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Proceedings Papers

Wetting Behavior of Droplet on Inclined Surface: From Inkjet Printing on Non-Paper Media

Riki Kawano, Kimiharu Yamazaki, Shinichi Kuramoto, Koichi Kato, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111666
https://doi.org/10.1115/IPACK2023-111666
View Paper titled, Wetting Behavior of Droplet on Inclined Surface: From Inkjet Printing on Non-Paper Media
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Topics: Drops, Printing, Viscosity, Wetting
Proceedings Papers

Evolution of Physical Properties of Liquid Film During Evaporation Process: Drying and Evaporation Process of Inkjet Liquid Film

Keisuke Kichise, Yoshihiro Harada, Shinichi Kuramoto, Masami Kadonaga, Kazuyoshi Fushinobu, Koichi Kato
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111660
https://doi.org/10.1115/IPACK2023-111660
View Paper titled, Evolution of Physical Properties of Liquid Film During Evaporation Process: Drying and Evaporation Process of Inkjet Liquid Film
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Topics: Drying, Dynamic light scattering, Evaporation, Liquid films, Viscosity, Inks, Lubrication theory, Drops, Heat, Mass transfer
Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97428
https://doi.org/10.1115/IPACK2022-97428
View Paper titled, Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
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Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles
Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8337
https://doi.org/10.1115/IPACK2018-8337
View Paper titled, On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Proceedings Papers

Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging

Hao Cheng, Zi Zhou Yang, Yang Peng, Yun Mou, Ming Xiang Chen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8226
https://doi.org/10.1115/IPACK2018-8226
View Paper titled, Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging
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Topics: Cements (Adhesives), Ceramics, Low temperature, Manufacturing, Packaging, Ultraviolet radiation, Shear strength, Hardening (Curing), Heat, Light-emitting diodes
Proceedings Papers

Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver

Ruth H. Reed, Justin Raade, Benjamin Elkin, Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48532
https://doi.org/10.1115/IPACK2015-48532
View Paper titled, Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver
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Topics: Flow (Dynamics), Glass, Heat, Heat transfer, High temperature, Modeling, Solar energy, Temperature, Viscosity, Fluids
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48522
https://doi.org/10.1115/IPACK2015-48522
View Paper titled, Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

The Detection of Minimum BLT Condition With Electrical Capacitance Measurement

Yasuhiro Saito, Satoru Suzuki, Takanori Komuro
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A074, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48303
https://doi.org/10.1115/IPACK2015-48303
View Paper titled, The Detection of Minimum BLT Condition With Electrical Capacitance Measurement
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Topics: Capacitance, Heat, Fillers (Materials), Heat sinks, Solids, Electrical measurement, Mass production, Pressure, Semiconductor devices, Silicones
Proceedings Papers

The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials

Kieran Hess, Amy S. Fleischer
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A062, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48082
https://doi.org/10.1115/IPACK2015-48082
View Paper titled, The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials
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Topics: Energy storage, Nanoparticles, Viscosity, Multi-walled carbon nanotubes, Fluids, Graphite, Temperature, Currents, Heat transfer, Nanofibers
Proceedings Papers

Thermal Transport Phenomenon in Circular Pipe Flow Using Different Nanofluids

Shuichi Torii
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73043
https://doi.org/10.1115/IPACK2013-73043
View Paper titled, Thermal Transport Phenomenon in Circular Pipe Flow Using Different Nanofluids
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Topics: Nanofluids, Pipe flow, Transport phenomena, Nanoparticles, Copper, Flow (Dynamics), Heat transfer, Particulate matter, Reynolds number, Thermal properties
Proceedings Papers

Laminar Convective Heat Transfer of Alumina-Polyalphaolefin Nanofluids Containing Spherical and Non-Spherical Nanoparticles

Leyuan Yu, Dong Liu, Frank Botz
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 343-355, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52256
https://doi.org/10.1115/IPACK2011-52256
View Paper titled, Laminar Convective Heat Transfer of Alumina-Polyalphaolefin Nanofluids Containing Spherical and Non-Spherical Nanoparticles
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Topics: Convection, Nanofluids, Nanoparticles, Fluids, Heat transfer, Particulate matter, Water, Friction, Laminar flow, Nanorods
Proceedings Papers

Squeeze Flow Models for Thermal Interface Materials Contained Between Parallel Plates and Plates With Posts

Simranjit Khalsa, Ganesh Subbarayan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 263-269, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52170
https://doi.org/10.1115/IPACK2011-52170
View Paper titled, Squeeze Flow Models for Thermal Interface Materials Contained Between Parallel Plates and Plates With Posts
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Topics: Flow (Dynamics), Plates (structures), Fluids, Particulate matter, Finite element analysis, Flat heat pipes, Pressure, Viscosity, Yield strength
Proceedings Papers

Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV

Jun Taniguchi, Shin-ichi Satake, Noriyuki Unno, Takahiro Kanai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 593-597, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89220
https://doi.org/10.1115/InterPACK2009-89220
View Paper titled, Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV
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Topics: Lithography, Ultraviolet radiation, Resins, Hardening (Curing), Errors, Fluids, Nanofabrication, Particulate matter, Resolution (Optics), Shrinkage (Materials)
Proceedings Papers

Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks

Waqar A. Khan, Michael M. Yovanovich
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 199-209, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33636
https://doi.org/10.1115/IPACK2007-33636
View Paper titled, Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks
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Topics: Fluid dynamics, Heat sinks, Heat transfer, Modeling, Momentum, Viscosity, Boundary-value problems, Flow (Dynamics), Fluids, Forced convection
Proceedings Papers

Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis

Takahiro Nagata, Takaya Kobayashi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1181-1186, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73162
https://doi.org/10.1115/IPACK2005-73162
View Paper titled, Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis
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Topics: Equilibrium (Physics), Finite element analysis, Solders, Stability, Drops, Surface tension, Constitutive equations, Deformation, Fluids, Creep
Proceedings Papers

Experimental Validation of Macro-Models for Simulating Capillary Driven Multiphase Flows Used for Micro-Chamber Filling

Debjyoti Banerjee
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2017-2021, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73412
https://doi.org/10.1115/IPACK2005-73412
View Paper titled, Experimental Validation of Macro-Models for Simulating Capillary Driven Multiphase Flows Used for Micro-Chamber Filling
Open the PDF for Experimental Validation of Macro-Models for Simulating Capillary Driven Multiphase Flows Used for Micro-Chamber Filling in another window
Topics: Algebra, Bubbles, Design, Differential equations, Flow (Dynamics), Fluids, Lumped parameter models, Multiphase flow, Simulation, Surface tension
Proceedings Papers

Boundary Effect on Temperature Gradients in Microchannels

Patrick S. Cabral, Tung T. Lam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 401-409, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35190
https://doi.org/10.1115/IPACK2003-35190
View Paper titled, Boundary Effect on Temperature Gradients in Microchannels
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Topics: Microchannels, Temperature gradient, Boundary-value problems, Heat, Computer cooling, Convection, Cooling, Drag (Fluid dynamics), Electronics, Flow (Dynamics)