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Proceedings Papers

On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)

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Sukrut Prashant Phansalkar, Bongtae Han, Ehsan Akbari, Paulius Vaitiekunas
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97719
https://doi.org/10.1115/IPACK2022-97719
View Paper titled, On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)
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Topics: Filled polymers, Viscoelasticity
Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

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Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97433
https://doi.org/10.1115/IPACK2022-97433
View Paper titled, Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
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Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation
Proceedings Papers

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

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Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis, Jaimal Williamson
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A023, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74075
https://doi.org/10.1115/IPACK2021-74075
View Paper titled, Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging
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Topics: Epoxy adhesives, Epoxy resins, High temperature, Molding, Viscoelasticity
Proceedings Papers

Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

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Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74061
https://doi.org/10.1115/IPACK2021-74061
View Paper titled, Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage
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Topics: High temperature, Relaxation (Physics), Reliability, Storage, Temperature, Viscoelasticity, Electronics, Glass transition, Materials properties, Mechanical properties
Proceedings Papers

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

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Pradeep Lall, Madhu Kasturi, Haotian Wu, Ed Davis, Jeff Suhling
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2675
https://doi.org/10.1115/IPACK2020-2675
View Paper titled, Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation
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Topics: Glass transition, High temperature, Mechanical properties, Optical microscopes, Oxidation, Viscoelasticity, Electronics, Operating temperature, Reliability, Storage
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

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Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6561
https://doi.org/10.1115/IPACK2019-6561
View Paper titled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
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Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

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Ruiyang Liu, HoHyung Lee, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48086
https://doi.org/10.1115/IPACK2015-48086
View Paper titled, Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage
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Topics: Adhesives, Shrinkage (Materials), Storage, Finite element analysis, Sensors, Viscoelasticity, Epoxy adhesives, Epoxy resins, MEMS packaging, Microelectromechanical systems
Proceedings Papers

Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation

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Tz-Cheng Chiu, Je-Li Kung, Yi-Shao Lai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 9-17, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89040
https://doi.org/10.1115/InterPACK2009-89040
View Paper titled, Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation
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Topics: Molding, Simulation, Viscoelasticity, Warping, Ball-Grid-Array packaging, Finite element analysis, Temperature, Constitutive equations, Cooling, Epoxy adhesives
Proceedings Papers

Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

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Yaoyu Pang, Jie-Hua Zhao, Darvin Edwards
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 379-384, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89169
https://doi.org/10.1115/InterPACK2009-89169
View Paper titled, Effect of Viscoelasticity on Thermalmechanical Stress in Polymers
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Topics: Polymers, Stress, Viscoelasticity, Polymer films, Temperature, Temperature profiles, Thermomechanics
Proceedings Papers

Characterization of Viscoelasticity of Molding Compounds in Time Domain

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Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 435-441, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89388
https://doi.org/10.1115/InterPACK2009-89388
View Paper titled, Characterization of Viscoelasticity of Molding Compounds in Time Domain
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Topics: Molding, Viscoelasticity, Relaxation (Physics), Polymers, Stress, Microelectronic packaging, Stress analysis (Engineering), Temperature
Proceedings Papers

Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

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Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 755-759, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89152
https://doi.org/10.1115/InterPACK2009-89152
View Paper titled, Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package
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Topics: Event history analysis, Flip-chip packages, Fatigue life, Finite element analysis, Viscoelasticity, Cooling, Solders, Warping
Proceedings Papers

Thermo-Viscoelastic Analysis for Warpage in CSP With Different Viscoelastic Properties for Several Layers

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Hideo Koguchi, Atsushi Ueno
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 13-19, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33591
https://doi.org/10.1115/IPACK2007-33591
View Paper titled, Thermo-Viscoelastic Analysis for Warpage in CSP With Different Viscoelastic Properties for Several Layers
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Topics: Viscoelasticity, Warping, Resins, Manufacturing, Packaging, Temperature, Theoretical analysis, Thermal expansion
Proceedings Papers

Characterization of Non-Conductive Adhesives

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Daniel Farley, Abhijit Dasgupta, J. F. J. M. Caers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73021
https://doi.org/10.1115/IPACK2005-73021
View Paper titled, Characterization of Non-Conductive Adhesives
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Topics: Adhesives, Manufacturing, Stress, Metals, Modeling, Contact resistance, Simulation, Temperature, Bonding, Compression
Proceedings Papers

Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis

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Takahiro Nagata, Takaya Kobayashi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1181-1186, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73162
https://doi.org/10.1115/IPACK2005-73162
View Paper titled, Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis
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Topics: Equilibrium (Physics), Finite element analysis, Solders, Stability, Drops, Surface tension, Constitutive equations, Deformation, Fluids, Creep
Proceedings Papers

A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP

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Hideo Koguchi, Mirai Ishida, Kazuto Nishida, Tomoaki Kuroishi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1405-1412, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73096
https://doi.org/10.1115/IPACK2005-73096
View Paper titled, A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP
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Topics: Deflection, Reliability, Stress, Viscoelasticity, Relaxation (Physics), Resins, Thermodynamic cycles, Adhesives, Thermal expansion, Thermal stresses
Proceedings Papers

Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages

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Arun Raman, Jun Tian, Alfred A. La Mar, Shalabh Tandon
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1881-1887, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73389
https://doi.org/10.1115/IPACK2005-73389
View Paper titled, Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages
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Topics: Lasers, Spallation (Nuclear physics), Adhesion, Adhesives, Ball-Grid-Array packaging, Copper, Dielectric materials, Epoxy adhesives, Epoxy resins, Flip-chip
Proceedings Papers

Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models

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Shankar Ganapathysubramanian, Sandeep Sane, Richard Raymond Dimagiba, Biju I. Chandran
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1523-1528, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73401
https://doi.org/10.1115/IPACK2005-73401
View Paper titled, Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models
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Topics: Approximation, Computer simulation, Elastic analysis, Electronic packaging, Flip-chip, Manufacturing, Modeling, Packaging, Polymers, Risk assessment