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Proceedings Papers

Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

Devdatta Kulkarni, John Gulick, Jeff King, Brian Jarrett, Paul George, Yoav Feldman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141367
https://doi.org/10.1115/IPACK2024-141367
View Paper titled, Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
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Topics: Cooling, Heat flux, Heat, Data centers, Design, Flux (Metallurgy), Climate change, Construction, Design methodology, Energy consumption
Proceedings Papers

Investigation of Server Level Direct-To-Chip Two Phase Cooling Solution for High Power GPUs

Akshith Narayanan, Qingyang Wang, Serdar Ozguc, Richard W. Bonner, III
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141261
https://doi.org/10.1115/IPACK2024-141261
View Paper titled, Investigation of Server Level Direct-To-Chip Two Phase Cooling Solution for High Power GPUs
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Topics: Cooling, Graphics processing units, Vehicles
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
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Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

At Scale Development of Thermal Test Vehicles for Data Center Liquid Cooling Developments

Ali Heydari, Harold Miyamura, Uschas Chowdhury, Yaman Mohammad Ali Manaserh, Mohammad Tradat, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Dwayne Kalma, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111307
https://doi.org/10.1115/IPACK2023-111307
View Paper titled, At Scale Development of Thermal Test Vehicles for Data Center Liquid Cooling Developments
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Topics: Cooling, Data centers, Vehicles
Proceedings Papers

Variable Area Jet Impingement for High Voltage Power Electronics

Reece Whitt, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
https://doi.org/10.1115/IPACK2023-111996
View Paper titled, Variable Area Jet Impingement for High Voltage Power Electronics
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Topics: Electronics, Nozzles, Convection, Coolants, Cooling, Flow (Dynamics), Impingement cooling, Reliability, Temperature, Transients (Dynamics)
Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111564
https://doi.org/10.1115/IPACK2023-111564
View Paper titled, L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
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Topics: Air conditioning, Cooling, Coolants, Heat, HVAC equipment, Artificial intelligence, Cooling loads, Data centers, Density, Fans
Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
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Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74016
https://doi.org/10.1115/IPACK2021-74016
View Paper titled, Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies
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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)
Proceedings Papers

Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

Nikhil R. Lakhkar
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68870
https://doi.org/10.1115/IPACK2021-68870
View Paper titled, Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications
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Topics: Cooling, Design, Electric vehicles, Hybrid electric vehicles, Vehicles, Compressors, Batteries, Electrification, HVAC equipment, Internal combustion engines
Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2648
https://doi.org/10.1115/IPACK2020-2648
View Paper titled, Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies
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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics
Proceedings Papers

Real Time Prediction of Li-Ion Battery Pack Temperatures in EV Vehicles

Azita Soleymani, William Maltz
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2609
https://doi.org/10.1115/IPACK2020-2609
View Paper titled, Real Time Prediction of Li-Ion Battery Pack Temperatures in EV Vehicles
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Topics: Lithium-ion batteries, Temperature, Vehicles
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6434
https://doi.org/10.1115/IPACK2019-6434
View Paper titled, Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger
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Topics: Cooling, Design, Electric vehicles, Vehicles, Circuits, Density, Dynamics (Mechanics), Energy dissipation, Engineering prototypes, Engineering simulation
Proceedings Papers

Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)

Madi Zholbaryssov, Azeem Sarwar
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6423
https://doi.org/10.1115/IPACK2019-6423
View Paper titled, Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)
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Topics: Motors, Permanent magnets, Stators, Electric propulsion, Emissions, Maintenance, Winding (process), Damage, Flaw detection, Mechanical admittance
Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6429
https://doi.org/10.1115/IPACK2019-6429
View Paper titled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles
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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles
Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8383
https://doi.org/10.1115/IPACK2018-8383
View Paper titled, Orientation Effects in Two-Phase Microgap Flow
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Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration
Proceedings Papers

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Boon Ang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8300
https://doi.org/10.1115/IPACK2018-8300
View Paper titled, Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications
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Topics: Internet of things, Stress, Vehicles, Circuits, Computer software, Cooling, Cycles, Energy dissipation, Flip-chip packages, Modeling