McCluskey, Alison B. Flatau
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 825-829, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33455
https://doi.org/10.1115/IPACK2007-33455
View Paper titled, Packaging of an Iron-Gallium Nanowire Acoustic Sensor for Under-Water Applications
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Topics: Acoustics, Gallium, Iron, Nanowires, Packaging, Sensors, Water, Waves, Absorption, Ear
Proceedings Papers

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

Ken-Ichi Ohguchi, Katsuhiko Sasaki, Setsuo Aso
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 107-113, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33663
https://doi.org/10.1115/IPACK2007-33663
View Paper titled, Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
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Topics: Lead-free solders, Creep, Alloys, Constitutive equations, Deformation, Engineering simulation, Simulation, Solders, Stress, Stress-strain relations
Proceedings Papers

A Study of Acoustic Emission Produced by Strength Test on Bio-Ceramics: Dependency of AE Duration Time and Mean Frequency on the Material Property

Mitsuyuki Nakayama
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 961-964, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33259
https://doi.org/10.1115/IPACK2007-33259
View Paper titled, A Study of Acoustic Emission Produced by Strength Test on Bio-Ceramics: Dependency of AE Duration Time and Mean Frequency on the Material Property
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Topics: Acoustic emissions, Ceramics, Materials properties, Biomaterials, Bone, Mechanical properties, Phase transitions, Waves, Young's modulus
Proceedings Papers

Laser-Induced Damage of Polycrystalline Silicon Optically Powered MEMS Actuators

Justin R. Serrano, Leslie M. Phinney, Carlton F. Brooks
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 761-766, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73322
https://doi.org/10.1115/IPACK2005-73322
View Paper titled, Laser-Induced Damage of Polycrystalline Silicon Optically Powered MEMS Actuators
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Topics: Actuators, Damage, Lasers, Microelectromechanical systems, Polysilicon, Energy dissipation, Imaging, Irradiation (Radiation exposure), Micromachining, Waves
Proceedings Papers

Accelerated Convergence for Lumped-Elements Based on-Package RF Passives Design by Using Curve Fitted Formula

Xiangyin Zeng, Jiangqi He, Baoshu Xu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1969-1972, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73308
https://doi.org/10.1115/IPACK2005-73308
View Paper titled, Accelerated Convergence for Lumped-Elements Based on-Package RF Passives Design by Using Curve Fitted Formula
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Topics: Capacitors, Design, Inductors, Capacitance, Computer software, Curve fitting, Errors, Filters, Q-factor, Tolerance analysis
Proceedings Papers

Modeling of Electron Transport in Thin Films With Quantum and Scattering Effects

A. Bulusu, D. G. Walker
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1427-1432, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73212
https://doi.org/10.1115/IPACK2005-73212
View Paper titled, Modeling of Electron Transport in Thin Films With Quantum and Scattering Effects
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Topics: Electromagnetic scattering, Electron transport, Modeling, Radiation scattering, Scattering (Physics), Thin films, Equilibrium (Physics), Phonons, Dimensions, Electrons