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Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2591
https://doi.org/10.1115/IPACK2020-2591
View Paper titled, Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
Open the PDF for Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers in another window
Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration
Proceedings Papers

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A028, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74224
https://doi.org/10.1115/IPACK2017-74224
View Paper titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
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Topics: Heat conduction, Heat transfer, Integrated circuits, Interpolation, Temperature sensors, Temperature, Optimization, Sensors, Finite element analysis, Genetic algorithms
Proceedings Papers

Experimental and Computational Characterization of a Heat Sink Tester

Aalok Trivedi, Nikhil Lakhkar, Madhusudhan Iyengar, Michael Ellsworth, Jr., Roger Schmidt, Dereje Agonafer
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 643-652, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33975
https://doi.org/10.1115/IPACK2007-33975
View Paper titled, Experimental and Computational Characterization of a Heat Sink Tester
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Topics: Heat sinks, Uncertainty analysis
Proceedings Papers

Thermomechanics of High-Pressure MEMS Sensors

Ryszard J. Pryputniewicz
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 971-977, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33501
https://doi.org/10.1115/IPACK2007-33501
View Paper titled, Thermomechanics of High-Pressure MEMS Sensors
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Topics: Deformation, Design, Diaphragms (Mechanical devices), Diaphragms (Structural), High pressure (Physics), Microelectromechanical systems, Pressure, Sensors, Thermomechanics, Uncertainty analysis