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Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples

Takashi Fukue, Koichi Hirasawa
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69101
https://doi.org/10.1115/IPACK2021-69101
View Paper titled, Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples
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Topics: Measurement uncertainty, Temperature, Thermocouples, Temperature measurement, Electrical components, Evaluation methods, Heat, Heat transfer, Uncertainty
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74149
https://doi.org/10.1115/IPACK2017-74149
View Paper titled, Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment

Yichao Yang, Jiayue Shen, Zhili Hao
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48134
https://doi.org/10.1115/IPACK2015-48134
View Paper titled, A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment
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Topics: Biological tissues, Microfluidics, Tactile sensors, Sensors, Deflection, Transducers, Elasticity, Electrolytes, Phantoms, Power presses
Proceedings Papers

Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance

Thomas L. Bougher, John H. Taphouse, Baratunde A. Cola
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48587
https://doi.org/10.1115/IPACK2015-48587
View Paper titled, Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance
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Topics: Carbon nanotubes, Thermoreflectance, Contact resistance, Heat transfer, Heating, Mechanical properties, Metrology, Probes, Thermal conductivity, Uncertainty
Proceedings Papers

Multiphysics Simulation of RF-MEMS With Quantified Uncertainties

Lin Sun, Hojin Kim, Alejandro Strachan, Sanjay R. Mathur, Jayathi Y. Murthy
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73175
https://doi.org/10.1115/IPACK2013-73175
View Paper titled, Multiphysics Simulation of RF-MEMS With Quantified Uncertainties
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Topics: Microelectromechanical systems, Simulation, Uncertainty, Deformation, Chaos, Complex systems, Damping, Displacement, Electrostatics, Fluids
Proceedings Papers

Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Niru Kumari, Cullen E. Bash, Scot Heath, Brandon Rubenstein
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 553-563, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52141
https://doi.org/10.1115/IPACK2011-52141
View Paper titled, Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency
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Topics: Data centers, Energy efficiency, Uncertainty, Stress, Temperature, Design, Experimental analysis, Flow (Dynamics), Air flow, Compressors
Proceedings Papers

Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages

Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 425-428, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52270
https://doi.org/10.1115/IPACK2011-52270
View Paper titled, Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages
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Topics: Electromagnetic scattering, Focused ion beams, Fracture toughness, Microscale devices, Resolution (Optics), Uncertainty, Vapors
Proceedings Papers

Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon

Richard C. Jaeger, Jeffrey C. Suhling, Safina Hussain, Jordan C. Roberts, Mohammad A. Motalab, Chun-Hyung Cho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 15-25, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89245
https://doi.org/10.1115/InterPACK2009-89245
View Paper titled, Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon
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Topics: Errors, Flip-chip packages, Sensors, Silicon, Stress, Temperature, Integrated circuits, Electronic packages, Finite element model, Flip-chip
Proceedings Papers

Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors

Benjamin Lemke, Rajashree Baskaran, Oliver Paul
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 463-469, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89171
https://doi.org/10.1115/InterPACK2009-89171
View Paper titled, Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors
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Topics: Complementary metal oxide semiconductors, Sensors, Stress, Temperature, Uncertainty, Currents, Sensitivity analysis
Proceedings Papers

Temperature Dependent Phonon Lifetimes and Decay Pathways in Hexagonal Gallium Nitride

Thomas Beechem, Samuel Graham
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 171-177, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33305
https://doi.org/10.1115/IPACK2007-33305
View Paper titled, Temperature Dependent Phonon Lifetimes and Decay Pathways in Hexagonal Gallium Nitride
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Topics: Gallium nitride, Phonons, Temperature, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Uncertainty
Proceedings Papers

A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination

Guojun Hu, Andrew A. O. Tay
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1207-1213, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73238
https://doi.org/10.1115/IPACK2005-73238
View Paper titled, A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination
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Topics: Delamination, Displacement, Fracture (Materials), Reflow soldering, Vapor pressure, Density, Diffusion (Physics), Lead-free solders, Solders, Stress
Proceedings Papers

Characterization of Time and Temperature Dependent Mechanical Behavior of Underfill Materials in Electronic Packaging Application

Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 473-483, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35232
https://doi.org/10.1115/IPACK2003-35232
View Paper titled, Characterization of Time and Temperature Dependent Mechanical Behavior of Underfill Materials in Electronic Packaging Application
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Topics: Creep, Electronic packaging, Mechanical behavior, Temperature, Testing, Thermomechanics, Adhesion, Solder masks, Deformation, Stress