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Proceedings Papers

Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging

Azadeh Moini, Amin Nikoozadeh, Jung Woo Choe, Butrus T. Khuri-Yakub, Chienliu Chang, Doug Stephens, L. Scott Smith, David Sahn
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48611
https://doi.org/10.1115/IPACK2015-48611
View Paper titled, Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging
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Topics: Catheters, Endoscopic devices, Imaging, Manufacturing, Packaging, Ultrasound, Biomedical imaging, Ultrasonic transducers, Bonding, Design
Proceedings Papers

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52294
https://doi.org/10.1115/IPACK2011-52294
View Paper titled, Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique
Open the PDF for Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique in another window
Topics: Ball-Grid-Array packages, Lasers, Lead-free solders, Ultrasound, Wetting, Solders, Inspection, Transients (Dynamics), Ball-Grid-Array packaging, Displacement
Proceedings Papers

Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses

Jin Yang, I. Charles Ume
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 365-374, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33542
https://doi.org/10.1115/IPACK2007-33542
View Paper titled, Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses
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Topics: Flip-chip, Flip-chip devices, Inspection, Modal analysis, Solders, Computer simulation, Dynamic response, Electronics, Experimental methods, Interferometry
Proceedings Papers

A High-Resolution Dry-Contact Acoustic Imaging of the Solder Joints for Ball Grid Array Assembly

Hironori Tohmyoh, Masumi Saka
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 817-822, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35228
https://doi.org/10.1115/IPACK2003-35228
View Paper titled, A High-Resolution Dry-Contact Acoustic Imaging of the Solder Joints for Ball Grid Array Assembly
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Topics: Acoustics, Ball-Grid-Array packaging, Imaging, Manufacturing, Resolution (Optics), Solder joints, Microscopy, Ultrasound, Semiconductor wafers, Signals