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Viscoelasticity
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Proceedings Papers
On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97719
Proceedings Papers
Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97433
Proceedings Papers
Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A023, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74075
Proceedings Papers
Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74061
Proceedings Papers
Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2675
Proceedings Papers
Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6561
Proceedings Papers
Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48086
Proceedings Papers
Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 9-17, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89040
Proceedings Papers
Effect of Viscoelasticity on Thermalmechanical Stress in Polymers
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 379-384, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89169
Proceedings Papers
Characterization of Viscoelasticity of Molding Compounds in Time Domain
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 435-441, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89388
Proceedings Papers
Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package
Available to PurchaseYoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 755-759, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89152
Proceedings Papers
Thermo-Viscoelastic Analysis for Warpage in CSP With Different Viscoelastic Properties for Several Layers
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 13-19, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33591
Proceedings Papers
Characterization of Non-Conductive Adhesives
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73021
Proceedings Papers
Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1181-1186, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73162
Proceedings Papers
A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1405-1412, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73096
Proceedings Papers
Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1881-1887, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73389
Proceedings Papers
Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1523-1528, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73401