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Proceedings Papers

Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink

Michael Ozeh, A. G. Agwu Nnanna
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A013, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8354
https://doi.org/10.1115/IPACK2018-8354
View Paper titled, Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink
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Topics: Generators, Heat recovery, Heat sinks, Heat pipes, Nanoparticles, Electronics, Heat, Heat exchangers, Metals, Temperature gradient
Proceedings Papers

Harvesting CPU Waste Heat Through Pyroelectric Materials

Soochan Lee, Nishant Singh, Patrick E. Phelan, Carole-Jean Wu
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A079, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48421
https://doi.org/10.1115/IPACK2015-48421
View Paper titled, Harvesting CPU Waste Heat Through Pyroelectric Materials
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Topics: Waste heat, Heat, Temperature, Materials properties, Thermal conductivity, Computation, Electric power generation, Energy dissipation, Energy efficiency, Energy generation
Proceedings Papers

Art and Science Towards Noiseless Driving of Liquid Metal for Advanced Thermal Management of High Heat Flux Device

Jing Liu, Zhong-Shan Deng, Zhi-Zhu He
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A059, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48698
https://doi.org/10.1115/IPACK2015-48698
View Paper titled, Art and Science Towards Noiseless Driving of Liquid Metal for Advanced Thermal Management of High Heat Flux Device
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Topics: Heat flux, Liquid metals, Thermal management, Cooling, Coolants, Flow (Dynamics), Energy consumption, Heat, Batteries, Design
Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48429
https://doi.org/10.1115/IPACK2015-48429
View Paper titled, Advanced Cooling Designs for GaN-on-Diamond MMICs
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Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes
Proceedings Papers

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Vibhash Jha, Serguei Dessiatoun, Michael Ohadi, Amir Shooshtari, Ebrahim Al-Hajri
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 277-283, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52179
https://doi.org/10.1115/IPACK2011-52179
View Paper titled, High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications
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Topics: Heat recovery, Heat transfer, Flow (Dynamics), Heat transfer coefficients, Pressure drop, Refrigerants, Thermal management, Absorption, Cooling, Electronic products
Proceedings Papers

Exergy Analysis and Entropy Generation Minimization of Thermoelectric Waste Heat Recovery for Electronics

Kazuaki Yazawa, Ali Shakouri
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 741-747, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52191
https://doi.org/10.1115/IPACK2011-52191
View Paper titled, Exergy Analysis and Entropy Generation Minimization of Thermoelectric Waste Heat Recovery for Electronics
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Topics: Electronics, Entropy, Exergy analysis, Heat recovery, Heat, Electronic systems, Brayton cycle, Design, Energy / power systems, Energy conversion
Proceedings Papers

A Computational Study of the Thermal Performance of a 69kV/3000A Solid State Current Limiter Under Transient Fault Current Loading

Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 693-699, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89071
https://doi.org/10.1115/InterPACK2009-89071
View Paper titled, A Computational Study of the Thermal Performance of a 69kV/3000A Solid State Current Limiter Under Transient Fault Current Loading
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Topics: Transients (Dynamics), Inductors, Cooling, Forced convection, Operating temperature, Steady state, Temperature, Waste heat
Proceedings Papers

Hot Spot Cooling Using Recycled Energy

Chien Ouyang, Kenny Gross, Ali Heydari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 259-263, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33875
https://doi.org/10.1115/IPACK2007-33875
View Paper titled, Hot Spot Cooling Using Recycled Energy
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Topics: Cooling, Energy efficiency, Computers, Recycling, Reliability, Temperature gradient, Waste heat
Proceedings Papers

High Coefficient of Performance Quantum Well Thermoelectric Nano Cooler

Velimir Jovanovic, Saeid Ghamaty, Daniel Krommenhoek, John C. Bass
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 595-601, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33838
https://doi.org/10.1115/IPACK2007-33838
View Paper titled, High Coefficient of Performance Quantum Well Thermoelectric Nano Cooler
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Topics: Quantum wells, Cooling, Sensors, Temperature, National Institute of Standards and Technology, Thin films, Air conditioning, Compression, Compressors, Cooling systems
Proceedings Papers

Design of an Absorption Based Miniature Heat Pump System for Cooling of High Power Microprocessors

Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 69-77, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33245
https://doi.org/10.1115/IPACK2007-33245
View Paper titled, Design of an Absorption Based Miniature Heat Pump System for Cooling of High Power Microprocessors
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Topics: Absorption, Cooling, Design, Heat pumps, Condensers (steam plant), Microchannels, Fluids, Temperature, Water vapor, Compression
Proceedings Papers

Thermal Management for Chip-Scale Atomic Clocks

Alexander Laws, Richard Y. J. Chang, Victor M. Bright, Y. C. Lee
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 741-745, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73444
https://doi.org/10.1115/IPACK2005-73444
View Paper titled, Thermal Management for Chip-Scale Atomic Clocks
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Topics: Atomic clocks, Thermal management, Temperature, Switches, Clocks, Design, Energy dissipation, Vehicles, Waste heat, Cavities
Proceedings Papers

Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings

R. McCarty, K. P. Hallinan, B. Sanders, T. Somphone
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2109-2122, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73010
https://doi.org/10.1115/IPACK2005-73010
View Paper titled, Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings
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Topics: Energy recovery, Heat, Temperature, Thermoelectric devices, Aerospace industry, Computer simulation, Exergy, Heat recovery, Switches, Waste heat
Proceedings Papers

An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment

Robert A. Taylor, Gary L. Solbrekken
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2139-2145, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73190
https://doi.org/10.1115/IPACK2005-73190
View Paper titled, An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment
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Topics: Electronic equipment, Optimization, Refrigeration, Heat sinks, Temperature, Junctions, Cooling, Geometry, Electronics, Heat
Proceedings Papers

Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars

James S. Wilson
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 545-550, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35256
https://doi.org/10.1115/IPACK2003-35256
View Paper titled, Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars
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Topics: Design, Electricity (Physics), Energy dissipation, Energy generation, Heat, Integrated circuits, Junctions, Microwaves, Packaging, Radar