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Proceedings Papers

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Junye Li, Zhao-zan Feng, Wei Li, Hua Zhu, Kuang Sheng
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A021, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8447
https://doi.org/10.1115/IPACK2018-8447
View Paper titled, Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Visualization, Nucleate boiling, Bubbles, Fluids, Flux (Metallurgy), Heat
Proceedings Papers

Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer

Kazuhisa Yuki, Katsuki Fukushima, Koichi Suzuki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48628
https://doi.org/10.1115/IPACK2015-48628
View Paper titled, Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer
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Topics: Boiling, Drops, Evaporation, Particulate matter, Nanoparticles, Adhesion, Temperature, Bubbles, Critical heat flux, Heat transfer
Proceedings Papers

Visualization of Confined Jet Impingement With Boiling Using Time-Resolved Stereo-PIV

Matthew J. Rau, Tianqi Guo, Pavlos P. Vlachos, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48184
https://doi.org/10.1115/IPACK2015-48184
View Paper titled, Visualization of Confined Jet Impingement With Boiling Using Time-Resolved Stereo-PIV
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Topics: Boiling, Visualization, Vapors, Flow (Dynamics), Heat, Particulate matter, Bubbles, Heat flux, Imaging, Outflow
Proceedings Papers

Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow

Todd A. Kingston, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48177
https://doi.org/10.1115/IPACK2015-48177
View Paper titled, Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow
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Topics: Bubbles, Microchannels, Slug flows, Vapors, Visualization, Flow (Dynamics), Heating, Junctions, Boiling, Borosilicate glasses
Proceedings Papers

Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels

Susan N. Ritchey, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73058
https://doi.org/10.1115/IPACK2013-73058
View Paper titled, Effects of Non-Uniform Heating on Two-Phase Flow Through Microchannels
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Topics: Heating, Microchannels, Two-phase flow, Heat sinks, Flow (Dynamics), Heat, Flux (Metallurgy), Heat flux, Boiling, Diluents
Proceedings Papers

Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration

Gi Hwan Kwon, Sung Jin Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73056
https://doi.org/10.1115/IPACK2013-73056
View Paper titled, Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration
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Topics: Flow (Dynamics), Heat pipes, Heat transfer, Fluids, Heat, Oscillations, Condensation, Evaporation, Glass, Visualization
Proceedings Papers

Measured-Temperature Interpolation and Visualization for Data Centers

Xuanhang (Simon) Zhang, Christopher M. Healey, Zachary R. Sheffer, James W. VanGilder
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73081
https://doi.org/10.1115/IPACK2013-73081
View Paper titled, Measured-Temperature Interpolation and Visualization for Data Centers
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Topics: Data centers, Interpolation, Temperature, Visualization, Cooling, Temperature sensors, Computation, Computational fluid dynamics, Fluid dynamics, Maintenance
Proceedings Papers

A Data-Centric Approach for Integrated Data Center Management

Christopher Hoover
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 565-576, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52159
https://doi.org/10.1115/IPACK2011-52159
View Paper titled, A Data-Centric Approach for Integrated Data Center Management
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Topics: Data centers, Bridges (Structures), Control systems, Modeling, Visualization
Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 443-451, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52047
https://doi.org/10.1115/IPACK2011-52047
View Paper titled, Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography
Proceedings Papers

Operational Benefits of Real-Time Monitoring and Visualization in Data Centers

Tahir Cader, Ratnesh Sharma, Cullen Bash, Les Fox, Vaibhav Bhatia, Mohandas Mekanapurath
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1033-1046, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89379
https://doi.org/10.1115/InterPACK2009-89379
View Paper titled, Operational Benefits of Real-Time Monitoring and Visualization in Data Centers
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Topics: Data centers, Visualization, Computers, Energy consumption, Environmental Protection Agency, Sensors, Air flow, Cloud computing, Computer software, Cooling systems
Proceedings Papers

Thermoelectric Cooling Analysis Using Modified Graphical Method

Huy N. Phan, Dereje Agonafer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 33-37, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89077
https://doi.org/10.1115/InterPACK2009-89077
View Paper titled, Thermoelectric Cooling Analysis Using Modified Graphical Method
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Topics: Thermoelectric cooling, Computation, Computational fluid dynamics, Cooling, Cooling systems, Currents, Design, Fluids, Temperature, Thermoelectric coolers
Proceedings Papers

Novel Fluorescent Visualization Method to Characterize Transport Properties in Micro/Nano Heat Pipe Wick Structures

Pramod Chamarthy, H. Peter J. de Bock, Boris Russ, Shakti Chauhan, Brian Rush, Stanton E. Weaver, Tao Deng, Kripa Varanasi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 419-425, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89173
https://doi.org/10.1115/InterPACK2009-89173
View Paper titled, Novel Fluorescent Visualization Method to Characterize Transport Properties in Micro/Nano Heat Pipe Wick Structures
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Topics: Heat pipes, Visualization, Permeability, Design, Computer cooling, Condensed matter, Condensers (steam plant), Flow (Dynamics), Gravity (Force), Physics
Proceedings Papers

Application of Excel to Thermal Analysis of Electronic Equipment: Program-Less Analysis and Visualization of Its Process by Using Spreadsheet of Excel

Toshio Tomimura, Yasushi Koito, Shuichi Torii, Masaru Ishizuka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 527-533, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89277
https://doi.org/10.1115/InterPACK2009-89277
View Paper titled, Application of Excel to Thermal Analysis of Electronic Equipment: Program-Less Analysis and Visualization of Its Process by Using Spreadsheet of Excel
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Topics: Electronic equipment, Thermal analysis, Visualization, Computer software, Finite difference methods, Numerical analysis, Printed circuit boards
Proceedings Papers

Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger

Milnes P. David, Julie Steinbrenner, Josef Miler, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 437-444, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89192
https://doi.org/10.1115/InterPACK2009-89192
View Paper titled, Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger
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Topics: Copper, Heat exchangers, Microchannels, Visualization, Flow (Dynamics), Membranes, Vapors, Pressure, Air flow, Cooling
Proceedings Papers

Integrated Design and Management of a Sustainable Data Center

Brian J. Watson, Amip J. Shah, Manish Marwah, Cullen E. Bash, Ratnesh K. Sharma, Christopher E. Hoover, Tom W. Christian, Chandrakant D. Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 635-644, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89032
https://doi.org/10.1115/InterPACK2009-89032
View Paper titled, Integrated Design and Management of a Sustainable Data Center
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Topics: Data centers, Design, Sustainability, Blocks (Building materials), Collaboration, Visualization
Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89155
https://doi.org/10.1115/InterPACK2009-89155
View Paper titled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography