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Proceedings Papers

Application of the Reflowable Magnetic Jig on Thin MCM Package for Warpage Control

Jong-Chan Park, Young-Min Kim, Gil-Ho Lee, Hyeong-Kwan Kim, Tae-Keun Lee
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109453
https://doi.org/10.1115/IPACK2023-109453
View Paper titled, Application of the Reflowable Magnetic Jig on Thin MCM Package for Warpage Control
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Topics: Jigs and fixtures, Shades and shadows, Soldering, Warping
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2528
https://doi.org/10.1115/IPACK2020-2528
View Paper titled, Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances
Proceedings Papers

The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods

Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2555
https://doi.org/10.1115/IPACK2020-2555
View Paper titled, The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
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Topics: Bifurcation, Experimental methods, Gravity (Force), Packaging, Semiconductor wafers, Warping
Proceedings Papers

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2614
https://doi.org/10.1115/IPACK2020-2614
View Paper titled, PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
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Topics: Printed circuit boards, Thermomechanics, Stress, Ceramics, Control panels, Deformation, Electronic components, Experimental methods, Finite element analysis, Reliability
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Double Side System in Package Development Challenge for Heterogeneous Integration

Feng Kao, Yu-Po Wang, Davidlion Wang, Jensen Tsai, Mike Tsai, Ryan Chiu, Eric He
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6354
https://doi.org/10.1115/IPACK2019-6354
View Paper titled, Double Side System in Package Development Challenge for Heterogeneous Integration
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Topics: System-in-package, Molding, Simulation, Accelerated life testing, Copper, Design, Energy dissipation, Internet of things, Manufacturing, Packaging
Proceedings Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6507
https://doi.org/10.1115/IPACK2019-6507
View Paper titled, Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads
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Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8254
https://doi.org/10.1115/IPACK2018-8254
View Paper titled, Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
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Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry
Proceedings Papers

Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations

Keishi Okamoto, Sayuri Kohara, Hiroyuki Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74098
https://doi.org/10.1115/IPACK2017-74098
View Paper titled, Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations
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Topics: Manufacturing, Materials properties, Warping, Copper, Design, Finite element analysis, Simulation, Young's modulus, Errors, Flip-chip
Proceedings Papers

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74026
https://doi.org/10.1115/IPACK2017-74026
View Paper titled, Large Flip Chip Assembly Challenges and Risk Mitigation Process
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Topics: Ball-Grid-Array packaging, Copper, Cracking (Materials), Delamination, Failure, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flip-chip packages, Fracture (Process)
Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74264
https://doi.org/10.1115/IPACK2017-74264
View Paper titled, Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT
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Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating
Proceedings Papers

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48427
https://doi.org/10.1115/IPACK2015-48427
View Paper titled, Lid-Integral Cold Plate Topology Integration, Performance, and Reliability
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Topics: Reliability, Topology, Silicon, Packaging, Composite materials, Cooling, Finite element model, Fracture (Materials), Fracture (Process), Gaskets
Proceedings Papers

MEMS Die Warpage During Curing of Die Attach Material

Hohyung Lee, Ruiyang Liu, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48010
https://doi.org/10.1115/IPACK2015-48010
View Paper titled, MEMS Die Warpage During Curing of Die Attach Material
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Topics: Hardening (Curing), Microelectromechanical systems, Warping, Materials properties, Finite element analysis, Manufacturing, Shrinkage (Materials), Stress, Adhesives, Glass transition
Proceedings Papers

Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application

Hiroyuki Mori, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48741
https://doi.org/10.1115/IPACK2015-48741
View Paper titled, Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application
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Topics: Flip-chip packages, Thermal deformation, Warping, Finite element analysis, Manufacturing, Package on package, Shapes, Deformation, Finite element model, Flip-chip
Proceedings Papers

New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP

Yukio Nakamura, Kenichi Oohashi, Koji Morita, Shuji Nomoto, Takayuki Suzuki, Shin Takanezawa, Shinji Tsuchikawa, Masaaki Takekoshi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48836
https://doi.org/10.1115/IPACK2015-48836
View Paper titled, New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP
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Topics: Density, Diluents, Fillers (Materials), Package on package, Resins, Thermal expansion, Warping
Proceedings Papers

Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle

Toru Ikeda, Akiko Ozaki, Takuya Hatao, Noriyuki Miyazaki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48168
https://doi.org/10.1115/IPACK2015-48168
View Paper titled, Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle
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Topics: Cycles, Electronic packages, Warping, Heating, Package on package, Reliability, Resins, Elastic moduli, Hardening (Curing), Relaxation (Physics)
Proceedings Papers

Reliability Studies for Package-on-Package Components in Drop and Shock Environments

Pradeep Lall, Arjun Angral, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 591-602, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52231
https://doi.org/10.1115/IPACK2011-52231
View Paper titled, Reliability Studies for Package-on-Package Components in Drop and Shock Environments
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Topics: Package on package, Reliability, Shock (Mechanics), Architecture, Electronics, Failure, Engineering simulation, Simulation, Warping, Design
Proceedings Papers

A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin

Hiroyuki Sato, Qiang Yu, Ryusuke Sone
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 185-190, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52101
https://doi.org/10.1115/IPACK2011-52101
View Paper titled, A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin
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Topics: Hardening (Curing), Mechanical properties, Resins, Thermal deformation, Aluminum, Warping, Deformation, Elastic moduli, Reliability, Semiconductors (Materials)